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Sesh RAMASWAMI
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Saratoga, CA, US
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Patents Grants
last 30 patents
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Patent Grant
Fabrication of through-silicon vias on silicon wafers
Patent number
8,329,575
Issue date
Dec 11, 2012
Applied Materials, Inc.
Nagarajan Rajagopalan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fabrication of through-silicon vias on silicon wafers
Patent number
8,283,237
Issue date
Oct 9, 2012
Applied Materials, Inc.
Nagarajan Rajagopalan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Collimated and long throw magnetron sputtering of nickel/iron films...
Patent number
7,294,242
Issue date
Nov 13, 2007
Applied Materials, Inc.
Imran Hashim
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Patent Grant
Method for enhancing the adhesion of copper deposited by chemical v...
Patent number
6,362,099
Issue date
Mar 26, 2002
Applied Materials, Inc.
Srinivas Gandikota
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
FABRICATION OF 3D CHIP STACKS WITHOUT CARRIER PLATES
Publication number
20140273354
Publication date
Sep 18, 2014
Applied Materials, Inc.
Sesh RAMASWAMI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FABRICATION OF THROUGH-SILICON VIAS ON SILICON WAFERS
Publication number
20120164827
Publication date
Jun 28, 2012
Applied Materials, Inc.
Nagarajan RAJAGOPALAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FABRICATION OF THROUGH-SILICON VIAS ON SILICON WAFERS
Publication number
20120164829
Publication date
Jun 28, 2012
Applied Materials, Inc.
Nagarajan RAJAGOPALAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for enhancing the adhesion of copper deposited by chemical v...
Publication number
20020119657
Publication date
Aug 29, 2002
Srinivas Gandikota
H01 - BASIC ELECTRIC ELEMENTS