Seunggeol Ryu

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal interface material, method of manufacturing the same, and s...
- Patent number 12,243,803
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Seunggeol Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit semiconductor device
- Patent number 12,237,268
- Issue date Feb 25, 2025
- Samsung Electronics Co., Ltd.
- Jaechoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit semiconductor device
- Patent number 12,009,303
- Issue date Jun 11, 2024
- Samsung Electronics Co., Ltd.
- Jaechoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material and semiconductor packages including the...
- Patent number 11,935,812
- Issue date Mar 19, 2024
- Samsung Electronics Co., Ltd.
- Seunggeol Ryu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE
- Publication number 20250157930
- Publication date May 15, 2025
- Samsung Electronics Co., Ltd.
- Jaechoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE
- Publication number 20240290720
- Publication date Aug 29, 2024
- Samsung Electronics Co., Ltd.
- Jaechoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL, METHOD OF MANUFACTURING THE SAME, AND S...
- Publication number 20240186215
- Publication date Jun 6, 2024
- Samsung Electronics Co., Ltd.
- Seunggeol Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM PACKAGE
- Publication number 20230178450
- Publication date Jun 8, 2023
- Samsung Electronics Co., Ltd.
- Sungeun JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND COOLING SYSTEM
- Publication number 20230124783
- Publication date Apr 20, 2023
- Samsung Electronics Co., Ltd.
- JAECHOON KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230060513
- Publication date Mar 2, 2023
- Samsung Electronics Co., Ltd.
- KIWOOK JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE
- Publication number 20220130761
- Publication date Apr 28, 2022
- Samsung Electronics Co., Ltd.
- Jaechoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL, METHOD OF MANUFACTURING THE SAME, AND S...
- Publication number 20220037227
- Publication date Feb 3, 2022
- Seunggeol Ryu
- H01 - BASIC ELECTRIC ELEMENTS

Seunggeol Ryu

Person

Patents Grantslast 30 patents

Thermal interface material, method of manufacturing the same, and s...

Integrated circuit semiconductor device

Integrated circuit semiconductor device

Thermal interface material and semiconductor packages including the...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE

INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE

THERMAL INTERFACE MATERIAL, METHOD OF MANUFACTURING THE SAME, AND S...

FILM PACKAGE

SEMICONDUCTOR PACKAGE AND COOLING SYSTEM

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT SEMICONDUCTOR DEVICE

THERMAL INTERFACE MATERIAL, METHOD OF MANUFACTURING THE SAME, AND S...