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SeungYong Chai
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Suwon-si, KR
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device and method of calibrating warpage testing syst...
Patent number
9,279,673
Issue date
Mar 8, 2016
STATS ChipPAC, Ltd.
WonJun Ko
G01 - MEASURING TESTING
Information
Patent Grant
Semiconductor device and method of forming protective coating mater...
Patent number
8,524,537
Issue date
Sep 3, 2013
STATS ChipPAC, Ltd.
JaEun Yun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packaging system with multi-stacked flip chips a...
Patent number
8,518,822
Issue date
Aug 27, 2013
Stats Chippac Ltd.
SeungYong Chai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package system with package integration
Patent number
8,067,275
Issue date
Nov 29, 2011
Stats Chippac Ltd.
WonJun Ko
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Semiconductor Device and Method of Calibrating Warpage Testing Syst...
Publication number
20140269810
Publication date
Sep 18, 2014
STATS ChipPAC, Ltd.
WonJun Ko
G01 - MEASURING TESTING
Information
Patent Application
Semiconductor Device and Method of Forming Protective Coating Mater...
Publication number
20130256840
Publication date
Oct 3, 2013
JaEun Yun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Protective Coating Mater...
Publication number
20110266656
Publication date
Nov 3, 2011
STATS ChipPAC, Ltd.
JaEun Yun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH MULTI-STACKED FLIP CHIPS A...
Publication number
20100244218
Publication date
Sep 30, 2010
SeungYong Chai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PACKAGE INTEGRATION
Publication number
20090155961
Publication date
Jun 18, 2009
WonJun Ko
H01 - BASIC ELECTRIC ELEMENTS