Seung Dae Seok

Person

Yongin-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Die pickup module and die bonding apparatus including the same
- Patent number 12,090,642
- Issue date Sep 17, 2024
- Semes Co., Ltd.
- Chang Bu Jeong
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Die pickup module and die bonding apparatus including the same
- Patent number 11,600,515
- Issue date Mar 7, 2023
- Semes Co., Ltd.
- Chang Bu Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding stage and bonding apparatus comprising the same
- Patent number 10,058,952
- Issue date Aug 28, 2018
- Samsung Electronics Co., Ltd.
- Seung-Dae Seok
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding head and die bonding apparatus having the same
- Patent number 9,620,476
- Issue date Apr 11, 2017
- Semes Co., Ltd.
- Hang Lim Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatuses comprising bonding heads
- Patent number 9,508,577
- Issue date Nov 29, 2016
- Samsung Electronics Co., Ltd.
- Byung Joon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for bonding semiconductor chips
- Patent number 9,431,365
- Issue date Aug 30, 2016
- Samsung Electronics Co., Ltd.
- Seung-dae Seok
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Bonding Stage and Bonding Apparatus Comprising the Same
- Publication number 20170136570
- Publication date May 18, 2017
- Samsung Electronics Co., Ltd.
- Seung Dae Seok
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR BONDING SEMICONDUCTOR CHIPS
- Publication number 20160079199
- Publication date Mar 17, 2016
- Seung-dae SEOK
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUSES AND METHODS THEREOF
- Publication number 20150155210
- Publication date Jun 4, 2015
- Samsung Electronics Co., Ltd.
- Byung Joon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING HEAD AND DIE BONDING APPARATUS HAVING THE SAME
- Publication number 20150129135
- Publication date May 14, 2015
- SEMES CO., LTD.
- Hang Lim LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING APPARATUS
- Publication number 20130248114
- Publication date Sep 26, 2013
- Samsung Electronics Co., Ltd.
- Seung Dae SEOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP BONDING APPARATUS AND CHIP BONDING METHOD USING THE SAME
- Publication number 20130139380
- Publication date Jun 6, 2013
- Samsung Electronics Co., Ltd.
- Byung Joon LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer bonding apparatus
- Publication number 20100071847
- Publication date Mar 25, 2010
- SAMSUNG ELECTRONICS CO., LTD.
- Jae Bong Shin
- H01 - BASIC ELECTRIC ELEMENTS

Seung Dae Seok

Person

Patents Grantslast 30 patents

Die pickup module and die bonding apparatus including the same

Die pickup module and die bonding apparatus including the same

Bonding stage and bonding apparatus comprising the same

Bonding head and die bonding apparatus having the same

Semiconductor manufacturing apparatuses comprising bonding heads

Apparatus for bonding semiconductor chips

Patents Applicationslast 30 patents

Bonding Stage and Bonding Apparatus Comprising the Same

APPARATUS FOR BONDING SEMICONDUCTOR CHIPS

SEMICONDUCTOR MANUFACTURING APPARATUSES AND METHODS THEREOF

BONDING HEAD AND DIE BONDING APPARATUS HAVING THE SAME

CHIP BONDING APPARATUS

CHIP BONDING APPARATUS AND CHIP BONDING METHOD USING THE SAME

Wafer bonding apparatus