SeungYun Ahn

Person

Ichon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package system with multi-chip module
- Patent number 9,330,945
- Issue date May 3, 2016
- Stats Chippac Ltd.
- Sungmin Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with fan-in package and method...
- Patent number 9,093,391
- Issue date Jul 28, 2015
- Stats Chippac Ltd.
- SeungYun Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with encapsulation and method o...
- Patent number 8,643,181
- Issue date Feb 4, 2014
- Stats Chippac Ltd.
- JoHyun Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system employing multi-package module te...
- Patent number 8,609,463
- Issue date Dec 17, 2013
- Stats Chippac Ltd.
- WonJun Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package-on-package system with underfilling stru...
- Patent number 8,535,981
- Issue date Sep 17, 2013
- Stats Chippac Ltd.
- Chan Hoon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with dual side connection and met...
- Patent number 8,501,535
- Issue date Aug 6, 2013
- Stats Chippac Ltd.
- Sungmin Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package system with via z-interconnections and method fo...
- Patent number 8,258,008
- Issue date Sep 4, 2012
- Stats Chippac Ltd.
- Taewoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for peeling semiconductor chips from tape
- Patent number 8,221,583
- Issue date Jul 17, 2012
- Stats Chippac Ltd.
- Gab Yong Min
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Integrated circuit packaging system with exposed conductor and meth...
- Patent number 8,067,306
- Issue date Nov 29, 2011
- Stats Chippac Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with dual side connection
- Patent number 7,884,457
- Issue date Feb 8, 2011
- Stats Chippac Ltd.
- Sungmin Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package system with via Z-interconnections
- Patent number 7,863,755
- Issue date Jan 4, 2011
- Stats Chippac Ltd.
- Taewoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip package system
- Patent number 7,521,297
- Issue date Apr 21, 2009
- Stats Chippac Ltd.
- SeongMin Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE SYSTEM WITH UNDERFILLING STRU...
- Publication number 20120228753
- Publication date Sep 13, 2012
- Chan Hoon Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ENCAPSULATION AND METHOD O...
- Publication number 20110233751
- Publication date Sep 29, 2011
- JoHyun Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EXPOSED CONDUCTOR AND METH...
- Publication number 20110210437
- Publication date Sep 1, 2011
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DUAL SIDE CONNECTION AND MET...
- Publication number 20110115098
- Publication date May 19, 2011
- Sungmin Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE SYSTEM WITH VIA Z-INTERCONNECTIONS AND METHOD FO...
- Publication number 20110084401
- Publication date Apr 14, 2011
- Taewoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FAN-IN PACKAGE AND METHOD...
- Publication number 20110062602
- Publication date Mar 17, 2011
- SeungYun Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE SYSTEM WITH VIA Z-INTERCONNECTIONS
- Publication number 20090236752
- Publication date Sep 24, 2009
- Taewoo Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MULTI-CHIP MODULE
- Publication number 20090072375
- Publication date Mar 19, 2009
- Sungmin Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DUAL SIDE CONNECTION
- Publication number 20090001612
- Publication date Jan 1, 2009
- Sungmin Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING MULTI-PACKAGE MODULE TE...
- Publication number 20080227238
- Publication date Sep 18, 2008
- WonJun Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR PEELING SEMICONDUCTOR CHIPS FROM TAPE
- Publication number 20080173407
- Publication date Jul 24, 2008
- Gab Yong Min
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPACERLESS SEMICONDUCTOR PACKAGE CHIP STACKING SYSTEM
- Publication number 20070268660
- Publication date Nov 22, 2007
- STATS ChipPAC Ltd.
- Seungyun Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP PACKAGE SYSTEM
- Publication number 20070216007
- Publication date Sep 20, 2007
- STATS ChipPAC Ltd.
- SeongMin Lee
- H01 - BASIC ELECTRIC ELEMENTS

SeungYun Ahn

Person

Patents Grantslast 30 patents

Integrated circuit package system with multi-chip module

Integrated circuit packaging system with fan-in package and method...

Integrated circuit packaging system with encapsulation and method o...

Integrated circuit package system employing multi-package module te...

Integrated circuit package-on-package system with underfilling stru...

Integrated circuit package system with dual side connection and met...

Package-on-package system with via z-interconnections and method fo...

System for peeling semiconductor chips from tape

Integrated circuit packaging system with exposed conductor and meth...

Integrated circuit package system with dual side connection

Package-on-package system with via Z-interconnections

Multichip package system

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE SYSTEM WITH UNDERFILLING STRU...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ENCAPSULATION AND METHOD O...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH EXPOSED CONDUCTOR AND METH...

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DUAL SIDE CONNECTION AND MET...

PACKAGE-ON-PACKAGE SYSTEM WITH VIA Z-INTERCONNECTIONS AND METHOD FO...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FAN-IN PACKAGE AND METHOD...

PACKAGE-ON-PACKAGE SYSTEM WITH VIA Z-INTERCONNECTIONS

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MULTI-CHIP MODULE

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DUAL SIDE CONNECTION

INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING MULTI-PACKAGE MODULE TE...

SYSTEM FOR PEELING SEMICONDUCTOR CHIPS FROM TAPE

SPACERLESS SEMICONDUCTOR PACKAGE CHIP STACKING SYSTEM

MULTICHIP PACKAGE SYSTEM