Sez-An Wu

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Hsin-Chu, TW

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Patents Grantslast 30 patents

Information Patent Grant
Hillock reduction in copper films
- Patent number 7,368,383
- Issue date May 6, 2008
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih-Chi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a metal nitride layer over exposed copper
- Patent number 6,713,407
- Issue date Mar 30, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Lung Cheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...