Sergio A. Chan Arguedas

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Additively manufactured structures for heat dissipation from integr...
- Patent number 12,080,620
- Issue date Sep 3, 2024
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages with thermal interface materials with d...
- Patent number 12,062,592
- Issue date Aug 13, 2024
- Intel Corporation
- Sergio Antonio Chan Arguedas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protruding SN substrate features for epoxy flow control
- Patent number 12,009,271
- Issue date Jun 11, 2024
- Intel Corporation
- Edvin Cetegen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package lids with polymer features
- Patent number 11,935,799
- Issue date Mar 19, 2024
- Intel Corporation
- Elah Bozorg-Grayeli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vented lids for integrated circuit packages
- Patent number 11,894,282
- Issue date Feb 6, 2024
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
First-level integration of second-level thermal interface material...
- Patent number 11,881,438
- Issue date Jan 23, 2024
- Intel Corporation
- Elah Bozorg-Grayeli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Full package vapor chamber with IHS
- Patent number 11,832,419
- Issue date Nov 28, 2023
- Intel Corporation
- Nicholas Neal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lids for integrated circuit packages with solder thermal interface...
- Patent number 11,817,369
- Issue date Nov 14, 2023
- Intel Corporation
- Bamidele Daniel Falola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated heat spreader (IHS) with heating element
- Patent number 11,798,861
- Issue date Oct 24, 2023
- Intel Corporation
- Peng Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies including a thermal interface material
- Patent number 11,791,237
- Issue date Oct 17, 2023
- Intel Corporation
- Peng Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Corner guard for improved electroplated first level interconnect bu...
- Patent number 11,776,864
- Issue date Oct 3, 2023
- Intel Corporation
- Jacob Vehonsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with a highly conductive layer deposited on die using throu...
- Patent number 11,776,869
- Issue date Oct 3, 2023
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package with solder array thermal interface materia...
- Patent number 11,735,552
- Issue date Aug 22, 2023
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages with asymmetric adhesion material regions
- Patent number 11,682,605
- Issue date Jun 20, 2023
- Intel Corporation
- Karthik Visvanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with a highly conductive layer deposited on die using throu...
- Patent number 11,328,978
- Issue date May 10, 2022
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate integrated posts and heat spreader customization for enha...
- Patent number 11,328,979
- Issue date May 10, 2022
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
5G mmWave cooling through PCB
- Patent number 11,112,841
- Issue date Sep 7, 2021
- Intel Corporation
- Divya Mani
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multi-chip package with partial integrated heat spreader
- Patent number 11,004,768
- Issue date May 11, 2021
- Intel Corporation
- Muhammad S. Islam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package with recessed substrate for underfill con...
- Patent number 10,672,625
- Issue date Jun 2, 2020
- Intel Corporation
- Sergio A. Chan Arguedas
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROL
- Publication number 20240258183
- Publication date Aug 1, 2024
- Intel Corporation
- Edvin CETEGEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBST...
- Publication number 20240222288
- Publication date Jul 4, 2024
- Intel Corporation
- David Shia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE COMPOSITION THERMAL INTERFACE MATERIALS FOR MULTI-DIE PACK...
- Publication number 20240006378
- Publication date Jan 4, 2024
- Intel Corporation
- Sergio Antonio Chan Arguedas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERED METALLIC RESERVOIRS FOR ENHANCED TRANSIENT AND STEADY-STAT...
- Publication number 20230343723
- Publication date Oct 26, 2023
- Intel Corporation
- Nicholas NEAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIA...
- Publication number 20230343738
- Publication date Oct 26, 2023
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
5G mmWAVE COOLING THROUGH PCB
- Publication number 20220256715
- Publication date Aug 11, 2022
- Intel Corporation
- Divya MANI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PACKAGE WITH A HIGHLY CONDUCTIVE LAYER DEPOSITED ON DIE USING THROU...
- Publication number 20220238411
- Publication date Jul 28, 2022
