SEUNGHOON YEON

Person

SUWON-SI, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 11,990,452
- Issue date May 21, 2024
- Samsung Electronics Co., Ltd.
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,942,446
- Issue date Mar 26, 2024
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and semiconductor package including the same
- Patent number 11,887,913
- Issue date Jan 30, 2024
- Samsung Electronics Co., Ltd.
- Chajea Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-stacked semiconductor package and method of manufacturing same
- Patent number 11,869,818
- Issue date Jan 9, 2024
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,862,596
- Issue date Jan 2, 2024
- Samsung Electronics Co., Ltd.
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,626,385
- Issue date Apr 11, 2023
- Samsung Electronics Co., Ltd.
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,569,201
- Issue date Jan 31, 2023
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,552,037
- Issue date Jan 10, 2023
- Samsung Electronics Co., Ltd.
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package with underfill and image sensor module includi...
- Patent number 11,545,512
- Issue date Jan 3, 2023
- Samsung Electronics Co., Ltd.
- Chajea Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device and semiconductor package including the same
- Patent number 11,545,417
- Issue date Jan 3, 2023
- Samsung Electronics Co., Ltd.
- Chajea Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-stacked semiconductor package and method of manufacturing same
- Patent number 11,328,966
- Issue date May 10, 2022
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,244,894
- Issue date Feb 8, 2022
- Samsung Electronics Co., Ltd.
- Seunghoon Yeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,158,603
- Issue date Oct 26, 2021
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming redistribution lines and methods of manufacturin...
- Patent number 10,748,953
- Issue date Aug 18, 2020
- Samsung Electronics Co., Ltd.
- Yonghoe Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 10,636,760
- Issue date Apr 28, 2020
- Samsung Electronics Co., Ltd.
- Seunghoon Yeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming redistribution lines and methods of manufacturin...
- Patent number 10,615,213
- Issue date Apr 7, 2020
- Samsung Electronics Co., Ltd.
- Yonghoe Cho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240258224
- Publication date Aug 1, 2024
- Samsung Electronics Co., Ltd.
- Seungryong Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240243104
- Publication date Jul 18, 2024
- Samsung Electronics Co., Ltd.
- Seunghoon Yeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240170455
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- Yonghoe CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240096841
- Publication date Mar 21, 2024
- Samsung Electronics Co., Ltd.
- Ohguk KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230215842
- Publication date Jul 6, 2023
- NAMHOON KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230148191
- Publication date May 11, 2023
- Samsung Electronics Co., Ltd.
- NAMHOON KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230117072
- Publication date Apr 20, 2023
- Samsung Electronics Co., Ltd.
- Chajea JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING BUMP STRUCTURES WITH DIFFERENT SHAPES
- Publication number 20230035032
- Publication date Feb 2, 2023
- Samsung Electronics Co., Ltd.
- SUNJAE KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20220262689
- Publication date Aug 18, 2022
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE WITH UNDERFILL AND IMAGE SENSOR MODULE INCLUDI...
- Publication number 20220045111
- Publication date Feb 10, 2022
- Samsung Electronics Co., Ltd.
- Chajea JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20220045033
- Publication date Feb 10, 2022
- Samsung Electronics Co., Ltd.
- HYOEUN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220037279
- Publication date Feb 3, 2022
- Samsung Electronics Co., Ltd.
- NAMHOON KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220013501
- Publication date Jan 13, 2022
- Samsung Electronics Co., Ltd.
- Namhoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20210407890
- Publication date Dec 30, 2021
- Samsung Electronics Co., Ltd.
- Chajea JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210398929
- Publication date Dec 23, 2021
- Samsung Electronics Co., Ltd.
- HYOEUN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20210028102
- Publication date Jan 28, 2021
- Samsung Electronics Co., Ltd.
- Seunghoon Yeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20200411393
- Publication date Dec 31, 2020
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- G01 - MEASURING TESTING
Information Patent Application
METHODS OF FORMING REDISTRIBUTION LINES AND METHODS OF MANUFACTURIN...
- Publication number 20200203414
- Publication date Jun 25, 2020
- Samsung Electronics Co., Ltd.
- YONGHOE CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20200051954
- Publication date Feb 13, 2020
- Samsung Electronics Co., Ltd.
- HYOEUN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20190214359
- Publication date Jul 11, 2019
- Samsung Electronics Co., Ltd.
- Seunghoon YEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING REDISTRIBUTION LINES AND METHODS OF MANUFACTURIN...
- Publication number 20190172865
- Publication date Jun 6, 2019
- Samsung Electronics Co., Ltd.
- YONGHOE CHO
- H01 - BASIC ELECTRIC ELEMENTS

SEUNGHOON YEON

Person

Patents Grantslast 30 patents

Semiconductor package

Semiconductor package and method of manufacturing the same

Integrated circuit device and semiconductor package including the same

Chip-stacked semiconductor package and method of manufacturing same

Semiconductor package

Semiconductor package

Semiconductor package and method of fabricating the same

Semiconductor package

Image sensor package with underfill and image sensor module includi...

Integrated circuit device and semiconductor package including the same

Chip-stacked semiconductor package and method of manufacturing same

Semiconductor packages

Semiconductor package and method of fabricating the same

Methods of forming redistribution lines and methods of manufacturin...

Semiconductor packages

Methods of forming redistribution lines and methods of manufacturin...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE INCLUDING BUMP STRUCTURES WITH DIFFERENT SHAPES

CHIP-STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

IMAGE SENSOR PACKAGE WITH UNDERFILL AND IMAGE SENSOR MODULE INCLUDI...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGES

CHIP-STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

METHODS OF FORMING REDISTRIBUTION LINES AND METHODS OF MANUFACTURIN...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGES

METHODS OF FORMING REDISTRIBUTION LINES AND METHODS OF MANUFACTURIN...