Seunghun CHAE

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Sejong-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,417,595
- Issue date Aug 16, 2022
- Samsung Electronics Co., Ltd.
- Seunghun Chae
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING A SEMICONDUCTOR P...
- Publication number 20240404935
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Seunghun Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240105536
- Publication date Mar 28, 2024
- Samsung Electronics Co., Ltd.
- Seokbong PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220384329
- Publication date Dec 1, 2022
- Samsung Electronics Co., Ltd.
- Seunghun CHAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210183756
- Publication date Jun 17, 2021
- Samsung Electronics Co., Ltd.
- Seunghun CHAE
- H01 - BASIC ELECTRIC ELEMENTS