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Serafin Padilla Pedron Jr.
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Manteca, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor packages and methods for forming semiconductor package
Patent number
9,613,877
Issue date
Apr 4, 2017
UTAC HEADQUARTERS PTE. LTD.
Nathapong Suthiwongsunthorn
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadless integrated circuit package having standoff contacts and di...
Patent number
9,305,889
Issue date
Apr 5, 2016
UTAC Hong Kong Limited
Kirk Powell
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermal leadless array package with die attach pad locking feature
Patent number
9,196,504
Issue date
Nov 24, 2015
UTAC DONGGUAN LTD.
Albert Loh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadless array plastic package with various IC packaging configurat...
Patent number
8,828,801
Issue date
Sep 9, 2014
UTAC Hong Kong Limited
John McMillan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadless integrated circuit package having standoff contacts and di...
Patent number
8,736,037
Issue date
May 27, 2014
UTAC Hong Kong Limited
Kirk Powell
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Leadless array plastic package with various IC packaging configurat...
Patent number
8,486,762
Issue date
Jul 16, 2013
UTAC Hong Kong Limited
John McMillan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thin array plastic package without die attach pad and process for f...
Patent number
7,358,119
Issue date
Apr 15, 2008
ASAT Ltd.
Neil McLellan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package and method of manufacturing the integrat...
Patent number
6,940,154
Issue date
Sep 6, 2005
ASAT Limited
Serafin Pedron
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked semiconductor package and method of manufacturing the same
Patent number
6,818,980
Issue date
Nov 16, 2004
ASAT Ltd.
Serafin P. Pedron
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Exposed heat spreader with seal ring
Patent number
6,188,130
Issue date
Feb 13, 2001
Advanced Technology Interconnect Incorporated
German Ramirez
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having a ground or power ring and a metal sub...
Patent number
5,877,551
Issue date
Mar 2, 1999
Olin Corporation
Salvador A. Tostado
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING SEMICONDUCTOR PACKAGE
Publication number
20150102478
Publication date
Apr 16, 2015
United Test & Assembly Center Ltd.
Nathapong SUTHIWONGSUNTHORN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEADLESS INTEGRATED CIRCUIT PACKAGE HAVING STANDOFF CONTACTS AND DI...
Publication number
20140367865
Publication date
Dec 18, 2014
UTAC Hong Kong Limited
Kirk POWELL
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMAL LEADLESS ARRAY PACKAGE WITH DIE ATTACH PAD LOCKING FEATURE
Publication number
20140008777
Publication date
Jan 9, 2014
UTAC DONGGUAN LTD
Albert LOH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LEADLESS ARRAY PLASTIC PACKAGE WITH VARIOUS IC PACKAGING CONFIGURAT...
Publication number
20130273692
Publication date
Oct 17, 2013
John MCMILLAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Thin array plastic package without die attach pad and process for f...
Publication number
20060154403
Publication date
Jul 13, 2006
Neil McLellan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated circuit package and method of manufacturing the integrat...
Publication number
20030234454
Publication date
Dec 25, 2003
Serafin Pedron
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of manufacturing an encapsulated integrated circuit package
Publication number
20030143776
Publication date
Jul 31, 2003
Serafin Pedron
H01 - BASIC ELECTRIC ELEMENTS