Seshadri Vikram

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Santa Clara, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Thermally enhanced flip chip packaging arrangement
- Patent number 6,770,513
- Issue date Aug 3, 2004
- National Semiconductor Corporation
- Seshadri Vikram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding methods and apparatus for heat sensitive metallization...
- Patent number 6,031,216
- Issue date Feb 29, 2000
- National Semiconductor Corporation
- Inderjit Singh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for doubling back single gauge lead frame
- Patent number 5,969,293
- Issue date Oct 19, 1999
- National Semiconductor Corporation
- Seshadri Vikram
- H01 - BASIC ELECTRIC ELEMENTS