Seri Lee

Person

Beaverton, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Fan integrated thermal management device
- Patent number 7,535,708
- Issue date May 19, 2009
- Intel Corporation
- Seri Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method, apparatus and system for enclosure enhancement
- Patent number 7,499,274
- Issue date Mar 3, 2009
- Intel Corporation
- Scott Noble
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Spring loaded heat sink retention mechanism
- Patent number 7,495,922
- Issue date Feb 24, 2009
- Intel Corporation
- Johan F. Ploeg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Rake shaped fan
- Patent number 7,321,184
- Issue date Jan 22, 2008
- Intel Corporation
- Seri Lee
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Method of attaching non-adhesive thermal interface materials
- Patent number 7,019,977
- Issue date Mar 28, 2006
- Intel Corporation
- Seri Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink and package surface design
- Patent number 6,870,736
- Issue date Mar 22, 2005
- Intel Corporation
- Seri Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance heat sink configurations for use in high density p...
- Patent number 6,845,010
- Issue date Jan 18, 2005
- Intel Corporation
- Seri Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink and package surface design
- Patent number 6,757,170
- Issue date Jun 29, 2004
- Intel Corporation
- Seri Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-dissipating devices, systems, and methods with small footprint
- Patent number 6,633,484
- Issue date Oct 14, 2003
- Intel Corporation
- Seri Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance heat sink configurations for use in high density p...
- Patent number 6,535,385
- Issue date Mar 18, 2003
- Intel Corporation
- Seri Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance fin configuration for air cooled heat sinks
- Patent number 6,501,655
- Issue date Dec 31, 2002
- Intel Corporation
- Seri Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High performance air cooled heat sinks used in high density packagi...
- Patent number 6,479,895
- Issue date Nov 12, 2002
- Intel Corporation
- Seri Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM FOR HEAT REMOVAL FROM SERVER RACKS
- Publication number 20240224474
- Publication date Jul 4, 2024
- Chun Keat CHEONG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermal device with ionized air flow
- Publication number 20100149719
- Publication date Jun 17, 2010
- Johan F. Ploeg
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
THERMAL DEVICE WITH ELECTROKINETIC AIR FLOW
- Publication number 20090168344
- Publication date Jul 2, 2009
- Johan F. Ploeg
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
PIEZOELECTRIC FAN
- Publication number 20090004034
- Publication date Jan 1, 2009
- Seri Lee
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
SPRING LOADED HEAT SINK RETENTION MECHANISM
- Publication number 20080239678
- Publication date Oct 2, 2008
- Johan F. Ploeg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Cooling device, system containing same, and cooling method
- Publication number 20080218972
- Publication date Sep 11, 2008
- Ioan Sauciuc
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
FAN INTEGRATED THERMAL MANAGEMENT DEVICE
- Publication number 20080068790
- Publication date Mar 20, 2008
- Intel Corporation
- Seri Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method, apparatus and system for enclosure enhancement
- Publication number 20070285891
- Publication date Dec 13, 2007
- Intel Corporation
- Scott Noble
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Rake shaped fan
- Publication number 20070037506
- Publication date Feb 15, 2007
- Seri Lee
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
Method of attaching non-adhesive thermal interface materials
- Publication number 20050135066
- Publication date Jun 23, 2005
- Intel Corporation
- Seri Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat sink and package surface design
- Publication number 20040218354
- Publication date Nov 4, 2004
- Intel Corporation
- Seri Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Radial heat sink with skived-shaped fin and methods of making same
- Publication number 20040190245
- Publication date Sep 30, 2004
- Murli Tirumala
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Heat sink and package surface design
- Publication number 20040017656
- Publication date Jan 29, 2004
- Intel Corporation
- Seri Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High performance heat sink configurations for use in high density p...
- Publication number 20030189813
- Publication date Oct 9, 2003
- Intel Corporation
- Seri Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE AIR COOLED HEAT SINKS USED IN HIGH DENSITY PACKAGI...
- Publication number 20020171139
- Publication date Nov 21, 2002
- Intel Corporation
- Seri Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat sink
- Publication number 20020079097
- Publication date Jun 27, 2002
- Seri Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIgh performance heat sink configurations for use in high density p...
- Publication number 20020060902
- Publication date May 23, 2002
- Intel Corporation
- Seri Lee
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Fan integrated thermal management device

Method, apparatus and system for enclosure enhancement

Spring loaded heat sink retention mechanism

Rake shaped fan

Method of attaching non-adhesive thermal interface materials

Heat sink and package surface design

High performance heat sink configurations for use in high density p...

Heat sink and package surface design

Heat-dissipating devices, systems, and methods with small footprint

High performance heat sink configurations for use in high density p...

High performance fin configuration for air cooled heat sinks

High performance air cooled heat sinks used in high density packagi...

Patents Applicationslast 30 patents

SYSTEM FOR HEAT REMOVAL FROM SERVER RACKS

Thermal device with ionized air flow

THERMAL DEVICE WITH ELECTROKINETIC AIR FLOW

PIEZOELECTRIC FAN

SPRING LOADED HEAT SINK RETENTION MECHANISM

Cooling device, system containing same, and cooling method

FAN INTEGRATED THERMAL MANAGEMENT DEVICE

Method, apparatus and system for enclosure enhancement

Rake shaped fan

Method of attaching non-adhesive thermal interface materials

Heat sink and package surface design

Radial heat sink with skived-shaped fin and methods of making same

Heat sink and package surface design

High performance heat sink configurations for use in high density p...

HIGH PERFORMANCE AIR COOLED HEAT SINKS USED IN HIGH DENSITY PACKAGI...

Heat sink

HIgh performance heat sink configurations for use in high density p...