TREA

Setsuko J. Cole

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  • Phoenix, AZ, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Planar encapsulation process
    • Patent number 5,596,172
    • Issue date Jan 21, 1997
    • Motorola, Inc.
    • Glenn D. Raskin
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bonding method and apparatus
    • Patent number 4,795,077
    • Issue date Jan 3, 1989
    • Motorola Inc.
    • Harry J. Geyer
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR