Seungkwan Ryu

Person

Seongnam-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package having an interposer and method of manufactur...
- Patent number 12,021,032
- Issue date Jun 25, 2024
- Samsung Electronics Co., Ltd.
- Yanggyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and semiconductor package including same
- Patent number 11,728,255
- Issue date Aug 15, 2023
- Samsung Electronics Co., Ltd.
- Ungcheon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an interposer and method of manufactur...
- Patent number 11,694,961
- Issue date Jul 4, 2023
- Samsung Electronics Co., Ltd.
- Yanggyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring protection layer on an interposer with a through electrode
- Patent number 11,587,859
- Issue date Feb 21, 2023
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer, semiconductor package including the same, and method of...
- Patent number 11,482,483
- Issue date Oct 25, 2022
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer with through electrode having a wiring protection layer
- Patent number 11,195,785
- Issue date Dec 7, 2021
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240112998
- Publication date Apr 4, 2024
- Samsung Electronics Co., Ltd.
- Yongjae KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING SAME
- Publication number 20230352386
- Publication date Nov 2, 2023
- Samsung Electronics Co., Ltd.
- Ungcheon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN INTERPOSER AND METHOD OF MANUFACTUR...
- Publication number 20230326862
- Publication date Oct 12, 2023
- Samsung Electronics Co., Ltd.
- Yanggyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF...
- Publication number 20230052195
- Publication date Feb 16, 2023
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND SEMICONDUCTOR PACKAGE HAVING THE SAME
- Publication number 20220051970
- Publication date Feb 17, 2022
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING SAME
- Publication number 20220013445
- Publication date Jan 13, 2022
- Samsung Electronics Co., Ltd.
- Ungcheon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN INTERPOSER AND METHOD OF MANUFACTUR...
- Publication number 20210391265
- Publication date Dec 16, 2021
- Samsung Electronics Co., Ltd.
- Yanggyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF...
- Publication number 20210175161
- Publication date Jun 10, 2021
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND SEMICONDUCTOR PACKAGE HAVING THE SAME
- Publication number 20210167001
- Publication date Jun 3, 2021
- Samsung Electronics Co., Ltd.
- Yukyung Park
- H01 - BASIC ELECTRIC ELEMENTS

Seungkwan Ryu

Person

Patents Grantslast 30 patents

Semiconductor package having an interposer and method of manufactur...

Interposer and semiconductor package including same

Semiconductor package having an interposer and method of manufactur...

Wiring protection layer on an interposer with a through electrode

Interposer, semiconductor package including the same, and method of...

Interposer with through electrode having a wiring protection layer

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING SAME

SEMICONDUCTOR PACKAGE HAVING AN INTERPOSER AND METHOD OF MANUFACTUR...

INTERPOSER, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF...

INTERPOSER AND SEMICONDUCTOR PACKAGE HAVING THE SAME

INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING SAME

SEMICONDUCTOR PACKAGE HAVING AN INTERPOSER AND METHOD OF MANUFACTUR...

INTERPOSER, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF...

INTERPOSER AND SEMICONDUCTOR PACKAGE HAVING THE SAME