Setsuo Yamamoto

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Laser processing apparatus and laser processing method
- Patent number 11,633,804
- Issue date Apr 25, 2023
- Disco Corporation
- Setsuo Yamamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer manufacturing apparatus
- Patent number 11,628,518
- Issue date Apr 18, 2023
- Disco Corporation
- Setsuo Yamamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Porous chuck table
- Patent number 11,315,822
- Issue date Apr 26, 2022
- Disco Corporation
- Setsuo Yamamoto
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Chuck table, cutting apparatus, and method correcting chuck table
- Patent number 11,101,162
- Issue date Aug 24, 2021
- Disco Corporation
- Setsuo Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chuck table and method of manufacturing suction plate of porous cer...
- Patent number 10,532,411
- Issue date Jan 14, 2020
- Disco Corporation
- Setsuo Yamamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of grinding wafer
- Patent number 8,025,556
- Issue date Sep 27, 2011
- Disco Corporation
- Keiichi Kajiyama
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing tool and polishing method and apparatus using same
- Patent number 7,736,215
- Issue date Jun 15, 2010
- Disco Corporation
- Sinnosuke Sekiya
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor wafer processing method
- Patent number 7,731,567
- Issue date Jun 8, 2010
- Disco Corporation
- Shinnosuke Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing tool
- Patent number 7,713,107
- Issue date May 11, 2010
- Disco Corporation
- Sinnosuke Sekiya
- B24 - GRINDING POLISHING
Information Patent Grant
Grinding method for wafer
- Patent number 7,677,955
- Issue date Mar 16, 2010
- Disco Corporation
- Keiichi Kajiyama
- B24 - GRINDING POLISHING
Information Patent Grant
Routing method and system
- Patent number 5,119,317
- Issue date Jun 2, 1992
- Kabushiki Kaisha Toshiba
- Noboru Narikawa
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
LASER PROCESSING APPARATUS
- Publication number 20220331901
- Publication date Oct 20, 2022
- Disco Corporation
- Setsuo Yamamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WAFER MANUFACTURING APPARATUS
- Publication number 20220193826
- Publication date Jun 23, 2022
- Disco Corporation
- Setsuo Yamamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHUCK TABLE AND METHOD OF MANUFACTURING CHUCK TABLE
- Publication number 20210074575
- Publication date Mar 11, 2021
- Disco Corporation
- Setsuo Yamamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POROUS CHUCK TABLE
- Publication number 20200013664
- Publication date Jan 9, 2020
- Disco Corporation
- Setsuo Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHUCK TABLE, CUTTING APPARATUS, AND METHOD CORRECTING CHUCK TABLE
- Publication number 20190273010
- Publication date Sep 5, 2019
- Disco Corporation
- Setsuo YAMAMOTO
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD
- Publication number 20190001433
- Publication date Jan 3, 2019
- Disco Corporation
- Setsuo Yamamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHUCK TABLE AND METHOD OF MANUFACTURING SUCTION PLATE OF POROUS CER...
- Publication number 20180065187
- Publication date Mar 8, 2018
- Disco Corporation
- Setsuo Yamamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Image Recognition Device
- Publication number 20160260299
- Publication date Sep 8, 2016
- NEC Corporation
- Setsuo YAMAMOTO
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD OF GRINDING WAFER
- Publication number 20090186562
- Publication date Jul 23, 2009
- Disco Corporation
- Keiichi Kajiyama
- B24 - GRINDING POLISHING
Information Patent Application
GRINDING APPARATUS AND METHOD OF GRINDING WAFER
- Publication number 20090104858
- Publication date Apr 23, 2009
- Setsuo YAMAMOTO
- B24 - GRINDING POLISHING
Information Patent Application
GRINDING METHOD FOR WAFER
- Publication number 20090098808
- Publication date Apr 16, 2009
- Disco Corporation
- Keiichi Kajiyama
- B24 - GRINDING POLISHING
Information Patent Application
Polishing tool and polishing method and apparatus using same
- Publication number 20080085662
- Publication date Apr 10, 2008
- Sinnosuke Sekiya
- B24 - GRINDING POLISHING
Information Patent Application
Semiconductor wafer processing method
- Publication number 20080076329
- Publication date Mar 27, 2008
- Disco Corporation
- Shinnosuke Sekiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polishing tool and polishing method and apparatus using same
- Publication number 20020173244
- Publication date Nov 21, 2002
- Sinnosuke Sekiya
- B24 - GRINDING POLISHING

Setsuo Yamamoto

Person

Patents Grantslast 30 patents

Laser processing apparatus and laser processing method

Wafer manufacturing apparatus

Porous chuck table

Chuck table, cutting apparatus, and method correcting chuck table

Chuck table and method of manufacturing suction plate of porous cer...

Method of grinding wafer

Polishing tool and polishing method and apparatus using same

Semiconductor wafer processing method

Polishing tool

Grinding method for wafer

Routing method and system

Patents Applicationslast 30 patents

LASER PROCESSING APPARATUS

WAFER MANUFACTURING APPARATUS

CHUCK TABLE AND METHOD OF MANUFACTURING CHUCK TABLE

POROUS CHUCK TABLE

CHUCK TABLE, CUTTING APPARATUS, AND METHOD CORRECTING CHUCK TABLE

LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD

CHUCK TABLE AND METHOD OF MANUFACTURING SUCTION PLATE OF POROUS CER...

Image Recognition Device

METHOD OF GRINDING WAFER

GRINDING APPARATUS AND METHOD OF GRINDING WAFER

GRINDING METHOD FOR WAFER

Polishing tool and polishing method and apparatus using same

Semiconductor wafer processing method

Polishing tool and polishing method and apparatus using same