SeYoung Jeong

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of fabricating semiconductor devices
- Patent number 9,793,165
- Issue date Oct 17, 2017
- Samsung Electronics Co., Ltd.
- Seyoung Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices having conductive through via electrodes in...
- Patent number 9,153,489
- Issue date Oct 6, 2015
- Samsung Electronics Co., Ltd.
- Ho-Jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of fabricating the same
- Patent number 9,059,072
- Issue date Jun 16, 2015
- Samsung Electronics Co., Ltd.
- Eun-Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device for semiconductor package having through silic...
- Patent number 8,933,561
- Issue date Jan 13, 2015
- Samsung Electronics Co., Ltd.
- SeYoung Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor devices and fabrication methods thereof
- Patent number 8,766,455
- Issue date Jul 1, 2014
- Samsung Electronics Co., Ltd.
- SeYoung Jeong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor packages and methods of fabricating the same
- Patent number 8,759,147
- Issue date Jun 24, 2014
- Samsung Electronics Co., Ltd.
- Eun-Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer TSV insulation and methods of fabricating the same
- Patent number 8,492,902
- Issue date Jul 23, 2013
- Samsung Electronics Co., Ltd.
- Ho-Jin Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES AND FABRICATION METHODS THEREOF
- Publication number 20140312505
- Publication date Oct 23, 2014
- SeYoung Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME
- Publication number 20140300004
- Publication date Oct 9, 2014
- Eun-Kyoung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES HAVING CONDUCTIVE THROUGH VIA ELECTRODES IN...
- Publication number 20120292782
- Publication date Nov 22, 2012
- SAMSUNG ELECTRONICS CO., LTD.
- Ho-Jin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20120214302
- Publication date Aug 23, 2012
- SEYOUNG JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME
- Publication number 20120171814
- Publication date Jul 5, 2012
- Samsung Electronics Co., Ltd.
- Eun-Kyoung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Fabrication Methods thereof
- Publication number 20120112359
- Publication date May 10, 2012
- SeYoung Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices And Methods Of Fabricating The Same
- Publication number 20120091580
- Publication date Apr 19, 2012
- Samsung Electronics Co., Ltd.
- SeYoung Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER TSV INSULATION AND METHODS OF FABRICATING THE SAME
- Publication number 20120074584
- Publication date Mar 29, 2012
- SAMSUNG ELECTRONICS CO., LTD.
- Ho-Jin LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIPS AND METHODS OF FORMING THE SAME
- Publication number 20120049349
- Publication date Mar 1, 2012
- Samsung Electronics Co., Ltd.
- Ho-Jin LEE
- H01 - BASIC ELECTRIC ELEMENTS

SeYoung Jeong

Person

Patents Grantslast 30 patents

Methods of fabricating semiconductor devices

Microelectronic devices having conductive through via electrodes in...

Semiconductor packages and methods of fabricating the same

Semiconductor device for semiconductor package having through silic...

Stacked semiconductor devices and fabrication methods thereof

Semiconductor packages and methods of fabricating the same

Multi-layer TSV insulation and methods of fabricating the same

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES AND FABRICATION METHODS THEREOF

SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME

MICROELECTRONIC DEVICES HAVING CONDUCTIVE THROUGH VIA ELECTRODES IN...

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME

Semiconductor Devices and Fabrication Methods thereof

Semiconductor Devices And Methods Of Fabricating The Same

MULTI-LAYER TSV INSULATION AND METHODS OF FABRICATING THE SAME

SEMICONDUCTOR CHIPS AND METHODS OF FORMING THE SAME