Shakul TANDON

Person

Hillsboro, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Fill pattern to enhance ebeam process margin
- Patent number 11,581,162
- Issue date Feb 14, 2023
- Intel Corporation
- Shakul Tandon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fill pattern to enhance e-beam process margin
- Patent number 11,107,658
- Issue date Aug 31, 2021
- Intel Corporation
- Shakul Tandon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aperture size modulation to enhance ebeam patterning resolution
- Patent number 10,395,883
- Issue date Aug 27, 2019
- Intel Corporation
- Shakul Tandon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underlying absorbing or conducting layer for Ebeam direct write (EB...
- Patent number 10,338,474
- Issue date Jul 2, 2019
- Intel Corporation
- Shakul Tandon
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
STITCHED GUARD RINGS WITH OVERLAY ERROR RESILIENCY
- Publication number 20240321660
- Publication date Sep 26, 2024
- Intel Corporation
- Shakul Tandon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ONE-DIMENSIONAL OVERLAY MARKS
- Publication number 20240004310
- Publication date Jan 4, 2024
- Intel Corporation
- William Blanton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INCREASING OVERLAY MARGINS FOR LINES THAT SPAN RETICLE BOUNDARIES I...
- Publication number 20230194997
- Publication date Jun 22, 2023
- Intel Corporation
- Mark Phillips
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
FILL PATTERN TO ENHANCE EBEAM PROCESS MARGIN
- Publication number 20210358713
- Publication date Nov 18, 2021
- Intel Corporation
- Shakul TANDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILL PATTERN TO ENHANCE EBEAM PROCESS MARGIN
- Publication number 20190164723
- Publication date May 30, 2019
- Intel Corporation
- Shakul TANDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APERTURE SIZE MODULATION TO ENHANCE EBEAM PATTERNING RESOLUTION
- Publication number 20190013175
- Publication date Jan 10, 2019
- Intel Corporation
- Shakul TANDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Underlying Absorbing or Conducting Layer for Ebeam Direct Write (EB...
- Publication number 20170338105
- Publication date Nov 23, 2017
- Intel Corporation
- Shakul TANDON
- H01 - BASIC ELECTRIC ELEMENTS

Shakul TANDON

Person

Patents Grantslast 30 patents

Fill pattern to enhance ebeam process margin

Fill pattern to enhance e-beam process margin

Aperture size modulation to enhance ebeam patterning resolution

Underlying absorbing or conducting layer for Ebeam direct write (EB...

Patents Applicationslast 30 patents

STITCHED GUARD RINGS WITH OVERLAY ERROR RESILIENCY

ONE-DIMENSIONAL OVERLAY MARKS

INCREASING OVERLAY MARGINS FOR LINES THAT SPAN RETICLE BOUNDARIES I...

FILL PATTERN TO ENHANCE EBEAM PROCESS MARGIN

FILL PATTERN TO ENHANCE EBEAM PROCESS MARGIN

APERTURE SIZE MODULATION TO ENHANCE EBEAM PATTERNING RESOLUTION

Underlying Absorbing or Conducting Layer for Ebeam Direct Write (EB...