Seth L. Knupp

Person

Schenectady, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Ultrathin multilayer metal alloy liner for nano Cu interconnects
- Patent number 11,177,167
- Issue date Nov 16, 2021
- International Business Machines Corporation
- Daniel Edelstein
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Ultrathin multilayer metal alloy liner for nano Cu interconnects
- Patent number 10,643,890
- Issue date May 5, 2020
- International Business Machines Corporation
- Daniel Edelstein
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Epitaxially grown quantum well finFETs for enhanced pFET performance
- Patent number 9,331,073
- Issue date May 3, 2016
- International Business Machines Corporation
- Marc A. Bergendahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer dielectric structures for semiconductor nano-devices
- Patent number 8,981,466
- Issue date Mar 17, 2015
- International Business Machines Corporation
- Alfred Grill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer dielectric structures for semiconductor nano-devices
- Patent number 8,980,715
- Issue date Mar 17, 2015
- International Business Machines Corporation
- Alfred Grill
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ULTRATHIN MULTILAYER METAL ALLOY LINER FOR NANO CU INTERCONNECTS
- Publication number 20160276216
- Publication date Sep 22, 2016
- International Business Machines Corporation
- Daniel Edelstein
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ULTRATHIN MULTILAYER METAL ALLOY LINER FOR NANO CU INTERCONNECTS
- Publication number 20160276280
- Publication date Sep 22, 2016
- International Business Machines Corporation
- Daniel Edelstein
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ULTRATHIN MULTILAYER METAL ALLOY LINER FOR NANO CU INTERCONNECTS
- Publication number 20160268160
- Publication date Sep 15, 2016
- International Business Machines Corporation
- DANIEL EDELSTEIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIALLY GROWN QUANTUM WELL FINFETS FOR ENHANCED PFET PERFORMANCE
- Publication number 20160093613
- Publication date Mar 31, 2016
- International Business Machines Corporation
- Marc A. Bergendahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIALLY GROWN QUANTUM WELL FINFETS FOR ENHANCED PFET PERFORMANCE
- Publication number 20160093697
- Publication date Mar 31, 2016
- International Business Machines Corporation
- Marc A. Bergendahl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ultrathin Multilayer Metal Alloy Liner for Nano Cu Interconnects
- Publication number 20150357236
- Publication date Dec 10, 2015
- International Business Machines Corporation
- Daniel Edelstein
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MULTILAYER DIELECTRIC STRUCTURES FOR SEMICONDUCTOR NANO-DEVICES
- Publication number 20140256153
- Publication date Sep 11, 2014
- International Business Machines Corporation
- Alfred Grill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER DIELECTRIC STRUCTURES FOR SEMICONDUCTOR NANO-DEVICES
- Publication number 20140252502
- Publication date Sep 11, 2014
- International Business Machines Corporation
- Alfred Grill
- H01 - BASIC ELECTRIC ELEMENTS

Seth L. Knupp

Person

Patents Grantslast 30 patents

Ultrathin multilayer metal alloy liner for nano Cu interconnects

Ultrathin multilayer metal alloy liner for nano Cu interconnects

Epitaxially grown quantum well finFETs for enhanced pFET performance

Multilayer dielectric structures for semiconductor nano-devices

Multilayer dielectric structures for semiconductor nano-devices

Patents Applicationslast 30 patents

ULTRATHIN MULTILAYER METAL ALLOY LINER FOR NANO CU INTERCONNECTS

ULTRATHIN MULTILAYER METAL ALLOY LINER FOR NANO CU INTERCONNECTS

ULTRATHIN MULTILAYER METAL ALLOY LINER FOR NANO CU INTERCONNECTS

EPITAXIALLY GROWN QUANTUM WELL FINFETS FOR ENHANCED PFET PERFORMANCE

EPITAXIALLY GROWN QUANTUM WELL FINFETS FOR ENHANCED PFET PERFORMANCE

Ultrathin Multilayer Metal Alloy Liner for Nano Cu Interconnects

MULTILAYER DIELECTRIC STRUCTURES FOR SEMICONDUCTOR NANO-DEVICES

MULTILAYER DIELECTRIC STRUCTURES FOR SEMICONDUCTOR NANO-DEVICES