- Intel Corporation
- Feras EID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMMERSION COOLING FOR INTEGRATED CIRCUIT DEVICES
- Publication number 20220201889
- Publication date Jun 23, 2022
- Intel Corporation
- Raanan Sover
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADDITIVELY MANUFACTURED STRUCTURES FOR HEAT DISSIPATION FROM INTEGR...
- Publication number 20210407884
- Publication date Dec 30, 2021
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT HEAT SPREADER INCLUDING SEALANT INTERFACE MATERIAL
- Publication number 20210398871
- Publication date Dec 23, 2021
- Intel Corporation
- Feras Eid
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIRST-LEVEL INTEGRATION OF SECOND-LEVEL THERMAL INTERFACE MATERIAL...
- Publication number 20210225729
- Publication date Jul 22, 2021
- Intel Corporation
- Elah Bozorg-Grayeli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FULL PACKAGE VAPOR CHAMBER WITH IHS
- Publication number 20210195798
- Publication date Jun 24, 2021
- Intel Corporation
- Nicholas NEAL
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE WITH ATTACHMENT AND/OR STOP STRUCTURES
- Publication number 20210066162
- Publication date Mar 4, 2021
- Intel Corporation
- Sergio A. CHAN ARGUEDAS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERED METALLIC RESERVOIRS FOR ENHANCED TRANSIENT AND STEADY-STAT...
- Publication number 20210035921
- Publication date Feb 4, 2021
- Intel Corporation
- Nicholas NEAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP PACKAGE WITH PARTIAL INTEGRATED HEAT SPREADER
- Publication number 20210035886
- Publication date Feb 4, 2021
- Intel Corporation
- Muhammad S. Islam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VARIABLE-THICKNESS INTEGRATED HEAT SPREADER (IHS)
- Publication number 20210028084
- Publication date Jan 28, 2021
- Intel Corporation
- Sergio Antonio Chan Arguedas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROL
- Publication number 20210020531
- Publication date Jan 21, 2021
- Intel Corporation
- Edvin CETEGEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORNER GUARD FOR IMPROVED ELECTROPLATED FIRST LEVEL INTERCONNECT BU...
- Publication number 20210020532
- Publication date Jan 21, 2021
- Intel Corporation
- Jacob VEHONSKY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED HEAT SPREADER (IHS) WITH SOLDER THERMAL INTERFACE MATERI...
- Publication number 20210020537
- Publication date Jan 21, 2021
- Intel Corporation
- Sergio Antonio Chan Arguedas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED HEAT SPREADER (IHS) WITH HEATING ELEMENT
- Publication number 20210013117
- Publication date Jan 14, 2021
- Intel Corporation
- Peng Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIA...
- Publication number 20200411464
- Publication date Dec 31, 2020
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE LIDS WITH POLYMER FEATURES
- Publication number 20200411395
- Publication date Dec 31, 2020
- Intel Corporation
- Elah Bozorg-Grayeli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH SOLDER THERMAL INTERFACE MATERIAL
- Publication number 20200411407
- Publication date Dec 31, 2020
- Intel Corporation
- Manish Dubey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VENTED LIDS FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20200402884
- Publication date Dec 24, 2020
- Intel Corporation
- Zhimin Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIDS FOR INTEGRATED CIRCUIT PACKAGES WITH SOLDER THERMAL INTERFACE...
- Publication number 20200388554
- Publication date Dec 10, 2020
- Intel Corporation
- Bamidele Daniel Falola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH ASYMMETRIC ADHESION MATERIAL REGIONS
- Publication number 20200381334
- Publication date Dec 3, 2020
- Intel Corporation
- Karthik Visvanathan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH SOLDER THERMAL INTERFACE MATERIALS...
- Publication number 20200381332
- Publication date Dec 3, 2020
- Intel Corporation
- Amitesh Saha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES WITH THERMAL INTERFACE MATERIALS WITH D...
- Publication number 20200373220
- Publication date Nov 26, 2020
- Intel Corporation
- Sergio Antonio Chan Arguedas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH A HIGHLY CONDUCTIVE LAYER DEPOSITED ON DIE USING THROU...
- Publication number 20200227335
- Publication date Jul 16, 2020
- Intel Corporation
- Feras EID
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE INTEGRATED POSTS AND HEAT SPREADER CUSTOMIZATION FOR ENHA...
- Publication number 20200194335
- Publication date Jun 18, 2020
- Intel Corporation
- Feras EID
- H01 - BASIC ELECTRIC ELEMENTS

Sergio A. Chan Arguedas

Person

Patents Grantslast 30 patents

Additively manufactured structures for heat dissipation from integr...

