Seungsoo HA

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Seongnam-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and package-on-package including the same
- Patent number 12,255,160
- Issue date Mar 18, 2025
- Samsung Electronics Co., Ltd.
- Juyoun Choi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250218969
- Publication date Jul 3, 2025
- Samsung Electronics Co., Ltd.
- Hongwon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250183214
- Publication date Jun 5, 2025
- Samsung Electronics Co., Ltd.
- SEUNGSOO HA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20250167155
- Publication date May 22, 2025
- Samsung Electronics Co., Ltd.
- SEUNGSOO HA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, AND MEMORY MODULE INCLUDING THE SAME
- Publication number 20230130453
- Publication date Apr 27, 2023
- Samsung Electronics Co., Ltd.
- SEOKBEOM YONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230060946
- Publication date Mar 2, 2023
- Samsung Electronics Co., Ltd.
- Seungsoo Ha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE INCLUDING THE SAME
- Publication number 20230039914
- Publication date Feb 9, 2023
- Samsung Electronics Co., Ltd.
- Juyoun CHOI
- H01 - BASIC ELECTRIC ELEMENTS