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Setsukp Hirakawa
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Tokyo, JP
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last 30 patents
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Patent Application
Highly elastic epoxy resin composition
Publication number
20060173101
Publication date
Aug 3, 2006
ASAHI DENKA CO., LTD.
Yoshinori Takahata
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...