Seung-Seob Kim

Person

Kyunggi-Do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packaging system with step mold and method of ma...
- Patent number 8,633,058
- Issue date Jan 21, 2014
- Stats Chippac Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package system with through silicon via interposer
- Patent number 8,063,475
- Issue date Nov 22, 2011
- Stats Chippac Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system having an internal structure pr...
- Patent number 7,994,625
- Issue date Aug 9, 2011
- Stats Chippac Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of connecting a shielding layer to...
- Patent number 7,851,893
- Issue date Dec 14, 2010
- STATS ChipPAC, Ltd.
- Seung Won Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for opening and detaching a panel
- Patent number 5,938,249
- Issue date Aug 17, 1999
- Daewoo Electronics Co., Ltd.
- Seung-Seob Kim
- G11 - INFORMATION STORAGE
Information Patent Grant
Device for moving and detaching a panel
- Patent number 5,862,468
- Issue date Jan 19, 1999
- Daewoo Electronics Co., Ltd.
- Seung-Seob Kim
- G11 - INFORMATION STORAGE
Information Patent Grant
Panel opening and closing apparatus
- Patent number 5,762,412
- Issue date Jun 9, 1998
- Daewoo Electronics Co., Ltd.
- Seung-Seob Kim
- G11 - INFORMATION STORAGE
Information Patent Grant
Caption VCR and method of displaying a caption signal in the captio...
- Patent number 5,299,006
- Issue date Mar 29, 1994
- Seung K. Kim
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STEP MOLD AND METHOD OF MA...
- Publication number 20120241979
- Publication date Sep 27, 2012
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING AN INTERNAL STRUCTURE PR...
- Publication number 20100123232
- Publication date May 20, 2010
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SYSTEM WITH THROUGH SILICON VIA INTERPOSER
- Publication number 20100078789
- Publication date Apr 1, 2010
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Connecting a Shielding Layer to...
- Publication number 20090302437
- Publication date Dec 10, 2009
- STATS ChipPAC, Ltd.
- Seung Won Kim
- H01 - BASIC ELECTRIC ELEMENTS

Seung-Seob Kim

Person

Patents Grantslast 30 patents

Integrated circuit packaging system with step mold and method of ma...

Semiconductor package system with through silicon via interposer

Integrated circuit packaging system having an internal structure pr...

Semiconductor device and method of connecting a shielding layer to...

Apparatus for opening and detaching a panel

Device for moving and detaching a panel

Panel opening and closing apparatus

Caption VCR and method of displaying a caption signal in the captio...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STEP MOLD AND METHOD OF MA...

INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING AN INTERNAL STRUCTURE PR...

SEMICONDUCTOR PACKAGE SYSTEM WITH THROUGH SILICON VIA INTERPOSER

Semiconductor Device and Method of Connecting a Shielding Layer to...