Sesha Varadarajan

Person

Lake Oswego, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Systems and methods for suppressing parasitic plasma and reducing w...
- Patent number 11,127,567
- Issue date Sep 21, 2021
- Lam Research Corporation
- Hu Kang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Systems and methods for suppressing parasitic plasma and reducing w...
- Patent number 10,665,429
- Issue date May 26, 2020
- Lam Research Corporation
- Hu Kang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Systems and methods for reducing backside deposition and mitigating...
- Patent number 9,852,901
- Issue date Dec 26, 2017
- Lam Research Corporation
- Sesha Varadarajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Systems and methods for suppressing parasitic plasma and reducing w...
- Patent number 9,793,096
- Issue date Oct 17, 2017
- Lam Research Corporation
- Hu Kang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Systems and methods for reducing backside deposition and mitigating...
- Patent number 9,460,915
- Issue date Oct 4, 2016
- Lam Research Corporation
- Sesha Varadarajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Conformal film deposition for gapfill
- Patent number 9,355,886
- Issue date May 31, 2016
- Novellus Systems, Inc.
- Shankar Swaminathan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatus for depositing copper on tungsten
- Patent number 8,377,824
- Issue date Feb 19, 2013
- Novellus Systems, Inc.
- Jonathan Reid
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plasma particle extraction process for PECVD
- Patent number 8,192,806
- Issue date Jun 5, 2012
- Novellus Systems, Inc.
- Sesha Varadarajan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and apparatus for depositing copper on tungsten
- Patent number 8,168,540
- Issue date May 1, 2012
- Novellus Systems, Inc.
- Jonathan Reid
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for improving process control and film conformality of PECVD...
- Patent number 7,745,346
- Issue date Jun 29, 2010
- Novellus Systems, Inc.
- Dennis Hausmann
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electroplating using DC current interruption and variable rotation...
- Patent number 6,884,335
- Issue date Apr 26, 2005
- Novellus Systems, Inc.
- Eric G. Webb
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplating process for avoiding defects in metal features of in...
- Patent number 6,793,796
- Issue date Sep 21, 2004
- Novellus Systems, Inc.
- Jonathan D. Reid
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND METHODS FOR SUPPRESSING PARASITIC PLASMA AND REDUCING W...
- Publication number 20200335304
- Publication date Oct 22, 2020
- LAM RESEARCH CORPORATION
- Hu Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR SUPPRESSING PARASITIC PLASMA AND REDUCING W...
- Publication number 20180068833
- Publication date Mar 8, 2018
- LAM RESEARCH CORPORATION
- Hu Kang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEMS AND METHODS FOR REDUCING BACKSIDE DEPOSITION AND MITIGATING...
- Publication number 20160372318
- Publication date Dec 22, 2016
- LAM RESEARCH CORPORATION
- Sesha Varadarajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEMS AND METHODS FOR REDUCING BACKSIDE DEPOSITION AND MITIGATING...
- Publication number 20160079057
- Publication date Mar 17, 2016
- LAM RESEARCH CORPORATION
- Sesha Varadarajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Systems and Methods for Suppressing Parasitic Plasma and Reducing W...
- Publication number 20160079036
- Publication date Mar 17, 2016
- LAM RESEARCH CORPORATION
- Hu Kang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONFORMAL FILM DEPOSITION FOR GAPFILL
- Publication number 20140134827
- Publication date May 15, 2014
- Novellus Systems, Inc.
- Shankar Swaminathan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR IMPROVING PROCESS CONTROL AND FILM CONFORMALITY OF PECVD...
- Publication number 20100099271
- Publication date Apr 22, 2010
- Novellus Systems, Inc.
- Dennis Hausmann
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Electroplating using DC current interruption and variable rotation...
- Publication number 20040231996
- Publication date Nov 25, 2004
- Novellus Systems, Inc.
- Eric G. Webb
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroplating process for avoiding defects in metal features of in...
- Publication number 20010015321
- Publication date Aug 23, 2001
- Jonathan D. Reid
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Sesha Varadarajan

Person

Patents Grantslast 30 patents

Systems and methods for suppressing parasitic plasma and reducing w...

Systems and methods for suppressing parasitic plasma and reducing w...

Systems and methods for reducing backside deposition and mitigating...

Systems and methods for suppressing parasitic plasma and reducing w...

Systems and methods for reducing backside deposition and mitigating...

Conformal film deposition for gapfill

Methods and apparatus for depositing copper on tungsten

Plasma particle extraction process for PECVD

Methods and apparatus for depositing copper on tungsten

Method for improving process control and film conformality of PECVD...

Electroplating using DC current interruption and variable rotation...

Electroplating process for avoiding defects in metal features of in...

Patents Applicationslast 30 patents

SYSTEMS AND METHODS FOR SUPPRESSING PARASITIC PLASMA AND REDUCING W...

SYSTEMS AND METHODS FOR SUPPRESSING PARASITIC PLASMA AND REDUCING W...

SYSTEMS AND METHODS FOR REDUCING BACKSIDE DEPOSITION AND MITIGATING...

SYSTEMS AND METHODS FOR REDUCING BACKSIDE DEPOSITION AND MITIGATING...

Systems and Methods for Suppressing Parasitic Plasma and Reducing W...

CONFORMAL FILM DEPOSITION FOR GAPFILL

METHOD FOR IMPROVING PROCESS CONTROL AND FILM CONFORMALITY OF PECVD...

Electroplating using DC current interruption and variable rotation...

Electroplating process for avoiding defects in metal features of in...