Setsuko Hirakawa

Person

  • Tokyo, JP

Patents Grantslast 30 patents

  • Information Patent Grant

    Hardenable epoxy resin composition

    • Patent number 8,426,504
    • Issue date Apr 23, 2013
    • Adeka Corporation
    • Takahiro Mori
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    HARDENABLE EPOXY RESIN COMPOSITION

    • Publication number 20100190899
    • Publication date Jul 29, 2010
    • ADEKA CORPORATION
    • Takahiro Mori
    • C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...