Seshadri GANGULI

Person

Sunnyvale, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Enhancing gapfill performance of dram word line
- Patent number 12,114,488
- Issue date Oct 8, 2024
- Applied Materials, Inc.
- Yong Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated dipole region for transistor
- Patent number 12,112,951
- Issue date Oct 8, 2024
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Amorphous silicon-based scavenging and sealing EOT
- Patent number 12,100,595
- Issue date Sep 24, 2024
- Applied Materials, Inc.
- Yong Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistivity DRAM buried word line stack
- Patent number 12,022,650
- Issue date Jun 25, 2024
- Applied Materials, Inc.
- Yixiong Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Catalyzed deposition of metal films
- Patent number 12,000,044
- Issue date Jun 4, 2024
- Applied Materials, Inc.
- Sang Ho Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective cobalt deposition on copper surfaces
- Patent number 11,959,167
- Issue date Apr 16, 2024
- Applied Materials, Inc.
- Sang-Ho Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatus for forming dual metal interconnects
- Patent number 11,948,885
- Issue date Apr 2, 2024
- Applied Materials, Inc.
- Suketu A Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor structures
- Patent number 11,908,914
- Issue date Feb 20, 2024
- Applied Materials, Inc.
- Ria Someshwar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having an oxygen free platinum group metal film
- Patent number 11,894,233
- Issue date Feb 6, 2024
- Applied Materials, Inc.
- Yixiong Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of forming molybdenum contacts
- Patent number 11,869,806
- Issue date Jan 9, 2024
- Applied Materials, Inc.
- Seshadri Ganguli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Catalyst enhanced molybdenum deposition and gap fill
- Patent number 11,859,277
- Issue date Jan 2, 2024
- Applied Materials, Inc.
- Xi Cen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective deposition on non-metallic surfaces
- Patent number 11,680,313
- Issue date Jun 20, 2023
- Applied Materials, Inc.
- Sang Ho Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Catalyst enhanced seamless ruthenium gap fill
- Patent number 11,680,312
- Issue date Jun 20, 2023
- Applied Materials, Inc.
- Byunghoon Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of testing a gap fill for DRAM
- Patent number 11,621,266
- Issue date Apr 4, 2023
- Applied Materials, Inc.
- Priyadarshi Panda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low resistivity DRAM buried word line stack
- Patent number 11,587,936
- Issue date Feb 21, 2023
- Applied Materials, Inc.
- Yixiong Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Oxygen free deposition of platinum group metal films
- Patent number 11,488,830
- Issue date Nov 1, 2022
- Applied Materials, Inc.
- Yixiong Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Catalyst enhanced seamless ruthenium gap fill
- Patent number 11,401,602
- Issue date Aug 2, 2022
- Applied Materials, Inc.
- Byunghoon Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective cobalt deposition on copper surfaces
- Patent number 11,384,429
- Issue date Jul 12, 2022
- Applied Materials, Inc.
- Sang-Ho Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for filling features with ruthenium
- Patent number 11,282,745
- Issue date Mar 22, 2022
- Applied Materials, Inc.
- Sang-Ho Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gap fill methods of forming buried word lines in DRAM without formi...
- Patent number 11,171,141
- Issue date Nov 9, 2021
- Applied Materials, Inc.
- Priyadarshi Panda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for forming dual metal interconnects
- Patent number 11,075,165
- Issue date Jul 27, 2021
- Applied Materials, Inc.
- Suketu A Parikh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition of aluminum oxide on metal surfaces
- Patent number 11,060,188
- Issue date Jul 13, 2021
- Applied Materials, Inc.
- Sang Ho Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier for copper metallization and methods of forming
- Patent number 10,930,550
- Issue date Feb 23, 2021
- Applied Materials, Inc.
- Seshadri Ganguli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low thickness dependent work-function nMOS integration for metal gate
- Patent number 10,608,097
- Issue date Mar 31, 2020
- Applied Materials, Inc.
- Paul F. Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Synthesis of metal nitride thin films materials using hydrazine der...
- Patent number 10,487,398
- Issue date Nov 26, 2019
- Applied Materials, Inc.
- Byunghoon Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Selective deposition of aluminum oxide on metal surfaces
- Patent number 10,358,719
- Issue date Jul 23, 2019
- Applied Materials, Inc.
- Sang Ho Yu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for selective deposition of metal silicides via atomic laye...
- Patent number 10,199,230
- Issue date Feb 5, 2019
- Applied Materials, Inc.
- Seshadri Ganguli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-threshold voltage (Vt) workfunction metal by selective atomic...
- Patent number 10,109,534
- Issue date Oct 23, 2018
- Applied Materials, Inc.
- Adam Brand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming barrier/seed layers for copper interconnect str...
- Patent number 9,926,639
- Issue date Mar 27, 2018
- Applied Materials, Inc.
- Hoon Kim
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Multi-threshold voltage structures with a lanthanum nitride film an...
- Patent number 9,748,354
- Issue date Aug 29, 2017
- Applied Materials, Inc.
- Wei V. Tang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED DIPOLE REGION FOR TRANSISTOR
- Publication number 20250006499
- Publication date Jan 2, 2025
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HALIDE AND ORGANIC PRECURSORS FOR METAL DEPOSITION
- Publication number 20240360557
- Publication date Oct 31, 2024
- Applied Materials, Inc.
- Srinivas Gandikota
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MULTI-VT INTEGRATION SCHEME FOR SEMICONDUCTOR DEVICES
- Publication number 20240266414
- Publication date Aug 8, 2024
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE COBALT DEPOSITION ON COPPER SURFACES
- Publication number 20240218503
- Publication date Jul 4, 2024
- Applied Materials, Inc.
- Sang-Ho YU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR STRUCTURES
- Publication number 20240154018
- Publication date May 9, 2024
- Applied Materials, Inc.
- Ria Someshwar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADICAL TREATMENT FOR METAL GATE STACK
- Publication number 20240087899
- Publication date Mar 14, 2024
- Applied Materials, Inc.
- Zhihui Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DIPOLE REGION FOR TRANSISTOR
- Publication number 20240063064
- Publication date Feb 22, 2024
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL MOLYBDENUM DEPOSITION
- Publication number 20240026529
- Publication date Jan 25, 2024
- Applied Materials, Inc.
- Srinivas Gandikota
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ATOMIC LAYER DEPOSITION OF HIGH DIELECTRIC CONSTANT MATERIALS
- Publication number 20230420486
- Publication date Dec 28, 2023
- Applied Materials, Inc.
- Geetika Bajaj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMATION OF CONFORMAL ALD SIO2 FILMS
- Publication number 20230416909
- Publication date Dec 28, 2023
- Applied Materials, Inc.
- Geetika BAJAJ
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ATOMIC LAYER DEPOSITION USING NOVEL OXYGEN-CONTAINING PRECURSORS
- Publication number 20230416915
- Publication date Dec 28, 2023
- Applied Materials, Inc.
- Geetika Bajaj
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF FORMING INTERCONNECT STRUCTURE
- Publication number 20230295804
- Publication date Sep 21, 2023
- Applied Materials, Inc.
- Srinivas Gandikota
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SILICIDES, ALLOYS AND INTERMETALLICS TO MINIMIZE RESISTANCE
- Publication number 20230268414
- Publication date Aug 24, 2023
- Applied Materials, Inc.
- Michael Haverty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DIPOLE REGION FOR TRANSISTOR
- Publication number 20230260791
- Publication date Aug 17, 2023
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTIVITY DRAM BURIED WORD LINE STACK
- Publication number 20230141748
- Publication date May 11, 2023
- Applied Materials, Inc.
- Yixiong Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Oxygen Free Deposition Of Platinum Group Metal Films
- Publication number 20230025937
- Publication date Jan 26, 2023
- Applied Materials, Inc.
- Yixiong Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR STRUCTURES
- Publication number 20230015781
- Publication date Jan 19, 2023
- Applied Materials, Inc.
- Ria Someshwar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Catalyst Enhanced Molybdenum Deposition And Gap Fill
- Publication number 20220372617
- Publication date Nov 24, 2022
- Applied Materials, Inc.
- Xi Cen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF FORMING MOLYBDENUM CONTACTS
- Publication number 20220359281
- Publication date Nov 10, 2022
- Applied Materials, Inc.
- Seshadri Ganguli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCING GAPFILL PERFORMANCE OF DRAM WORD LINE
- Publication number 20220359532
- Publication date Nov 10, 2022
- Applied Materials, Inc.
- Yong Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CATALYST ENHANCED SEAMLESS RUTHENIUM GAP FILL
- Publication number 20220333232
- Publication date Oct 20, 2022
- Applied Materials, Inc.
- Byunghoon Yoon
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
GAP FILL METHODS USING CATALYZED DEPOSITION
- Publication number 20220325410
- Publication date Oct 13, 2022
- Applied Materials, Inc.
- Byunghoon Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE COBALT DEPOSITION ON COPPER SURFACES
- Publication number 20220298625
- Publication date Sep 22, 2022
- Applied Materials, Inc.
- Sang-Ho YU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Low Resistivity DRAM Buried Word Line Stack
- Publication number 20220278108
- Publication date Sep 1, 2022
- Applied Materials, Inc.
- Yixiong Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION OF SILICON-BASED DIELECTRIC FILMS
- Publication number 20220270870
- Publication date Aug 25, 2022
- Applied Materials, Inc.
- Geetika Bajaj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Amorphous Silicon-Based Scavenging And Sealing EOT
- Publication number 20220254640
- Publication date Aug 11, 2022
- Applied Materials, Inc.
- Yong Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR METAL FILL IN METAL GATE STACK
- Publication number 20220165852
- Publication date May 26, 2022
- Applied Materials, Inc.
- Srinivas GANDIKOTA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND MATERIALS FOR ENHANCED BARRIER PERFORMANCE AND REDUCED...
- Publication number 20220122923
- Publication date Apr 21, 2022
- Applied Materials, Inc.
- Lu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR SEAM REDUCTION OR ELIMINATION
- Publication number 20220108916
- Publication date Apr 7, 2022
- Applied Materials, Inc.
- Yixiong YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAP FILL METHODS FOR DRAM
- Publication number 20220068935
- Publication date Mar 3, 2022
- Applied Materials, Inc.
- Priyadarshi Panda
- H01 - BASIC ELECTRIC ELEMENTS

Seshadri GANGULI

Person

Patents Grantslast 30 patents

Enhancing gapfill performance of dram word line

Integrated dipole region for transistor

Amorphous silicon-based scavenging and sealing EOT

Low resistivity DRAM buried word line stack

Catalyzed deposition of metal films

Selective cobalt deposition on copper surfaces

Methods and apparatus for forming dual metal interconnects

Methods of forming semiconductor structures

Electronic device having an oxygen free platinum group metal film

Methods of forming molybdenum contacts

Catalyst enhanced molybdenum deposition and gap fill

Selective deposition on non-metallic surfaces

Catalyst enhanced seamless ruthenium gap fill

Method of testing a gap fill for DRAM

Low resistivity DRAM buried word line stack

Oxygen free deposition of platinum group metal films

Catalyst enhanced seamless ruthenium gap fill

Selective cobalt deposition on copper surfaces

Methods for filling features with ruthenium

Gap fill methods of forming buried word lines in DRAM without formi...

Methods and apparatus for forming dual metal interconnects

Selective deposition of aluminum oxide on metal surfaces

Barrier for copper metallization and methods of forming

Low thickness dependent work-function nMOS integration for metal gate

Synthesis of metal nitride thin films materials using hydrazine der...

Selective deposition of aluminum oxide on metal surfaces

Methods for selective deposition of metal silicides via atomic laye...

Multi-threshold voltage (Vt) workfunction metal by selective atomic...

Methods for forming barrier/seed layers for copper interconnect str...

Multi-threshold voltage structures with a lanthanum nitride film an...

Patents Applicationslast 30 patents

INTEGRATED DIPOLE REGION FOR TRANSISTOR

HALIDE AND ORGANIC PRECURSORS FOR METAL DEPOSITION

MULTI-VT INTEGRATION SCHEME FOR SEMICONDUCTOR DEVICES

SELECTIVE COBALT DEPOSITION ON COPPER SURFACES

METHODS OF FORMING SEMICONDUCTOR STRUCTURES

RADICAL TREATMENT FOR METAL GATE STACK

INTEGRATED DIPOLE REGION FOR TRANSISTOR

CONFORMAL MOLYBDENUM DEPOSITION

ATOMIC LAYER DEPOSITION OF HIGH DIELECTRIC CONSTANT MATERIALS

METHOD FOR FORMATION OF CONFORMAL ALD SIO2 FILMS

ATOMIC LAYER DEPOSITION USING NOVEL OXYGEN-CONTAINING PRECURSORS

METHOD OF FORMING INTERCONNECT STRUCTURE

SILICIDES, ALLOYS AND INTERMETALLICS TO MINIMIZE RESISTANCE

INTEGRATED DIPOLE REGION FOR TRANSISTOR

LOW RESISTIVITY DRAM BURIED WORD LINE STACK

Oxygen Free Deposition Of Platinum Group Metal Films

METHODS OF FORMING SEMICONDUCTOR STRUCTURES

Catalyst Enhanced Molybdenum Deposition And Gap Fill

METHODS OF FORMING MOLYBDENUM CONTACTS

ENHANCING GAPFILL PERFORMANCE OF DRAM WORD LINE

CATALYST ENHANCED SEAMLESS RUTHENIUM GAP FILL

GAP FILL METHODS USING CATALYZED DEPOSITION

SELECTIVE COBALT DEPOSITION ON COPPER SURFACES

Low Resistivity DRAM Buried Word Line Stack

DEPOSITION OF SILICON-BASED DIELECTRIC FILMS

Amorphous Silicon-Based Scavenging And Sealing EOT

METHODS AND APPARATUS FOR METAL FILL IN METAL GATE STACK

METHODS AND MATERIALS FOR ENHANCED BARRIER PERFORMANCE AND REDUCED...

METHODS AND APPARATUS FOR SEAM REDUCTION OR ELIMINATION

GAP FILL METHODS FOR DRAM