Shaestagir Chowdhury

Person

Beaverton, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Void-free high aspect ratio metal alloy interconnects and method of...
- Patent number 11,443,983
- Issue date Sep 13, 2022
- Intel Corporation
- Shaestagir Chowdhury
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Electroless filled conductive structures
- Patent number 9,123,706
- Issue date Sep 1, 2015
- Intel Corporation
- Daniel J. Zierath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filling narrow and high aspect ratio openings with electroless depo...
- Patent number 7,622,382
- Issue date Nov 24, 2009
- Intel Corporation
- Shaestagir Chowdhury
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Filling narrow and high aspect ratio openings using electroless dep...
- Patent number 7,432,200
- Issue date Oct 7, 2008
- Intel Corporation
- Shaestagir Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroless plating baths for high aspect features
- Patent number 7,220,296
- Issue date May 22, 2007
- Intel Corporation
- Shaestagir Chowdhury
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECT STRUCTURES WITH NITROGEN-RICH DIELECTRIC MATERIAL INTE...
- Publication number 20230102711
- Publication date Mar 30, 2023
- Intel Corporation
- Ming-Yi Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED LATERAL CONTACTS
- Publication number 20230032866
- Publication date Feb 2, 2023
- Intel Corporation
- Andy Chih-Hung Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VOID-FREE HIGH ASPECT RATIO METAL ALLOY INTERCONNECTS AND METHOD OF...
- Publication number 20200098626
- Publication date Mar 26, 2020
- Shaestagir CHOWDHURY
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTROLESS FILLED CONDUCTIVE STRUCTURES
- Publication number 20150371949
- Publication date Dec 24, 2015
- Intel Corporation
- Daniel J. Zierath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLESS FILLED CONDUCTIVE STRUCTURES
- Publication number 20130270703
- Publication date Oct 17, 2013
- Daniel J. Zierath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Filling narrow and high aspect ratio openings with electroless depo...
- Publication number 20070232044
- Publication date Oct 4, 2007
- Shaestagir Chowdhury
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Filling narrow and high aspect ratio openings using electroless dep...
- Publication number 20070141826
- Publication date Jun 21, 2007
- Intel Corporation
- Shaestagir Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to fabricate copper-cobalt interconnects
- Publication number 20060063382
- Publication date Mar 23, 2006
- Valery M. Dubin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Reducing wafer defects from chemical mechanical polishing
- Publication number 20050164609
- Publication date Jul 28, 2005
- Matthew Prince
- H01 - BASIC ELECTRIC ELEMENTS

Shaestagir Chowdhury

Person

Patents Grantslast 30 patents

Void-free high aspect ratio metal alloy interconnects and method of...

Electroless filled conductive structures

Filling narrow and high aspect ratio openings with electroless depo...

Filling narrow and high aspect ratio openings using electroless dep...

Electroless plating baths for high aspect features

Patents Applicationslast 30 patents

INTERCONNECT STRUCTURES WITH NITROGEN-RICH DIELECTRIC MATERIAL INTE...

SELF-ALIGNED LATERAL CONTACTS

VOID-FREE HIGH ASPECT RATIO METAL ALLOY INTERCONNECTS AND METHOD OF...

ELECTROLESS FILLED CONDUCTIVE STRUCTURES

ELECTROLESS FILLED CONDUCTIVE STRUCTURES

Filling narrow and high aspect ratio openings with electroless depo...

Filling narrow and high aspect ratio openings using electroless dep...

Method to fabricate copper-cobalt interconnects

Reducing wafer defects from chemical mechanical polishing