Seung Wook Yoon

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with encapsulant deposited along sides and sur...
- Patent number 12,094,729
- Issue date Sep 17, 2024
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of making a wafer-level chip-scale...
- Patent number 11,961,764
- Issue date Apr 16, 2024
- STATS ChipPAC Pte. Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming encapsulated wafer level...
- Patent number 11,257,729
- Issue date Feb 22, 2022
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with encapsulant deposited along sides and sur...
- Patent number 11,222,793
- Issue date Jan 11, 2022
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of using a standardized carrier in...
- Patent number 11,011,423
- Issue date May 18, 2021
- STATS ChipPAC Pte. Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming inductor over insulating...
- Patent number 10,903,304
- Issue date Jan 26, 2021
- STATS ChipPAC Pte. Ltd.
- Meenakshi Padmanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interposer frame over se...
- Patent number RE48111
- Issue date Jul 21, 2020
- JCET Semiconductor (Shaoxing) Co. Ltd.
- Reza A. Pagaila
Information Patent Grant
Semiconductor device and method of forming EMI shielding layer with...
- Patent number 10,643,952
- Issue date May 5, 2020
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming a low profile embedded...
- Patent number 10,622,293
- Issue date Apr 14, 2020
- JCET Semiconductor (Shaoxing) Co., Ltd.
- Seung Wook Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of depositing encapsulant along sides and surface edge of se...
- Patent number 10,515,828
- Issue date Dec 24, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a vertical interconnect...
- Patent number 10,475,779
- Issue date Nov 12, 2019
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming encapsulated wafer level...
- Patent number 10,446,459
- Issue date Oct 15, 2019
- STATS ChipPAC Pte. Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of using a standardized carrier in...
- Patent number 10,181,423
- Issue date Jan 15, 2019
- STATS ChipPAC Pte. Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interposer frame over se...
- Patent number 9,893,045
- Issue date Feb 13, 2018
- STATS ChipPAC Pte. Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a vertical interconnect...
- Patent number 9,768,155
- Issue date Sep 19, 2017
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming TSV semiconductor wafer...
- Patent number 9,754,858
- Issue date Sep 5, 2017
- STATS ChipPAC Pte. Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming encapsulated wafer level...
- Patent number 9,704,769
- Issue date Jul 11, 2017
- STATS ChipPAC Pte. Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming inductor over insulating...
- Patent number 9,640,603
- Issue date May 2, 2017
- STATS ChipPAC Pte. Ltd.
- Meenakshi Padmanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of using a standardized carrier in...
- Patent number 9,620,413
- Issue date Apr 11, 2017
- STATS ChipPAC Pte. Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of depositing encapsulant along sid...
- Patent number 9,496,195
- Issue date Nov 15, 2016
- STATS ChipPAC Pte. Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming EMI shielding layer with...
- Patent number 9,484,279
- Issue date Nov 1, 2016
- STATS ChipPAC Pte. Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for forming a low profile embedded...
- Patent number 9,293,401
- Issue date Mar 22, 2016
- STATS ChipPAC, Ltd.
- Seung Wook Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interposer frame over se...
- Patent number 9,240,380
- Issue date Jan 19, 2016
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of forming TSV interposer with semi...
- Patent number 9,224,647
- Issue date Dec 29, 2015
- STATS ChipPAC, Ltd.
- Jun Mo Koo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming TMV and TSV in WLCSP usi...
- Patent number 9,224,693
- Issue date Dec 29, 2015
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a vertical interconnect...
- Patent number 9,064,936
- Issue date Jun 23, 2015
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of bonding different size semicondu...
- Patent number 8,993,377
- Issue date Mar 31, 2015
- STATS ChipPAC, Ltd.
- Jun Mo Koo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with embedded circuitry and post
- Patent number 8,957,530
- Issue date Feb 17, 2015
- Stats Chippac Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming different height conduct...
- Patent number 8,896,109
- Issue date Nov 25, 2014
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming TMV and TSV in WLCSP usi...
- Patent number 8,822,281
- Issue date Sep 2, 2014
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device with Encapsulant Deposited Along Sides and Sur...
- Publication number 20220093417
- Publication date Mar 24, 2022
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Using a Standardized Carrier in...
- Publication number 20210233815
- Publication date Jul 29, 2021
- STATS ChipPAC Pte Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Encapsulant Deposited Along Sides and Sur...
- Publication number 20200090954
- Publication date Mar 19, 2020
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Encapsulated Wafer Level...
- Publication number 20200006177
- Publication date Jan 2, 2020
- STATS ChipPAC Pte Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Using a Standardized Carrier in...
- Publication number 20190109048
- Publication date Apr 11, 2019
- STATS ChipPAC Pte Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Vertical Interconnect...
- Publication number 20180026023
- Publication date Jan 25, 2018
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Encapsulated Wafer Level...
- Publication number 20170278765
- Publication date Sep 28, 2017
- STATS ChipPAC Pte Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Inductor Over Insulating...
- Publication number 20170186690
- Publication date Jun 29, 2017
- STATS ChipPAC Pte Ltd.
- Meenakshi Padmanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Using a Standardized Carrier in...
- Publication number 20170133270
- Publication date May 11, 2017
- STATS ChipPAC Pte Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming EMI Shielding Layer with...
- Publication number 20170018507
- Publication date Jan 19, 2017
- STATS ChipPAC Pte Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Depositing Encapsulant Along Sid...
- Publication number 20170011936
- Publication date Jan 12, 2017
- STATS ChipPAC Pte Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Forming a Low Profile Embedded...
- Publication number 20160141238
- Publication date May 19, 2016
- STATS ChipPAC, Ltd.
- Seung Wook Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Interposer Frame Over Se...
- Publication number 20160111410
- Publication date Apr 21, 2016
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Vertical Interconnect...
- Publication number 20150287708
- Publication date Oct 8, 2015
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Encapsulated Wafer Level...
- Publication number 20150243575
- Publication date Aug 27, 2015
- STATS ChipPAC, Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Inductor Over Insulating...
- Publication number 20140327107
- Publication date Nov 6, 2014
- Meenakshi Padmanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Interposer Frame Over Se...
- Publication number 20140327145
- Publication date Nov 6, 2014
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming TMV and TSV in WLCSP Usi...
- Publication number 20140319678
- Publication date Oct 30, 2014
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Depositing Encapsulant Along Sid...
- Publication number 20140091482
- Publication date Apr 3, 2014
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Using a Standardized Carrier in...
- Publication number 20140091455
- Publication date Apr 3, 2014
- STATS ChipPAC, Ltd.
- Thomas J. Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming TSV Semiconductor Wafer...
- Publication number 20130292851
- Publication date Nov 7, 2013
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method for Forming a Low Profile Embedded...
- Publication number 20130228917
- Publication date Sep 5, 2013
- STATS ChipPAC, Ltd.
- Seung Wook Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a Vertical Interconnect...
- Publication number 20130200528
- Publication date Aug 8, 2013
- STATS ChipPAC, Ltd.
- Yaojian Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Interposer Frame Over Se...
- Publication number 20130105989
- Publication date May 2, 2013
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Different Height Conduct...
- Publication number 20130075903
- Publication date Mar 28, 2013
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Bonding Different Size Semicondu...
- Publication number 20120074587
- Publication date Mar 29, 2012
- STATS ChipPAC, Ltd.
- Jun Mo Koo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming TSV Interposer With Semi...
- Publication number 20120074585
- Publication date Mar 29, 2012
- STATS ChipPAC, Ltd.
- Jun Mo Koo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Interposer Frame Over Se...
- Publication number 20120056329
- Publication date Mar 8, 2012
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device and Method of Forming TSV Semiconductor Wafer...
- Publication number 20120056312
- Publication date Mar 8, 2012
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Different Height Conduct...
- Publication number 20120056316
- Publication date Mar 8, 2012
- STATS ChipPAC, Ltd.
- Reza A. Pagaila
- H01 - BASIC ELECTRIC ELEMENTS

Seung Wook Yoon

Person

Patents Grantslast 30 patents

Semiconductor device with encapsulant deposited along sides and sur...

Semiconductor device and method of making a wafer-level chip-scale...

Semiconductor device and method of forming encapsulated wafer level...

Semiconductor device with encapsulant deposited along sides and sur...

Semiconductor device and method of using a standardized carrier in...

Semiconductor device and method of forming inductor over insulating...

Semiconductor device and method of forming interposer frame over se...

Semiconductor device and method of forming EMI shielding layer with...

Semiconductor device and method for forming a low profile embedded...

Method of depositing encapsulant along sides and surface edge of se...

Semiconductor device and method of forming a vertical interconnect...

Semiconductor device and method of forming encapsulated wafer level...

Semiconductor device and method of using a standardized carrier in...

Semiconductor device and method of forming interposer frame over se...

Semiconductor device and method of forming a vertical interconnect...

Semiconductor device and method of forming TSV semiconductor wafer...

Semiconductor device and method of forming encapsulated wafer level...

Semiconductor device and method of forming inductor over insulating...

Semiconductor device and method of using a standardized carrier in...

Semiconductor device and method of depositing encapsulant along sid...

Semiconductor device and method of forming EMI shielding layer with...

Semiconductor device and method for forming a low profile embedded...

Semiconductor device and method of forming interposer frame over se...

Semiconductor device and method of forming TSV interposer with semi...

Semiconductor device and method of forming TMV and TSV in WLCSP usi...

Semiconductor device and method of forming a vertical interconnect...

Semiconductor device and method of bonding different size semicondu...

Integrated circuit packaging system with embedded circuitry and post

Semiconductor device and method of forming different height conduct...

Semiconductor device and method of forming TMV and TSV in WLCSP usi...

Patents Applicationslast 30 patents

Semiconductor Device with Encapsulant Deposited Along Sides and Sur...

Semiconductor Device and Method of Using a Standardized Carrier in...

Semiconductor Device with Encapsulant Deposited Along Sides and Sur...

Semiconductor Device and Method of Forming Encapsulated Wafer Level...

Semiconductor Device and Method of Using a Standardized Carrier in...

Semiconductor Device and Method of Forming a Vertical Interconnect...

Semiconductor Device and Method of Forming Encapsulated Wafer Level...

Semiconductor Device and Method of Forming Inductor Over Insulating...

Semiconductor Device and Method of Using a Standardized Carrier in...

Semiconductor Device and Method of Forming EMI Shielding Layer with...

Semiconductor Device and Method of Depositing Encapsulant Along Sid...

Semiconductor Device and Method for Forming a Low Profile Embedded...

Semiconductor Device and Method of Forming Interposer Frame Over Se...

Semiconductor Device and Method of Forming a Vertical Interconnect...

Semiconductor Device and Method of Forming Encapsulated Wafer Level...

Semiconductor Device and Method of Forming Inductor Over Insulating...

Semiconductor Device and Method of Forming Interposer Frame Over Se...

Semiconductor Device and Method of Forming TMV and TSV in WLCSP Usi...

Semiconductor Device and Method of Depositing Encapsulant Along Sid...

Semiconductor Device and Method of Using a Standardized Carrier in...

Semiconductor Device and Method of Forming TSV Semiconductor Wafer...

Semiconductor Device and Method for Forming a Low Profile Embedded...

Semiconductor Device and Method of Forming a Vertical Interconnect...

Semiconductor Device and Method of Forming Interposer Frame Over Se...

Semiconductor Device and Method of Forming Different Height Conduct...

Semiconductor Device and Method of Bonding Different Size Semicondu...

Semiconductor Device and Method of Forming TSV Interposer With Semi...

Semiconductor Device and Method of Forming Interposer Frame Over Se...

Semiconductor Device and Method of Forming TSV Semiconductor Wafer...

Semiconductor Device and Method of Forming Different Height Conduct...