Seonju Oh

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Cheonan-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Substrate treating apparatus and substrate treating method
- Patent number 9,881,827
- Issue date Jan 30, 2018
- Samsung Electronics Co., Ltd.
- Geunwoo Kim
- G02 - OPTICS
Information Patent Grant
Wafer dividing apparatus and methods
- Patent number 8,506,832
- Issue date Aug 13, 2013
- Samsung Electronics Co., Ltd.
- Hotae Jin
- B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE TREATING APPARATUS AND SUBSTRATE TREATING METHOD
- Publication number 20150340263
- Publication date Nov 26, 2015
- GEUNWOO KIM
- B32 - LAYERED PRODUCTS
Information Patent Application
Wafer dividing apparatus and methods
- Publication number 20110053376
- Publication date Mar 3, 2011
- Samsung Electronics Co., Ltd.
- Hotae Jin
- B28 - WORKING CEMENT, CLAY, OR STONE