Seung-jin CHEON

Follow

Person

Asan-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for fabricating semiconductor packages
- Patent number 7,824,585
- Issue date Nov 2, 2010
- Samsung Electronics Co., Ltd.
- Seung-Jin Cheon
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
MOLDING APPARATUS FOR SEMICONDUCTOR PACKAGE FABRICATION AND METHOD...
- Publication number 20170136669
- Publication date May 18, 2017
- Samsung Electronics Co., Ltd.
- Kwang won Choi
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
BALL BOX AND SOLDER BALL ATTACHMENT APPARATUS HAVING THE SAME
- Publication number 20170129032
- Publication date May 11, 2017
- Samsung Electronics Co., Ltd.
- Young-bok KIM
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB FOR MUF AND MOLDING STRUCTURE OF THE PCB
- Publication number 20130161800
- Publication date Jun 27, 2013
- Samsung Electronics Co., Ltd.
- Hak-kyoon BYUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for fabricating semiconductor packages
- Publication number 20080038848
- Publication date Feb 14, 2008
- SAMSUNG ELECTRONICS CO., LTD.
- Seung-Jin Cheon
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL