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Seshasayee Ankireddi
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Redwood City, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Structure and method for hybrid optical package with glass top cover
Patent number
10,461,066
Issue date
Oct 29, 2019
Maxim Integrated Products, Inc.
Kumar Nagarajan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dense-luminescent-materials-coated violet LEDs
Patent number
9,761,763
Issue date
Sep 12, 2017
Soraa, Inc.
Frank M. Steranka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hermetic solution for thermal and optical sensor-in-package
Patent number
9,564,569
Issue date
Feb 7, 2017
Maxim Integrated Products, Inc.
Ken Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Heat dissipation structure for an integrated circuit (IC) chip
Patent number
9,355,932
Issue date
May 31, 2016
Oracle International Corporation
Seshasayee S. Ankireddi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Heat dissipation structure for an integrated circuit (IC) chip
Patent number
9,184,108
Issue date
Nov 10, 2015
Oracle International Corporation
Seshasayee S. Ankireddi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Optoelectronic apparatuses with post-molded reflector cups
Patent number
9,065,025
Issue date
Jun 23, 2015
Intersil Americas LLC
Seshasayee S. Ankireddi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Optoelectronic apparatuses with post-molded reflector cups and meth...
Patent number
8,796,052
Issue date
Aug 5, 2014
Intersil Americas LLC
Seshasayee S. Ankireddi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Optoelectronic apparatuses and methods for manufacturing optoelectr...
Patent number
8,564,012
Issue date
Oct 22, 2013
Intersil Americas LLC
Seshasayee S. Ankireddi
G01 - MEASURING TESTING
Information
Patent Grant
Bond pad configurations for semiconductor dies
Patent number
8,558,396
Issue date
Oct 15, 2013
Intersil Americas Inc.
Nikhil Vishwanath Kelkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metallic thermal joint for high power density chips
Patent number
8,368,205
Issue date
Feb 5, 2013
Oracle America, Inc.
Seshasayee Ankireddi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermal and power bus stacked package architecture
Patent number
8,331,094
Issue date
Dec 11, 2012
Oracle International Corporation
Seshasayee Ankireddi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
STRUCTURE AND METHOD FOR HYBRID OPTICAL PACKAGE WITH GLASS TOP COVER
Publication number
20180006003
Publication date
Jan 4, 2018
Maxim Integrated Products, Inc.
KUMAR NAGARAJAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DESIGN OF A HEAT DISSIPATION STRUCTURE FOR AN INTEGRATED CIRCUIT (I...
Publication number
20150357260
Publication date
Dec 10, 2015
Oracle International Corporation
Seshasayee S. Ankireddi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OPTOELECTRONIC APPARATUSES WITH POST-MOLDED REFLECTOR CUPS
Publication number
20140312377
Publication date
Oct 23, 2014
Seshasayee S. Ankireddi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DENSE-LUMINESCENT-MATERIALS-COATED VIOLET LEDS
Publication number
20140175492
Publication date
Jun 26, 2014
Soraa, Inc.
FRANK M. STERANKA
F21 - LIGHTING
Information
Patent Application
OPTOELECTRONIC APPARATUSES WITH POST-MOLDED REFLECTOR CUPS AND METH...
Publication number
20130221380
Publication date
Aug 29, 2013
Intersil Americas Inc.
Seshasayee (Sai) S. Ankireddi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OPTOELECTRONIC APPARATUSES AND METHODS FOR MANUFACTURING OPTOELECTR...
Publication number
20130207126
Publication date
Aug 15, 2013
INTERSIL AMERICAS LLC
Seshasayee (Sai) S. Ankireddi
G01 - MEASURING TESTING
Information
Patent Application
DESIGN OF A HEAT DISSIPATION STRUCTURE FOR AN INTEGRATED CIRCUIT (I...
Publication number
20130148305
Publication date
Jun 13, 2013
Oracle International Corporation
Seshasayee S. Ankireddi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BOND PAD CONFIGURATIONS FOR SEMICONDUCTOR DIES
Publication number
20130015592
Publication date
Jan 17, 2013
Intersil Americas Inc.
Nikhil Vishwanath Kelkar
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMAL AND POWER BUS STACKED PACKAGE ARCHITECTURE
Publication number
20120188708
Publication date
Jul 26, 2012
Oracle International Corporation
SESHASAYEE ANKIREDDI
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METALLIC THERMAL JOINT FOR HIGH POWER DENSITY CHIPS
Publication number
20120153453
Publication date
Jun 21, 2012
ORACLE AMERICA, INC.
Seshasayee Ankireddi
H01 - BASIC ELECTRIC ELEMENTS