Seyang Park

Follow

Person

Beaverton, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for electroplating
- Patent number 8,308,931
- Issue date Nov 13, 2012
- Novellus Systems, Inc.
- Jonathan Reid
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Two step process for uniform across wafer deposition and void free...
- Patent number 7,799,684
- Issue date Sep 21, 2010
- Novellus Systems, Inc.
- Jonathan Reid
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Anneal of ruthenium seed layer to improve copper plating
- Patent number 7,442,267
- Issue date Oct 28, 2008
- Novellus Systems, Inc.
- Eric G. Webb
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Methods for the electrochemical deposition of copper onto a barrier...
- Patent number 7,405,157
- Issue date Jul 29, 2008
- Novellus Systems, Inc.
- Jon Reid
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method and apparatus for electroplating
- Publication number 20100032310
- Publication date Feb 11, 2010
- Novellus Systems, Inc.
- Jonathan Reid
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR