Sey-Ping Sun

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Wrap-around contact on FinFET
- Patent number 11,854,898
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wrap-around contact on FinFET
- Patent number 11,362,000
- Issue date Jun 14, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, FinFET devices, and manufacturing methods th...
- Patent number 11,251,086
- Issue date Feb 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having dummy connectors and methods of formi...
- Patent number 10,867,976
- Issue date Dec 15, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming the gate electrode of field effect transistor
- Patent number 10,797,156
- Issue date Oct 6, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd
- Neng-Kuo Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wrap-around contact on FinFET
- Patent number 10,651,091
- Issue date May 12, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming the gate electrode of field effect transistor
- Patent number 10,516,031
- Issue date Dec 24, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Neng-Kuo Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having dummy connectors and methods of formi...
- Patent number 10,510,734
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin structure of FinFET
- Patent number 10,333,001
- Issue date Jun 25, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Gin-Chen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having dummy connectors and methods of formi...
- Patent number 10,276,548
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET low resistivity contact formation method
- Patent number 10,269,628
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wrap-around contact on FinFET
- Patent number 10,269,649
- Issue date Apr 23, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned dual-metal silicide and germanide formation
- Patent number 10,115,597
- Issue date Oct 30, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun Hsiung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices, FinFET devices, and manufacturing methods th...
- Patent number 10,049,938
- Issue date Aug 14, 2018
- Taiwan Semiconductor Manufacturing Company
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wrap-around contact on FinFET
- Patent number 9,941,367
- Issue date Apr 10, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin structure of FinFET
- Patent number 9,929,272
- Issue date Mar 27, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Gin-Chen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a finFET device
- Patent number 9,899,496
- Issue date Feb 20, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sey-Ping Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing method using slurry composition conta...
- Patent number 9,881,803
- Issue date Jan 30, 2018
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Jung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFETs with nitride liners and methods of forming the same
- Patent number 9,870,956
- Issue date Jan 16, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Neng-Kuo Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacture thereof
- Patent number 9,818,603
- Issue date Nov 14, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming the gate electrode of field effect transistor
- Patent number 9,812,551
- Issue date Nov 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd
- Neng-Kuo Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-planar transistors and methods of fabrication thereof
- Patent number 9,735,276
- Issue date Aug 15, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hang Tung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing methods and methods of forming i...
- Patent number 9,607,826
- Issue date Mar 28, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Gin-Chen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having elevated structure
- Patent number 9,601,587
- Issue date Mar 21, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sey-Ping Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure of semiconductor device
- Patent number 9,589,838
- Issue date Mar 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gate electrode of field effect transistor
- Patent number 9,589,803
- Issue date Mar 7, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Neng-Kuo Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned dual-metal silicide and germanide formation
- Patent number 9,559,182
- Issue date Jan 31, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Clement Hsingjen Wann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fin structure of FinFet
- Patent number 9,443,964
- Issue date Sep 13, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Gin-Chen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wrap-around contact
- Patent number 9,443,769
- Issue date Sep 13, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing method using slurry composition conta...
- Patent number 9,416,297
- Issue date Aug 16, 2016
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Jung Hsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
OPTICAL DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240280752
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- C30 - CRYSTAL GROWTH
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240128147
- Publication date Apr 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sey-Ping SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20240021488
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sey-Ping Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming the Same
- Publication number 20230420330
- Publication date Dec 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sey-Ping Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Semiconductor Devices and Methods of Forming the Same
- Publication number 20230361068
- Publication date Nov 9, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.
- Sey-Ping Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages With Deep Bond Pads and Method Forming Same
- Publication number 20230187406
- Publication date Jun 15, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wrap-Around Contact on FinFET
- Publication number 20210272849
- Publication date Sep 2, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wrap-Around Contact on FinFET
- Publication number 20200258784
- Publication date Aug 13, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING THE GATE ELECTRODE OF FIELD EFFECT TRANSISTOR
- Publication number 20200127118
- Publication date Apr 23, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Neng-Kuo CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages Having Dummy Connectors and Methods of Formi...
- Publication number 20200118984
- Publication date Apr 16, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wrap-Around Contact on FinFET
- Publication number 20190252261
- Publication date Aug 15, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages having Dummy Connectors and Methods of Formi...
- Publication number 20190115326
- Publication date Apr 18, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES, FINFET DEVICES, AND MANUFACTURING METHODS TH...
- Publication number 20190006244
- Publication date Jan 3, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wrap-Around Contact on FinFET
- Publication number 20180219077
- Publication date Aug 2, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel Fin Structure of FinFET
- Publication number 20180219095
- Publication date Aug 2, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Gin-Chen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages having Dummy Connectors and Methods of Formi...
- Publication number 20180076184
- Publication date Mar 15, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING THE GATE ELECTRODE OF FIELD EFFECT TRANSISTOR
- Publication number 20180069094
- Publication date Mar 8, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Neng-Kuo CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FinFet Low Resistivity Contact Formation Method
- Publication number 20170170061
- Publication date Jun 15, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING THE GATE ELECTRODE OF FIELD EFFECT TRANSISTOR
- Publication number 20170162669
- Publication date Jun 8, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Neng-Kuo CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-Aligned Dual-Metal Silicide and Germanide Formation
- Publication number 20170140942
- Publication date May 18, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun Hsiung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel Fin Structure of FinFet
- Publication number 20160380103
- Publication date Dec 29, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Gin-Chen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wrap-Around Contact on FinFET
- Publication number 20160343815
- Publication date Nov 24, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING METHOD USING SLURRY COMPOSITION CONTA...
- Publication number 20160329215
- Publication date Nov 10, 2016
- Taiwan Semiconductor Manufacturing Co., LTD
- Chia-Jung Hsu
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
FinFETs with Nitride Liners and Methods of Forming the Same
- Publication number 20160329329
- Publication date Nov 10, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Neng-Kuo Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices, FinFET Devices, and Manufacturing Methods Th...
- Publication number 20160211338
- Publication date Jul 21, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-Aligned Dual-Metal Silicide and Germanide Formation
- Publication number 20160099331
- Publication date Apr 7, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Clement Hsingjen Wann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel Fin Structure of FinFet
- Publication number 20150311321
- Publication date Oct 29, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Gin-Chen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Structure of Semiconductor Device
- Publication number 20150303106
- Publication date Oct 22, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wrap-Around Contact
- Publication number 20150303118
- Publication date Oct 22, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods of Manufacture Thereof
- Publication number 20150255581
- Publication date Sep 10, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS

Sey-Ping Sun

Person

Patents Grantslast 30 patents

Wrap-around contact on FinFET

Wrap-around contact on FinFET

Semiconductor devices, FinFET devices, and manufacturing methods th...

Semiconductor packages having dummy connectors and methods of formi...

Method of forming the gate electrode of field effect transistor

Wrap-around contact on FinFET

Method of forming the gate electrode of field effect transistor

Semiconductor packages having dummy connectors and methods of formi...

Fin structure of FinFET

Semiconductor packages having dummy connectors and methods of formi...

FinFET low resistivity contact formation method

Wrap-around contact on FinFET

Self-aligned dual-metal silicide and germanide formation

Semiconductor devices, FinFET devices, and manufacturing methods th...

Wrap-around contact on FinFET

Fin structure of FinFET

Method of making a finFET device

Chemical mechanical polishing method using slurry composition conta...

FinFETs with nitride liners and methods of forming the same

Semiconductor devices and methods of manufacture thereof

Method of forming the gate electrode of field effect transistor

Non-planar transistors and methods of fabrication thereof

Semiconductor device manufacturing methods and methods of forming i...

Semiconductor device having elevated structure

Contact structure of semiconductor device

Gate electrode of field effect transistor

Self-aligned dual-metal silicide and germanide formation

Fin structure of FinFet

Wrap-around contact

Chemical mechanical polishing method using slurry composition conta...

Patents Applicationslast 30 patents

OPTICAL DEVICE AND METHOD OF MANUFACTURE

SEMICONDUCTOR DEVICE

Integrated Circuit Package and Method

Semiconductor Packages and Methods of Forming the Same

Packaged Semiconductor Devices and Methods of Forming the Same

Packages With Deep Bond Pads and Method Forming Same

Wrap-Around Contact on FinFET

Wrap-Around Contact on FinFET

METHOD OF FORMING THE GATE ELECTRODE OF FIELD EFFECT TRANSISTOR

Semiconductor Packages Having Dummy Connectors and Methods of Formi...

Wrap-Around Contact on FinFET

Semiconductor Packages having Dummy Connectors and Methods of Formi...

SEMICONDUCTOR DEVICES, FINFET DEVICES, AND MANUFACTURING METHODS TH...

Wrap-Around Contact on FinFET

Novel Fin Structure of FinFET

Semiconductor Packages having Dummy Connectors and Methods of Formi...

METHOD OF FORMING THE GATE ELECTRODE OF FIELD EFFECT TRANSISTOR

FinFet Low Resistivity Contact Formation Method

METHOD OF FORMING THE GATE ELECTRODE OF FIELD EFFECT TRANSISTOR

Self-Aligned Dual-Metal Silicide and Germanide Formation

Novel Fin Structure of FinFet

Wrap-Around Contact on FinFET

CHEMICAL MECHANICAL POLISHING METHOD USING SLURRY COMPOSITION CONTA...

FinFETs with Nitride Liners and Methods of Forming the Same

Semiconductor Devices, FinFET Devices, and Manufacturing Methods Th...

Self-Aligned Dual-Metal Silicide and Germanide Formation

Novel Fin Structure of FinFet

Contact Structure of Semiconductor Device

Wrap-Around Contact

Semiconductor Devices and Methods of Manufacture Thereof