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Setsuko Hirakawa
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Tokyo, JP
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last 30 patents
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Patent Grant
Hardenable epoxy resin composition
Patent number
8,426,504
Issue date
Apr 23, 2013
Adeka Corporation
Takahiro Mori
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
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Patent Application
HARDENABLE EPOXY RESIN COMPOSITION
Publication number
20100190899
Publication date
Jul 29, 2010
ADEKA CORPORATION
Takahiro Mori
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...