Integrated circuit packages with thermal interface materials with d...

Protruding SN substrate features for epoxy flow control

Integrated circuit package lids with polymer features

Vented lids for integrated circuit packages

First-level integration of second-level thermal interface material...

Full package vapor chamber with IHS

Lids for integrated circuit packages with solder thermal interface...

Integrated heat spreader (IHS) with heating element

Microelectronic assemblies including a thermal interface material

Corner guard for improved electroplated first level interconnect bu...

Package with a highly conductive layer deposited on die using throu...

Microelectronic package with solder array thermal interface materia...

Integrated circuit packages with asymmetric adhesion material regions

Package with a highly conductive layer deposited on die using throu...

Substrate integrated posts and heat spreader customization for enha...

5G mmWave cooling through PCB

Multi-chip package with partial integrated heat spreader

Electronic device package with recessed substrate for underfill con...

Patents Applicationslast 30 patents

PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROL

SOCKET INTERFACE FRAMES FOR DEVICES WITH IMPROVED-PERFORMANCE SUBST...

MULTIPLE COMPOSITION THERMAL INTERFACE MATERIALS FOR MULTI-DIE PACK...

SOLDERED METALLIC RESERVOIRS FOR ENHANCED TRANSIENT AND STEADY-STAT...

MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIA...

5G mmWAVE COOLING THROUGH PCB

PACKAGE WITH A HIGHLY CONDUCTIVE LAYER DEPOSITED ON DIE USING THROU...

IMMERSION COOLING FOR INTEGRATED CIRCUIT DEVICES

ADDITIVELY MANUFACTURED STRUCTURES FOR HEAT DISSIPATION FROM INTEGR...

INTEGRATED CIRCUIT HEAT SPREADER INCLUDING SEALANT INTERFACE MATERIAL

FIRST-LEVEL INTEGRATION OF SECOND-LEVEL THERMAL INTERFACE MATERIAL...

FULL PACKAGE VAPOR CHAMBER WITH IHS

SEMICONDUCTOR PACKAGE WITH ATTACHMENT AND/OR STOP STRUCTURES

SOLDERED METALLIC RESERVOIRS FOR ENHANCED TRANSIENT AND STEADY-STAT...

MULTI-CHIP PACKAGE WITH PARTIAL INTEGRATED HEAT SPREADER

VARIABLE-THICKNESS INTEGRATED HEAT SPREADER (IHS)

PROTRUDING SN SUBSTRATE FEATURES FOR EPOXY FLOW CONTROL

CORNER GUARD FOR IMPROVED ELECTROPLATED FIRST LEVEL INTERCONNECT BU...

INTEGRATED HEAT SPREADER (IHS) WITH SOLDER THERMAL INTERFACE MATERI...

INTEGRATED HEAT SPREADER (IHS) WITH HEATING ELEMENT

MICROELECTRONIC PACKAGE WITH SOLDER ARRAY THERMAL INTERFACE MATERIA...

INTEGRATED CIRCUIT PACKAGE LIDS WITH POLYMER FEATURES

INTEGRATED CIRCUIT PACKAGES WITH SOLDER THERMAL INTERFACE MATERIAL

VENTED LIDS FOR INTEGRATED CIRCUIT PACKAGES

LIDS FOR INTEGRATED CIRCUIT PACKAGES WITH SOLDER THERMAL INTERFACE...

INTEGRATED CIRCUIT PACKAGES WITH ASYMMETRIC ADHESION MATERIAL REGIONS

INTEGRATED CIRCUIT PACKAGES WITH SOLDER THERMAL INTERFACE MATERIALS...

INTEGRATED CIRCUIT PACKAGES WITH THERMAL INTERFACE MATERIALS WITH D...

PACKAGE WITH A HIGHLY CONDUCTIVE LAYER DEPOSITED ON DIE USING THROU...

SUBSTRATE INTEGRATED POSTS AND HEAT SPREADER CUSTOMIZATION FOR ENHA...