Sergei Voronov

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Laser die backside film removal for integrated circuit (IC) packaging
- Patent number 9,859,248
- Issue date Jan 2, 2018
- Intel Corporation
- Danish Faruqui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die or substrate marking using a laser
- Patent number 9,472,505
- Issue date Oct 18, 2016
- Intel Corporation
- Frank Evans
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate markings
- Patent number 9,430,685
- Issue date Aug 30, 2016
- Intel Corporation
- Sergei Voronov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser die backside film removal for integrated circuit (IC) packaging
- Patent number 9,412,702
- Issue date Aug 9, 2016
- Intel Corporation
- Danish Faruqui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Work piece with concealed surface defects
- Patent number 8,525,136
- Issue date Sep 3, 2013
- Intel Corporation
- Sergei Voronov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser-assisted chemical singulation of a wafer
- Patent number 8,426,250
- Issue date Apr 23, 2013
- Intel Corporation
- George Vakanas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating an identification mark utilizing a liquid fil...
- Patent number 8,173,552
- Issue date May 8, 2012
- Intel Corporation
- George P. Vakanas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit package having security feature and method of ma...
- Patent number 8,076,776
- Issue date Dec 13, 2011
- Intel Corporation
- Dhruv P. Bhate
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for concealing surface defects
- Patent number 7,985,957
- Issue date Jul 26, 2011
- Intel Corporation
- Sergei Voronov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser assisted chemical vapor deposition for backside die marking a...
- Patent number 7,807,573
- Issue date Oct 5, 2010
- Intel Corporation
- Eric Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Dual pulsed beam laser micromachining method
- Patent number 7,611,966
- Issue date Nov 3, 2009
- Intel Corporation
- Eric J. Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser micromachining method
- Patent number 7,303,977
- Issue date Dec 4, 2007
- Intel Corporation
- Sergei L. Voronov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser micromachining method
- Patent number 7,169,687
- Issue date Jan 30, 2007
- Intel Corporation
- Eric J. Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LASER DIE BACKSIDE FILM REMOVAL FOR INTEGRATED CIRCUIT (IC) PACKAGING
- Publication number 20160307869
- Publication date Oct 20, 2016
- Intel Corporation
- Danish Faruqui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE OR SUBSTRATE MARKING USING A LASER
- Publication number 20150171017
- Publication date Jun 18, 2015
- Frank Evans
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER DIE BACKSIDE FILM REMOVAL FOR INTEGRATED CIRCUIT (IC) PACKAGING
- Publication number 20140264951
- Publication date Sep 18, 2014
- Danish Faruqui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS TO IMPROVE LASER MARK CONTRAST ON DIE BACKSIDE FILM IN EMBE...
- Publication number 20140175657
- Publication date Jun 26, 2014
- Mihir A. Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE MARKINGS
- Publication number 20140076976
- Publication date Mar 20, 2014
- Sergei Voronov
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
WORK PIECE WITH CONCEALED SURFACE DEFECTS
- Publication number 20110195226
- Publication date Aug 11, 2011
- Sergei Voronov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Liquid film assisted laser die marking and structures formed thereby
- Publication number 20110031590
- Publication date Feb 10, 2011
- George P. Vakanas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated circuit package having security feature and method of ma...
- Publication number 20100314750
- Publication date Dec 16, 2010
- Dhruv P. Bhate
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods for concealing surface defects
- Publication number 20100155625
- Publication date Jun 24, 2010
- Sergei Voronov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER SINGULATION IN HIGH VOLUME MANUFACTURING
- Publication number 20100129984
- Publication date May 27, 2010
- George Vakanas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser-assisted chemical singulation of a wafer
- Publication number 20100099238
- Publication date Apr 22, 2010
- George Vakanas
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser assisted chemical vapor deposition for backside die marking a...
- Publication number 20100065971
- Publication date Mar 18, 2010
- Eric Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Dicing and drilling of wafers
- Publication number 20080242054
- Publication date Oct 2, 2008
- Andy Antonelli
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE MARKINGS
- Publication number 20080156780
- Publication date Jul 3, 2008
- Sergei Voronov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Dual pulsed beam laser micromachining method
- Publication number 20060249816
- Publication date Nov 9, 2006
- Intel Corporation
- Eric J. Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser micromachining method
- Publication number 20060099810
- Publication date May 11, 2006
- Intel Corporation
- Sergei L. Voronov
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser micromachining method
- Publication number 20060091125
- Publication date May 4, 2006
- Intel Corporation
- Eric J. Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser ablation method
- Publication number 20060088984
- Publication date Apr 27, 2006
- Intel Corporation
- Eric J. Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Sergei Voronov

Person

Patents Grantslast 30 patents

Laser die backside film removal for integrated circuit (IC) packaging

Die or substrate marking using a laser

Substrate markings

Laser die backside film removal for integrated circuit (IC) packaging

Work piece with concealed surface defects

Laser-assisted chemical singulation of a wafer

Method of fabricating an identification mark utilizing a liquid fil...

Integrated circuit package having security feature and method of ma...

Methods for concealing surface defects

Laser assisted chemical vapor deposition for backside die marking a...

Dual pulsed beam laser micromachining method

Laser micromachining method

Laser micromachining method

Patents Applicationslast 30 patents

LASER DIE BACKSIDE FILM REMOVAL FOR INTEGRATED CIRCUIT (IC) PACKAGING

DIE OR SUBSTRATE MARKING USING A LASER

LASER DIE BACKSIDE FILM REMOVAL FOR INTEGRATED CIRCUIT (IC) PACKAGING

METHODS TO IMPROVE LASER MARK CONTRAST ON DIE BACKSIDE FILM IN EMBE...

SUBSTRATE MARKINGS

WORK PIECE WITH CONCEALED SURFACE DEFECTS

Liquid film assisted laser die marking and structures formed thereby

Integrated circuit package having security feature and method of ma...

Methods for concealing surface defects

WAFER SINGULATION IN HIGH VOLUME MANUFACTURING

Laser-assisted chemical singulation of a wafer

Laser assisted chemical vapor deposition for backside die marking a...

Dicing and drilling of wafers

SUBSTRATE MARKINGS

Dual pulsed beam laser micromachining method

Laser micromachining method

Laser micromachining method

Laser ablation method