Seungman Choi

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Loudonville, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Interconnected integrated circuit (IC) chip structure and packaging...
- Patent number 10,714,411
- Issue date Jul 14, 2020
- GLOBALFOUNDRIES Inc.
- Wolfgang Sauter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Parallel test structure
- Patent number 10,475,677
- Issue date Nov 12, 2019
- GLOBALFOUNDRIES Inc.
- Tian Shen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECTED INTEGRATED CIRCUIT (IC) CHIP STRUCTURE AND PACKAGING...
- Publication number 20190287879
- Publication date Sep 19, 2019
- GLOBALFOUNDRIES INC.
- Wolfgang Sauter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARALLEL TEST STRUCTURE
- Publication number 20190067056
- Publication date Feb 28, 2019
- GLOBALFOUNDRIES INC.
- Tian Shen
- G01 - MEASURING TESTING
Information Patent Application
TDDB PERCOLATION CURRENT INDUCED E-FUSE STRUCTURE AND METHOD OF PRO...
- Publication number 20190066812
- Publication date Feb 28, 2019
- GLOBALFOUNDRIES INC.
- Kong Boon Yeap
- G11 - INFORMATION STORAGE