Shailesh REDKAR

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Austin, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Method to prevent corrosion of bond pad structure
- Patent number 8,207,052
- Issue date Jun 26, 2012
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Younan Hua
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD TO PREVENT CORROSION OF BOND PAD STRUCTURE
- Publication number 20100184285
- Publication date Jul 22, 2010
- CHARTERED SEMICONDUCTOR MANUFACTURING, LTD.
- Younan HUA
- H01 - BASIC ELECTRIC ELEMENTS