Seung Yeop KOOK

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Image encoder and decoder using unidirectional prediction
- Patent number 12,177,453
- Issue date Dec 24, 2024
- Electronics and Telecommunications Research Institute
- Hae Chul Choi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image encoder and decoder using unidirectional prediction
- Patent number 11,882,292
- Issue date Jan 23, 2024
- Electronics and Telecommunications Research Institute
- Hae Chul Choi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image encoder and decoder using unidirectional prediction
- Patent number 11,683,502
- Issue date Jun 20, 2023
- Electronics and Telecommunications Research Institute
- Hae Chul Choi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Fan-out semiconductor package and electronic device including the same
- Patent number 11,626,364
- Issue date Apr 11, 2023
- Samsung Electronics Co., Ltd.
- Sun Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image encoder and decoder using unidirectional prediction
- Patent number 10,917,647
- Issue date Feb 9, 2021
- Electronics and Telecommunications Research Institute
- Hae Chul Choi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Fan-out semiconductor package and electronic device including the same
- Patent number 10,861,784
- Issue date Dec 8, 2020
- Samsung Electronics Co., Ltd.
- Sun Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image encoder and decoder using unidirectional prediction
- Patent number 10,742,996
- Issue date Aug 11, 2020
- Electronics and Telecommunications Research Institute
- Hae Chul Choi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Printed circuit board including sub-circuit board
- Patent number 10,701,806
- Issue date Jun 30, 2020
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yong-Ho Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package and electronic device including the same
- Patent number 10,679,933
- Issue date Jun 9, 2020
- Samsung Electronics Co., Ltd.
- Sun Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image encoder and decoder using unidirectional prediction
- Patent number 10,638,138
- Issue date Apr 28, 2020
- Electronics and Telecommunications Research Institute
- Hae Chul Choi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Printed circuit board including sub-circuit board
- Patent number 10,477,683
- Issue date Nov 12, 2019
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yong-Ho Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package having stress alleviation structure
- Patent number 10,461,008
- Issue date Oct 29, 2019
- Samsung Electronics Co., Ltd.
- Sung Won Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package and electronic device including the same
- Patent number 10,446,481
- Issue date Oct 15, 2019
- Samsung Electronics Co., Ltd.
- Sun Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package and method of manufacturing same
- Patent number 10,388,614
- Issue date Aug 20, 2019
- Samsung Electronics Co., Ltd.
- Ji Hyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image encoder and decoder using unidirectional prediction
- Patent number 10,321,137
- Issue date Jun 11, 2019
- Electronics and Telecommunications Research Institute
- Hae Chul Choi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Substrate for camera module and camera module having the same
- Patent number 10,270,948
- Issue date Apr 23, 2019
- Samsung Electro-Mechanics Co., Ltd.
- Seung Eun Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image encoder and decoder using unidirectional prediction
- Patent number 10,178,393
- Issue date Jan 8, 2019
- Electronics and Telecommunications Research Institute
- Hae Chul Choi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Fan-out semiconductor package and electronic device including the same
- Patent number 10,128,179
- Issue date Nov 13, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Sun Ho Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package and electronic device including the same
- Patent number 10,115,648
- Issue date Oct 30, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Shang Hoon Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package and method of manufacturing same
- Patent number 10,062,652
- Issue date Aug 28, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Ji Hyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image encoder and decoder using unidirectional prediction
- Patent number 9,942,554
- Issue date Apr 10, 2018
- Electronics and Telecommunications Research Institute
- Hae Chul Choi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Electronic component package and electronic device including the same
- Patent number 9,929,117
- Issue date Mar 27, 2018
- SAMSUNG ELECTRO-MACHANICS CO., LTD.
- Ji Hyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package and electronic device including the same
- Patent number 9,859,243
- Issue date Jan 2, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Ji Hyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board and method of manufacturing the same
- Patent number 9,839,126
- Issue date Dec 5, 2017
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Myung Sam Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board, electronic component and method of manufacturing cir...
- Patent number 9,832,885
- Issue date Nov 28, 2017
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Myung Sam Kang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Electronic component package and electronic device including the same
- Patent number 9,831,203
- Issue date Nov 28, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Ji Hyun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coreless board for semiconductor package, method of manufacturing t...
- Patent number 9,420,709
- Issue date Aug 16, 2016
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Young Kwan Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Image encoder and decoder using undirectional prediction
- Patent number 9,407,937
- Issue date Aug 2, 2016
- Electronics and Telecommunications Research Institute
- Hae Chul Choi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image encoder and decoder using undirectional prediction
- Patent number 9,369,737
- Issue date Jun 14, 2016
- Electronics and Telecommunications Research Institute
- Hae Chul Choi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image encoder and decoder using undirectional prediction
- Patent number 9,332,282
- Issue date May 3, 2016
- Electronics and Telecommunications Research Institute
- Hae Chul Choi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
IMAGE ENCODER AND DECODER USING UNIDIRECTIONAL PREDICTION
- Publication number 20240107032
- Publication date Mar 28, 2024
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Hae Chul CHOI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IMAGE ENCODER AND DECODER USING UNIDIRECTIONAL PREDICTION
- Publication number 20230276058
- Publication date Aug 31, 2023
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Hae Chul CHOI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20230268266
- Publication date Aug 24, 2023
- Samsung Electronics Co., Ltd.
- Sun Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE ENCODER AND DECODER USING UNIDIRECTIONAL PREDICTION
- Publication number 20220159270
- Publication date May 19, 2022
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Hae Chul CHOI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IMAGE ENCODER AND DECODER USING UNIDIRECTIONAL PREDICTION
- Publication number 20210127121
- Publication date Apr 29, 2021
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Hae Chul CHOI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20210118791
- Publication date Apr 22, 2021
- Samsung Electronics Co., Ltd.
- Sun Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20200294904
- Publication date Sep 17, 2020
- Samsung Electronics Co., Ltd.
- Sun Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE ENCODER AND DECODER USING UNIDIRECTIONAL PREDICTION
- Publication number 20200221101
- Publication date Jul 9, 2020
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Hae Chul CHOI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20200043842
- Publication date Feb 6, 2020
- Samsung Electronics Co., Ltd.
- Sun Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD INCLUDING SUB-CIRCUIT BOARD
- Publication number 20200029435
- Publication date Jan 23, 2020
- Samsung Electro-Mechanics Co., Ltd.
- Yong-Ho BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE ENCODER AND DECODER USING UNIDIRECTIONAL PREDICTION
- Publication number 20190281305
- Publication date Sep 12, 2019
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Hae Chul CHOI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IMAGE ENCODER AND DECODER USING UNIDIRECTIONAL PREDICTION
- Publication number 20190261004
- Publication date Aug 22, 2019
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Hae Chul CHOI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20180342452
- Publication date Nov 29, 2018
- Samsung Electro-Mechanics Co., Ltd.
- Sun Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20180197827
- Publication date Jul 12, 2018
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Ji Hyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20170358548
- Publication date Dec 14, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Ji Hyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR CAMERA MODULE AND CAMERA MODULE HAVING THE SAME
- Publication number 20170294469
- Publication date Oct 12, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Seung Eun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20170271272
- Publication date Sep 21, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Ji Hyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD
- Publication number 20170202083
- Publication date Jul 13, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Yong-Ho BAEK
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT PACKAGE
- Publication number 20170178992
- Publication date Jun 22, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Sung Won JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20170148699
- Publication date May 25, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Shang Hoon SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20170141063
- Publication date May 18, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Ji Hyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME
- Publication number 20170133309
- Publication date May 11, 2017
- Samsung Electro-Mechanics Co., Ltd.
- Sun Ho KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE ENCODER AND DECODER USING UNIDIRECTIONAL PREDICTION
- Publication number 20170026642
- Publication date Jan 26, 2017
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Hae Chul CHOI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IMAGE ENCODER AND DECODER USING UNIDIRECTIONAL PREDICTION
- Publication number 20170026652
- Publication date Jan 26, 2017
- ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Hae Chul CHOI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IMAGE ENCODER AND DECODER USING UNIDIRECTIONAL PREDICTION
- Publication number 20160309146
- Publication date Oct 20, 2016
- Electronics and Telecommunications Research Institute.
- Hae Chul CHOI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PRINTED CIRCUIT BOARD, ELECTRONIC COMPONENT MODULE AND METHOD OF MA...
- Publication number 20160302308
- Publication date Oct 13, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Jeong Ho LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160050752
- Publication date Feb 18, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Myung Sam KANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160050755
- Publication date Feb 18, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Myung Sam KANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20160007467
- Publication date Jan 7, 2016
- Samsung Electro-Mechanics Co., Ltd.
- Seung-Eun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Publication number 20150366059
- Publication date Dec 17, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Seung Eun LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Seung Yeop KOOK

Person

Patents Grantslast 30 patents

Image encoder and decoder using unidirectional prediction

Image encoder and decoder using unidirectional prediction

Image encoder and decoder using unidirectional prediction

Fan-out semiconductor package and electronic device including the same

Image encoder and decoder using unidirectional prediction

Fan-out semiconductor package and electronic device including the same

Image encoder and decoder using unidirectional prediction

Printed circuit board including sub-circuit board

Fan-out semiconductor package and electronic device including the same

Image encoder and decoder using unidirectional prediction

Printed circuit board including sub-circuit board

Electronic component package having stress alleviation structure

Fan-out semiconductor package and electronic device including the same

Fan-out semiconductor package and method of manufacturing same

Image encoder and decoder using unidirectional prediction

Substrate for camera module and camera module having the same

Image encoder and decoder using unidirectional prediction

Fan-out semiconductor package and electronic device including the same

Fan-out semiconductor package and electronic device including the same

Fan-out semiconductor package and method of manufacturing same

Image encoder and decoder using unidirectional prediction

Electronic component package and electronic device including the same

Electronic component package and electronic device including the same

Printed circuit board and method of manufacturing the same

Circuit board, electronic component and method of manufacturing cir...

Electronic component package and electronic device including the same

Coreless board for semiconductor package, method of manufacturing t...

Image encoder and decoder using undirectional prediction

Image encoder and decoder using undirectional prediction

Image encoder and decoder using undirectional prediction

Patents Applicationslast 30 patents

IMAGE ENCODER AND DECODER USING UNIDIRECTIONAL PREDICTION

IMAGE ENCODER AND DECODER USING UNIDIRECTIONAL PREDICTION

FAN-OUT SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME

IMAGE ENCODER AND DECODER USING UNIDIRECTIONAL PREDICTION

IMAGE ENCODER AND DECODER USING UNIDIRECTIONAL PREDICTION

FAN-OUT SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME

FAN-OUT SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME

IMAGE ENCODER AND DECODER USING UNIDIRECTIONAL PREDICTION

FAN-OUT SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME

PRINTED CIRCUIT BOARD INCLUDING SUB-CIRCUIT BOARD

IMAGE ENCODER AND DECODER USING UNIDIRECTIONAL PREDICTION

IMAGE ENCODER AND DECODER USING UNIDIRECTIONAL PREDICTION

FAN-OUT SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME

FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

ELECTRONIC COMPONENT PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME

SUBSTRATE FOR CAMERA MODULE AND CAMERA MODULE HAVING THE SAME

FAN-OUT SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

PRINTED CIRCUIT BOARD

ELECTRONIC COMPONENT PACKAGE

FAN-OUT SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME

ELECTRONIC COMPONENT PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME

FAN-OUT SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE INCLUDING THE SAME

IMAGE ENCODER AND DECODER USING UNIDIRECTIONAL PREDICTION

IMAGE ENCODER AND DECODER USING UNIDIRECTIONAL PREDICTION

IMAGE ENCODER AND DECODER USING UNIDIRECTIONAL PREDICTION

PRINTED CIRCUIT BOARD, ELECTRONIC COMPONENT MODULE AND METHOD OF MA...

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME