Seunghun SHIN

Person

Gumi-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 12,094,794
- Issue date Sep 17, 2024
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having molding layer with inclined side wall
- Patent number 11,869,821
- Issue date Jan 9, 2024
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,515,226
- Issue date Nov 29, 2022
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,424,172
- Issue date Aug 23, 2022
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Discrete decoupling capacitor and integrated circuit chip package i...
- Patent number 11,393,801
- Issue date Jul 19, 2022
- Samsung Electronics Co., Ltd.
- Seunghun Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate, method of sawing substrate, and semiconductor device
- Patent number 10,916,509
- Issue date Feb 9, 2021
- Samsung Electronics Co., Ltd.
- Yun-Rae Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate, method of sawing substrate, and semiconductor device
- Patent number 10,418,335
- Issue date Sep 17, 2019
- Samsung Electronics Co., Ltd.
- Yun-Rae Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device including metal housing antenna
- Patent number 10,283,846
- Issue date May 7, 2019
- Samsung Electronics Co., Ltd.
- Wowjin Choi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20240379478
- Publication date Nov 14, 2024
- Samsung Electronics Co., Ltd.
- Yeongkwon KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF SPLITTING SEMICONDUCTOR CHIP USING MECHANICAL MACHINING A...
- Publication number 20240312823
- Publication date Sep 19, 2024
- Samsung Electronics Co., Ltd.
- Yeongkwon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240178191
- Publication date May 30, 2024
- Samsung Electronics Co., Ltd.
- Jihun JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20230065076
- Publication date Mar 2, 2023
- Samsung Electronics Co., Ltd.
- Yeongkwon KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220375808
- Publication date Nov 24, 2022
- Samsung Electronics Co., Ltd.
- Yeongkwon KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210375709
- Publication date Dec 2, 2021
- Samsung Electronics Co., Ltd.
- Yeongkwon KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20210343613
- Publication date Nov 4, 2021
- Samsung Electronics Co., Ltd.
- Yeongkwon KO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISCRETE DECOUPLING CAPACITOR AND INTEGRATED CIRCUIT CHIP PACKAGE I...
- Publication number 20210118618
- Publication date Apr 22, 2021
- Samsung Electronics Co., Ltd.
- SEUNGHUN SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE, METHOD OF SAWING SUBSTRATE, AND SEMICONDUCTOR DEVICE
- Publication number 20190355671
- Publication date Nov 21, 2019
- Samsung Electronics Co., Ltd.
- Yun-Rae CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE, METHOD OF SAWING SUBSTRATE, AND SEMICONDUCTOR DEVICE
- Publication number 20180261555
- Publication date Sep 13, 2018
- Samsung Electronics Co., Ltd.
- Yun-Rae CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE INCLUDING METAL HOUSING ANTENNA
- Publication number 20170201013
- Publication date Jul 13, 2017
- Samsung Electronics Co., Ltd.
- Wowjin CHOI
- H01 - BASIC ELECTRIC ELEMENTS

Seunghun SHIN

Person

Patents Grantslast 30 patents

Semiconductor package and method of fabricating the same

Semiconductor package having molding layer with inclined side wall

Semiconductor package and method of fabricating the same

Semiconductor package

Discrete decoupling capacitor and integrated circuit chip package i...

Substrate, method of sawing substrate, and semiconductor device

Substrate, method of sawing substrate, and semiconductor device

Electronic device including metal housing antenna

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

METHOD OF SPLITTING SEMICONDUCTOR CHIP USING MECHANICAL MACHINING A...

SEMICONDUCTOR CHIP AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

DISCRETE DECOUPLING CAPACITOR AND INTEGRATED CIRCUIT CHIP PACKAGE I...

SUBSTRATE, METHOD OF SAWING SUBSTRATE, AND SEMICONDUCTOR DEVICE

SUBSTRATE, METHOD OF SAWING SUBSTRATE, AND SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE INCLUDING METAL HOUSING ANTENNA