Seth Prejean

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Austin, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip with redundant thru-silicon-vias
- Patent number 12,094,853
- Issue date Sep 17, 2024
- Advanced Micro Devices, Inc.
- Bryan Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with redundant thru-silicon-vias
- Patent number 11,469,212
- Issue date Oct 11, 2022
- Advanced Micro Devices, Inc.
- Bryan Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with thermal interface tape
- Patent number 9,627,281
- Issue date Apr 18, 2017
- Advanced Micro Device, Inc.
- Seth Prejean
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with redundant thru-silicon-vias
- Patent number 9,437,561
- Issue date Sep 6, 2016
- Advanced Micro Devices, Inc.
- Bryan Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method of detecting IC die cracks
- Patent number 7,649,200
- Issue date Jan 19, 2010
- Advanced Micro Devices, Inc.
- Roy Mark Miller
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS
- Publication number 20230031099
- Publication date Feb 2, 2023
- ADVANCED MICRO DEVICES, INC.
- BRYAN BLACK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS
- Publication number 20160365335
- Publication date Dec 15, 2016
- Bryan Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH REDUNDANT THRU-SILICON-VIAS
- Publication number 20120061821
- Publication date Mar 15, 2012
- Bryan Black
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH THERMAL INTERFACE TAPE
- Publication number 20120043539
- Publication date Feb 23, 2012
- Seth Prejean
- H01 - BASIC ELECTRIC ELEMENTS