Seppo J. Lehtonen

Person

  • Columbia, MD, US

Patents Grantslast 30 patents

  • Information Patent Grant

    Chip packaged battery

    • Patent number 12,156,338
    • Issue date Nov 26, 2024
    • The Johns Hopkins University
    • Konstantinos Gerasopoulos
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Multispectral imager

    • Patent number 11,067,449
    • Issue date Jul 20, 2021
    • The Johns Hopkins University
    • Jorge I. Nunez Sanchez
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Ka band multi-chip modulator

    • Patent number 9,844,169
    • Issue date Dec 12, 2017
    • The Johns Hopkins University
    • Daniel E. Matlin
    • H03 - BASIC ELECTRONIC CIRCUITRY
  • Information Patent Grant

    Semiconductor die adapter and method of using

    • Patent number 6,881,593
    • Issue date Apr 19, 2005
    • The Johns Hopkins University
    • Binh Q. Le
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Method for electroless gold plating of conductive traces on printed...

    • Patent number 6,733,823
    • Issue date May 11, 2004
    • The Johns Hopkins University
    • David M. Lee
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents