Seshadri Ramaswami

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Copper, indium, gallium, selenium (CIGS) films with improved quantu...
- Patent number 12,211,947
- Issue date Jan 28, 2025
- Applied Materials, Inc.
- Philip Hsin-hua Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper, indium, gallium, selenium (CIGS) films with improved quantu...
- Patent number 11,728,449
- Issue date Aug 15, 2023
- Applied Materials, Inc.
- Philip Hsin-hua Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for thin wafer carrier
- Patent number 11,094,573
- Issue date Aug 17, 2021
- Applied Materials, Inc.
- Jingyu Qiao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for producing copper-indium-gallium-selenium...
- Patent number 11,088,293
- Issue date Aug 10, 2021
- Applied Materials, Inc.
- Philip Hsin-Hua Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of creating CIGS photodiode for image sensor applications
- Patent number 11,018,275
- Issue date May 25, 2021
- Applied Materials, Inc.
- Philip Hsin-hua Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealing structure for workpiece to substrate bonding in a processin...
- Patent number 10,978,334
- Issue date Apr 13, 2021
- Applied Materials, Inc.
- Chin Hock Toh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrostatic chucking force measurement tool for process chamber c...
- Patent number 10,879,094
- Issue date Dec 29, 2020
- Applied Materials, Inc.
- Srinivas D. Nemani
- G01 - MEASURING TESTING
Information Patent Grant
Automated apparatus to temporarily attach substrates to carriers wi...
- Patent number 10,665,494
- Issue date May 26, 2020
- Applied Materials, Inc.
- Niranjan Kumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for wafer level singulation
- Patent number 9,502,294
- Issue date Nov 22, 2016
- Applied Materials, Inc.
- Klaus Schuegraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of diced wafer transportation
- Patent number 8,940,619
- Issue date Jan 27, 2015
- Applied Materials, Inc.
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system for wafer level singulation
- Patent number 8,580,615
- Issue date Nov 12, 2013
- Applied Materials, Inc.
- Klaus Schuegraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for improving sidewall coverage during sputter...
- Patent number 6,899,799
- Issue date May 31, 2005
- Applied Materials, Inc.
- Kenny King-Tai Ngan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Continuous, non-agglomerated adhesion of a seed layer to a barrier...
- Patent number 6,627,542
- Issue date Sep 30, 2003
- Applied Materials, Inc.
- Srinivas Gandikota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sputtering method to generate ionized metal plasma using electron b...
- Patent number 6,599,399
- Issue date Jul 29, 2003
- Applied Materials, Inc.
- Zheng Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Target for use in magnetron sputtering of nickel for forming metall...
- Patent number 6,521,107
- Issue date Feb 18, 2003
- Applied Materials, Inc.
- Murali Abburi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for improving sidewall coverage during sputter...
- Patent number 6,475,356
- Issue date Nov 5, 2002
- Applied Materials, Inc.
- Ken Ngan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Target for use in magnetron sputtering of nickel for forming metall...
- Patent number 6,472,867
- Issue date Oct 29, 2002
- Applied Materials, Inc.
- Murali Abburi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Fabricating plug and near-zero overlap interconnect line
- Patent number 6,455,921
- Issue date Sep 24, 2002
- Applied Materials, Inc.
- Seshadri Ramaswami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacture of target for use in magnetron sputtering of nickel and...
- Patent number 6,436,207
- Issue date Aug 20, 2002
- Applied Material, Inc.
- Murali Abburi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ti/Tinx underlayer which enables a highly <111> ori...
- Patent number 6,420,260
- Issue date Jul 16, 2002
- Applied Materials, Inc.
- Kenny King-tai Ngan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of enhancing hardness of sputter deposited copper films
- Patent number 6,391,163
- Issue date May 21, 2002
- Applied Materials, Inc.
- Vikram Pavate
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for manufacturing metal sputtering target for use in DC magn...
- Patent number 6,228,186
- Issue date May 8, 2001
- Applied Materials, Inc.
- Vikram Pavate
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Target for use in magnetron sputtering of aluminum for forming meta...
- Patent number 6,171,455
- Issue date Jan 9, 2001
- Applied Materials Inc.
- Vikram Pavate
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of producing smooth titanium nitride films having low resist...
- Patent number 6,149,777
- Issue date Nov 21, 2000
- Applied Materials, Inc.
- Kenny King-tai Ngan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Copper target for sputter deposition
- Patent number 6,139,701
- Issue date Oct 31, 2000
- Applied Materials, Inc.
- Vikram Pavate
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Target for use in magnetron sputtering of aluminum for forming meta...
- Patent number 6,126,791
- Issue date Oct 3, 2000
- Applied Materials, Inc.
- Vikram Pavate
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Target for use in magnetron sputtering of nickel for forming metall...
- Patent number 6,086,725
- Issue date Jul 11, 2000
- Applied Materials, Inc.
- Murali Abburi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Smooth titanium nitride films having low resistivity
- Patent number 6,059,872
- Issue date May 9, 2000
- Applied Materials, Inc.
- Kenny King-tai Ngan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of fabricating a fabricating plug and near-zero overlap inte...
- Patent number 6,046,100
- Issue date Apr 4, 2000
- Applied Materials, Inc.
- Seshadri Ramaswami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Target for use in magnetron sputtering of aluminum for forming meta...
- Patent number 6,001,227
- Issue date Dec 14, 1999
- Applied Materials, Inc.
- Vikram Pavate
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
MONOLITHIC COMPLEMENTARY FIELD-EFFECT TRANSISTORS HAVING CARBON-DOP...
- Publication number 20230326925
- Publication date Oct 12, 2023
- Applied Materials, Inc.
- Andrew Anthony Cockburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER, INDIUM, GALLIUM, SELENIUM (CIGS) FILMS WITH IMPROVED QUANTU...
- Publication number 20230275165
- Publication date Aug 31, 2023
- Applied Materials, Inc.
- Philip Hsin-hua Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER, INDIUM, GALLIUM, SELENIUM (CIGS) FILMS WITH IMPROVED QUANTU...
- Publication number 20210167235
- Publication date Jun 3, 2021
- Applied Materials, Inc.
- Philip Hsin-hua Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING VERTICAL CAVITY SURFACE EMITTING LASER DIE ONTO A SILICON W...
- Publication number 20210151949
- Publication date May 20, 2021
- Applied Materials, Inc.
- Philip Hsin-Hua LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF CREATING CIGS PHOTODIODE FOR IMAGE SENSOR APPLICATIONS
- Publication number 20210111297
- Publication date Apr 15, 2021
- Applied Materials, Inc.
- Philip Hsin-hua Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS TO IMPROVE INTERFACE STATE DENSITY Dit ON DEEP TRENCH ISOLA...
- Publication number 20210111222
- Publication date Apr 15, 2021
- Applied Materials, Inc.
- Philip Hsin-hua Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR THIN WAFER CARRIER
- Publication number 20200161156
- Publication date May 21, 2020
- Applied Materials, Inc.
- Jingyu QIAO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND APPARATUS FOR IMAGE SENSOR SEMICONDUCTORS
- Publication number 20200006412
- Publication date Jan 2, 2020
- PHILIP HSIN-HUA LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR PRODUCING COPPER-INDIUM-GALLIUM-SELENIUM...
- Publication number 20200006581
- Publication date Jan 2, 2020
- Applied Materials, Inc.
- PHILIP HSIN-HUA LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF PATTERNING A WAFER SUBSTRATE
- Publication number 20190362965
- Publication date Nov 28, 2019
- Applied Materials, Inc.
- Keith Tatseun WONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AUTOMATED APPARATUS TO TEMPORARILY ATTACH SUBSTRATES TO CARRIERS WI...
- Publication number 20190237352
- Publication date Aug 1, 2019
- Applied Materials, Inc.
- Niranjan KUMAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYDROPHOBIC ELECTROSTATIC CHUCK
- Publication number 20190115241
- Publication date Apr 18, 2019
- Kim VELLORE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROSTATIC CARRIER FOR DIE BONDING APPLICATIONS
- Publication number 20180374736
- Publication date Dec 27, 2018
- Applied Materials, Inc.
- Niranjan KUMAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE-LESS CARRIERS FOR CHEMICAL MECHANICAL POLISHING
- Publication number 20180281151
- Publication date Oct 4, 2018
- Applied Materials, Inc.
- Seshadri RAMASWAMI
- B24 - GRINDING POLISHING
Information Patent Application
ELECTROSTATIC CHUCKING FORCE MEASUREMENT TOOL FOR PROCESS CHAMBER C...
- Publication number 20180144959
- Publication date May 24, 2018
- Applied Materials, Inc.
- Srinivas D. Nemani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS BALANCED ELECTROSTATIC SUBSTRATE CARRIER WITH CONTACTS
- Publication number 20180122679
- Publication date May 3, 2018
- Applied Materials, Inc.
- Shambhu N. Roy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEALING STRUCTURE FOR WORKPIECE TO SUBSTRATE BONDING IN A PROCESSIN...
- Publication number 20160064267
- Publication date Mar 3, 2016
- Chin Hock Toh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF DICED WAFER TRANSPORTATION
- Publication number 20150102467
- Publication date Apr 16, 2015
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR WAFER LEVEL SINGULATION
- Publication number 20140196850
- Publication date Jul 17, 2014
- Applied Materials, Inc.
- Klaus Schuegraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DICED WAFER TRANSPORTATION
- Publication number 20140015109
- Publication date Jan 16, 2014
- Wei-Sheng Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR WAFER LEVEL SINGULATION
- Publication number 20130045570
- Publication date Feb 21, 2013
- Applied Materials, Inc.
- Klaus Schuegraf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for improving sidewall coverage during sputter...
- Publication number 20050205414
- Publication date Sep 22, 2005
- APPLIED MATERIALS, INC.
- Kenny King-tai Ngan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and apparatus for improving sidewall coverage during sputter...
- Publication number 20030038025
- Publication date Feb 27, 2003
- APPLIED MATERIALS, INC.
- Ken Ngan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Target for use in magnetron sputtering of nickel for forming metall...
- Publication number 20030015420
- Publication date Jan 23, 2003
- Murali Abburi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of producing smooth titanium nitride films having low resist...
- Publication number 20020125123
- Publication date Sep 12, 2002
- Kenny King-tai Ngan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of enhancing hardness of sputter deposited copper films
- Publication number 20020088716
- Publication date Jul 11, 2002
- Vikram Pavate
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SPUTTERING METHOD TO GENERATE IONIZED METAL PLASMA USING ELECTRON B...
- Publication number 20020005348
- Publication date Jan 17, 2002
- ZHENG XU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Seshadri Ramaswami

Person

Patents Grantslast 30 patents

Copper, indium, gallium, selenium (CIGS) films with improved quantu...

Copper, indium, gallium, selenium (CIGS) films with improved quantu...

Method and apparatus for thin wafer carrier

Methods and apparatus for producing copper-indium-gallium-selenium...

Method of creating CIGS photodiode for image sensor applications

Sealing structure for workpiece to substrate bonding in a processin...

Electrostatic chucking force measurement tool for process chamber c...

Automated apparatus to temporarily attach substrates to carriers wi...

Method and system for wafer level singulation

Method of diced wafer transportation

Method and system for wafer level singulation

Method and apparatus for improving sidewall coverage during sputter...

Continuous, non-agglomerated adhesion of a seed layer to a barrier...

Sputtering method to generate ionized metal plasma using electron b...

Target for use in magnetron sputtering of nickel for forming metall...

Method and apparatus for improving sidewall coverage during sputter...

Target for use in magnetron sputtering of nickel for forming metall...

Fabricating plug and near-zero overlap interconnect line

Manufacture of target for use in magnetron sputtering of nickel and...

Ti/Tinx underlayer which enables a highly &#x0003C;111&#x0003E; ori...

Method of enhancing hardness of sputter deposited copper films

Method for manufacturing metal sputtering target for use in DC magn...

Target for use in magnetron sputtering of aluminum for forming meta...

Method of producing smooth titanium nitride films having low resist...

Copper target for sputter deposition

Target for use in magnetron sputtering of aluminum for forming meta...

Target for use in magnetron sputtering of nickel for forming metall...

Smooth titanium nitride films having low resistivity

Method of fabricating a fabricating plug and near-zero overlap inte...

Target for use in magnetron sputtering of aluminum for forming meta...

Patents Applicationslast 30 patents

MONOLITHIC COMPLEMENTARY FIELD-EFFECT TRANSISTORS HAVING CARBON-DOP...

COPPER, INDIUM, GALLIUM, SELENIUM (CIGS) FILMS WITH IMPROVED QUANTU...

COPPER, INDIUM, GALLIUM, SELENIUM (CIGS) FILMS WITH IMPROVED QUANTU...

BONDING VERTICAL CAVITY SURFACE EMITTING LASER DIE ONTO A SILICON W...

METHOD OF CREATING CIGS PHOTODIODE FOR IMAGE SENSOR APPLICATIONS

PROCESS TO IMPROVE INTERFACE STATE DENSITY Dit ON DEEP TRENCH ISOLA...

METHOD AND APPARATUS FOR THIN WAFER CARRIER

METHODS AND APPARATUS FOR IMAGE SENSOR SEMICONDUCTORS

METHODS AND APPARATUS FOR PRODUCING COPPER-INDIUM-GALLIUM-SELENIUM...

METHODS OF PATTERNING A WAFER SUBSTRATE

AUTOMATED APPARATUS TO TEMPORARILY ATTACH SUBSTRATES TO CARRIERS WI...

HYDROPHOBIC ELECTROSTATIC CHUCK

ELECTROSTATIC CARRIER FOR DIE BONDING APPLICATIONS

ADHESIVE-LESS CARRIERS FOR CHEMICAL MECHANICAL POLISHING

ELECTROSTATIC CHUCKING FORCE MEASUREMENT TOOL FOR PROCESS CHAMBER C...

STRESS BALANCED ELECTROSTATIC SUBSTRATE CARRIER WITH CONTACTS

SEALING STRUCTURE FOR WORKPIECE TO SUBSTRATE BONDING IN A PROCESSIN...

METHOD OF DICED WAFER TRANSPORTATION

METHOD AND SYSTEM FOR WAFER LEVEL SINGULATION

METHOD OF DICED WAFER TRANSPORTATION

METHOD AND SYSTEM FOR WAFER LEVEL SINGULATION

Method and apparatus for improving sidewall coverage during sputter...

Method and apparatus for improving sidewall coverage during sputter...

Target for use in magnetron sputtering of nickel for forming metall...

Method of producing smooth titanium nitride films having low resist...

Method of enhancing hardness of sputter deposited copper films

SPUTTERING METHOD TO GENERATE IONIZED METAL PLASMA USING ELECTRON B...

Ti/Tinx underlayer which enables a highly <111> ori...