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Setsuo Horimoto
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Katano, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Method of mounting a semiconductor chip on a wiring substrate
Patent number
5,813,115
Issue date
Sep 29, 1998
Matsushita Electric Industrial Co., Ltd.
Yoshihiko Misawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Producing system of printed circuit board and method therefor
Patent number
5,564,183
Issue date
Oct 15, 1996
Matsushita Electric Industrial Co., Ltd.
Kenichi Satou
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Component mounting apparatus
Patent number
5,255,429
Issue date
Oct 26, 1993
Matsushita Electric Industrial Co., Ltd.
Naomi Nishi
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR