Seshasayee Gaddamraja

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Santa Clara, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Hermetic solution for thermal and optical sensor-in-package
- Patent number 9,564,569
- Issue date Feb 7, 2017
- Maxim Integrated Products, Inc.
- Ken Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of chip positioning for multi-chip packaging
- Patent number 9,196,608
- Issue date Nov 24, 2015
- Cypress Semiconductor Corporation
- Sally Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked LED for optical sensor devices
- Patent number 9,136,258
- Issue date Sep 15, 2015
- Maxim Integrated Products, Inc.
- Ken Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip positioning in multi-chip package
- Patent number 8,901,756
- Issue date Dec 2, 2014
- Spansion LLC
- Sally Foong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Chip Positioning in Multi-Chip Package
- Publication number 20140175613
- Publication date Jun 26, 2014
- SPANSION LLC
- Sally FOONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ATTACHMENT, DIE STACKING, AND WIRE EMBEDDING USING FILM
- Publication number 20090001599
- Publication date Jan 1, 2009
- SPANSION LLC
- Sally Foong
- H01 - BASIC ELECTRIC ELEMENTS