Seung Wan Woo

Person

Suwon, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Printed circuit board having embedded electronic device and method...
- Patent number 9,504,169
- Issue date Nov 22, 2016
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Young Nam Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System of measuring warpage and method of measuring warpage
- Patent number 9,470,635
- Issue date Oct 18, 2016
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Seung Wan Woo
- G01 - MEASURING TESTING
Information Patent Grant
Method for manufacturing semiconductor package
- Patent number 9,171,780
- Issue date Oct 27, 2015
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yee Na Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package
- Patent number 9,155,192
- Issue date Oct 6, 2015
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Kyung Ho Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20150380276
- Publication date Dec 31, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Yee Na SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20150147849
- Publication date May 28, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Yee Na SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC DEVICE AND METHOD...
- Publication number 20150014034
- Publication date Jan 15, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Young Nam Hwang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
IMAGE SENSOR MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140374870
- Publication date Dec 25, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Kyung Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CALIBRATION BLOCK FOR MEASURING WARPAGE, WARPAGE MEASURING APPARATU...
- Publication number 20140354797
- Publication date Dec 4, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Seung Wan Woo
- G01 - MEASURING TESTING
Information Patent Application
SYSTEM OF MEASURING WARPAGE AND METHOD OF MEASURING WARPAGE
- Publication number 20140184782
- Publication date Jul 3, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Seung Wan WOO
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONIC COMPONENT PACKAGE
- Publication number 20140146498
- Publication date May 29, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Kyung Ho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20140145322
- Publication date May 29, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Young Nam Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATION LAYER TYPE SEMICONDUCTOR PACKAGE
- Publication number 20140145323
- Publication date May 29, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Kyung Ho LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM OF MEASURING WARPAGE AND METHOD OF MEASURING WARPAGE
- Publication number 20140104417
- Publication date Apr 17, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Seung Wan WOO
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20140061891
- Publication date Mar 6, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Po Chul KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR MEASURING WARPAGE CHARACTERISTIC OF SPECIMEN
- Publication number 20130100460
- Publication date Apr 25, 2013
- SAMSUNG ELECTRO-MECHANICS CO.,LTD.
- Seung Wan WOO
- G01 - MEASURING TESTING

Seung Wan Woo

Person

Patents Grantslast 30 patents

Printed circuit board having embedded electronic device and method...

System of measuring warpage and method of measuring warpage

Method for manufacturing semiconductor package

Electronic component package

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

PRINTED CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC DEVICE AND METHOD...

IMAGE SENSOR MODULE AND METHOD OF MANUFACTURING THE SAME

CALIBRATION BLOCK FOR MEASURING WARPAGE, WARPAGE MEASURING APPARATU...

SYSTEM OF MEASURING WARPAGE AND METHOD OF MEASURING WARPAGE

ELECTRONIC COMPONENT PACKAGE

ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME

LAMINATION LAYER TYPE SEMICONDUCTOR PACKAGE

SYSTEM OF MEASURING WARPAGE AND METHOD OF MEASURING WARPAGE

SEMICONDUCTOR CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

APPARATUS FOR MEASURING WARPAGE CHARACTERISTIC OF SPECIMEN