Shahram Y. Mehdizadeh

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Valley Village, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Controlling the thickness of wafers during the electroplating process
- Patent number 7,914,657
- Issue date Mar 29, 2011
- Hitachi Global Storage Technologies, Netherlands B.V.
- Wai B. Fu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
Controlling the thickness of wafers during the electroplating process
- Publication number 20070125656
- Publication date Jun 7, 2007
- Wai B. Fu
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR