Sergey Yuferev

Person

Villach, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with non-uniformly distributed vias
- Patent number 12,159,829
- Issue date Dec 3, 2024
- Infineon Technologies Austria AG
- Sergey Yuferev
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacked transistor chip package with source coupling
- Patent number 12,094,807
- Issue date Sep 17, 2024
- Infineon Technologies AG
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module having a multi-branch switch node connector
- Patent number 12,009,290
- Issue date Jun 11, 2024
- Infineon Technologies Austria AG
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, semiconductor module and methods for manufac...
- Patent number 11,978,692
- Issue date May 7, 2024
- Infineon Technologies Austria AG
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,973,071
- Issue date Apr 30, 2024
- Infineon Technologies Austria AG
- Gerhard Noebauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuitry and method of forming a circuitry
- Patent number 11,935,874
- Issue date Mar 19, 2024
- Infineon Technologies AG
- Robert Fehler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module
- Patent number 11,664,304
- Issue date May 30, 2023
- Infineon Technologies Austria AG
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing a semiconductor p...
- Patent number 11,444,017
- Issue date Sep 13, 2022
- Infineon Technologies Austria AG
- Sergey Yuferev
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package and method of manufacturing a semiconductor p...
- Patent number 11,348,861
- Issue date May 31, 2022
- Infineon Technologies Austria AG
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing a semiconductor p...
- Patent number 10,811,342
- Issue date Oct 20, 2020
- Infineon Technologies Austria AG
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR PACKAGE
- Publication number 20250087581
- Publication date Mar 13, 2025
- Infineon Technologies Austria AG
- Sergey Yuferev
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DIE WITH A VERTICAL DEVICE
- Publication number 20240313105
- Publication date Sep 19, 2024
- Infineon Technologies Austria AG
- Gerhard Thomas Nöbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Manufacturing a Semiconductor Package and a Semiconduct...
- Publication number 20240258213
- Publication date Aug 1, 2024
- Infineon Technologies Austria AG
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING A SEMICONDUCTOR PA...
- Publication number 20240030111
- Publication date Jan 25, 2024
- Infineon Technologies Austria AG
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230420393
- Publication date Dec 28, 2023
- Infineon Technologies Austria AG
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE HAVING A MULTI-BRANCH SWITCH NODE CONNECTOR
- Publication number 20230253304
- Publication date Aug 10, 2023
- Infineon Technologies Austria AG
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH NON-UNIFORMLY DISTRIBUTED VIAS
- Publication number 20220367350
- Publication date Nov 17, 2022
- Sergey Yuferev
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STACKED TRANSISTOR CHIP PACKAGE WITH SOURCE COUPLING
- Publication number 20220122906
- Publication date Apr 21, 2022
- INFINEON TECHNOLOGIES AG
- Sergey YUFEREV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20220108945
- Publication date Apr 7, 2022
- Infineon Technologies Austria AG
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package, Semiconductor Module and Methods for Manufac...
- Publication number 20220084915
- Publication date Mar 17, 2022
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuitry and Method of Forming a Circuitry
- Publication number 20220028840
- Publication date Jan 27, 2022
- Robert Fehler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20210351168
- Publication date Nov 11, 2021
- Gerhard Noebauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Manufacturing a Semiconductor P...
- Publication number 20210005536
- Publication date Jan 7, 2021
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Manufacturing a Semiconductor P...
- Publication number 20200075484
- Publication date Mar 5, 2020
- Sergey Yuferev
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Package and Method of Manufacturing a Semiconductor P...
- Publication number 20190267309
- Publication date Aug 29, 2019
- Sergey Yuferev
- H01 - BASIC ELECTRIC ELEMENTS

Sergey Yuferev

Person

Patents Grantslast 30 patents

Semiconductor package with non-uniformly distributed vias

Stacked transistor chip package with source coupling

Semiconductor module having a multi-branch switch node connector

Semiconductor package, semiconductor module and methods for manufac...

Semiconductor module

Circuitry and method of forming a circuitry

Semiconductor module

Semiconductor package and method of manufacturing a semiconductor p...

Semiconductor package and method of manufacturing a semiconductor p...

Semiconductor package and method of manufacturing a semiconductor p...

Patents Applicationslast 30 patents

METHOD FOR FABRICATING A SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DIE WITH A VERTICAL DEVICE

Methods for Manufacturing a Semiconductor Package and a Semiconduct...

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING A SEMICONDUCTOR PA...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR MODULE HAVING A MULTI-BRANCH SWITCH NODE CONNECTOR

SEMICONDUCTOR PACKAGE WITH NON-UNIFORMLY DISTRIBUTED VIAS

STACKED TRANSISTOR CHIP PACKAGE WITH SOURCE COUPLING

SEMICONDUCTOR MODULE

Semiconductor Package, Semiconductor Module and Methods for Manufac...

Circuitry and Method of Forming a Circuitry

SEMICONDUCTOR MODULE

Semiconductor Package and Method of Manufacturing a Semiconductor P...

Semiconductor Package and Method of Manufacturing a Semiconductor P...

Semiconductor Package and Method of Manufacturing a Semiconductor P...