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Seungryong OH

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  • Hwaseong-si, KR
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Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20250118651
    • Publication date Apr 10, 2025
    • Samsung Electronics Co., Ltd.
    • Seungryong OH
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240258224
    • Publication date Aug 1, 2024
    • Samsung Electronics Co., Ltd.
    • Seungryong Oh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240243111
    • Publication date Jul 18, 2024
    • Samsung Electronics Co., Ltd.
    • Chajea JO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
    • Publication number 20240243104
    • Publication date Jul 18, 2024
    • Samsung Electronics Co., Ltd.
    • Seunghoon Yeon
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIP HAVING THROUGH-E...
    • Publication number 20240194575
    • Publication date Jun 13, 2024
    • Samsung Electronics Co., Ltd.
    • Seungryong Oh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240170455
    • Publication date May 23, 2024
    • Samsung Electronics Co., Ltd.
    • Yonghoe CHO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240170464
    • Publication date May 23, 2024
    • Samsung Electronics Co., Ltd.
    • Chajea JO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240162188
    • Publication date May 16, 2024
    • Samsung Electronics Co., Ltd.
    • Chajea JO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
    • Publication number 20240096841
    • Publication date Mar 21, 2024
    • Samsung Electronics Co., Ltd.
    • Ohguk KWON
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    IMAGE SENSOR PACKAGE
    • Publication number 20230129129
    • Publication date Apr 27, 2023
    • Samsung Electronics Co., Ltd.
    • Seungryong OH
    • H01 - BASIC ELECTRIC ELEMENTS