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Shams U. Arifeen
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Boise, ID, US
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Patents Grants
last 30 patents
Information
Patent Grant
Thermally conductive label for circuit
Patent number
11,997,782
Issue date
May 28, 2024
Micron Technology, Inc.
Kaleb A. Wilson
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor devices, semiconductor device packages, electronic sy...
Patent number
11,984,440
Issue date
May 14, 2024
Micron Technology, Inc.
Shams U. Arifeen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic components including metal pillars secured to bond...
Patent number
11,869,862
Issue date
Jan 9, 2024
Micron Technology, Inc.
Shams U. Arifeen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Warpage control in microelectronic packages, and related assemblies...
Patent number
11,855,002
Issue date
Dec 26, 2023
Micron Technology, Inc.
Christopher Glancey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices having crack-inhibiting structures
Patent number
11,848,282
Issue date
Dec 19, 2023
Micron Technology, Inc.
Hyunsuk Chun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked semiconductor die assemblies with substrate heat sinks and...
Patent number
11,769,752
Issue date
Sep 26, 2023
Micron Technology, Inc.
Shams U. Arifeen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor interconnect structures with conductive elements, and...
Patent number
11,728,307
Issue date
Aug 15, 2023
Micron Technology, Inc.
Shams U. Arifeen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device packages with angled pillars for decreasing st...
Patent number
11,721,658
Issue date
Aug 8, 2023
Micron Technology, Inc.
Shams U. Arifeen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
11,688,658
Issue date
Jun 27, 2023
Micron Technology, Inc.
Hyunsuk Chun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit board with spaces for embedding components
Patent number
11,664,360
Issue date
May 30, 2023
Micron Technology, Inc.
Quang Nguyen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Processes for forming self-healing solder joints and repair of same...
Patent number
11,646,286
Issue date
May 9, 2023
Micron Technology, Inc.
Shams U. Arifeen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices having crack-inhibiting structures
Patent number
11,616,028
Issue date
Mar 28, 2023
Micron Technology, Inc.
Shams U. Arifeen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices, semiconductor device packages, electronic sy...
Patent number
11,587,918
Issue date
Feb 21, 2023
Micron Technology, Inc.
Shams U. Arifeen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices with reinforced substrates
Patent number
11,552,029
Issue date
Jan 10, 2023
Micron Technology, Inc.
Koustav Sinha
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices having crack-inhibiting structures
Patent number
11,444,037
Issue date
Sep 13, 2022
Micron Technology, Inc.
Hyunsuk Chun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods for forming elements for microelectronic components, relate...
Patent number
11,276,659
Issue date
Mar 15, 2022
Micron Technology, Inc.
Shams U. Arifeen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus and method for dissipating heat in multiple semiconductor...
Patent number
11,239,133
Issue date
Feb 1, 2022
Micron Technology, Inc.
Xiaopeng Qu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit board with spaces for embedding components
Patent number
11,217,576
Issue date
Jan 4, 2022
Micron Technology, Inc.
Quang Nguyen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices, semiconductor device packages, electronic sy...
Patent number
11,171,130
Issue date
Nov 9, 2021
Micron Technology, Inc.
Shams U. Arifeen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device packages with angled pillars for decreasing st...
Patent number
11,164,837
Issue date
Nov 2, 2021
Micron Technology, Inc.
Shams U. Arifeen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Warpage control in microelectronic packages, and related assemblies...
Patent number
11,031,353
Issue date
Jun 8, 2021
Micron Technology, Inc.
Christopher Glancey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus and method for dissipating heat in multiple semiconductor...
Patent number
11,011,449
Issue date
May 18, 2021
Micron Technology, Inc.
Xiaopeng Qu
G11 - INFORMATION STORAGE
Information
Patent Grant
Semiconductor devices having crack-inhibiting structures
Patent number
10,811,365
Issue date
Oct 20, 2020
Micron Technology, Inc.
Shams U. Arifeen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices having crack-inhibiting structures
Patent number
10,784,212
Issue date
Sep 22, 2020
Micron Technology, Inc.
Hyunsuk Chun
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUBSTRATE HEAT SINKS AND...
Publication number
20240014171
Publication date
Jan 11, 2024
Micron Technology, Inc.
Shams U. Arifeen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR INTERCONNECT STRUCTURES WITH CONDUCTIVE ELEMENTS, AND...
Publication number
20230335522
Publication date
Oct 19, 2023
Micron Technology, Inc.
Shams U. Arifeen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND ASSEMBLIES FOR MEASUREMENT AND PREDICTION OF PACKAGE AN...
Publication number
20230268318
Publication date
Aug 24, 2023
Micron Technology, Inc.
Chien Ming Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE ASSEMBLIES WITH FLEXIBLE INTERCONNECTS AND ASSOCI...
Publication number
20230260943
Publication date
Aug 17, 2023
Micron Technology, Inc.
Christopher Glancey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES WITH REINFORCED SUBSTRATES
Publication number
20230154868
Publication date
May 18, 2023
Micron Technology, Inc.
Koustav Sinha
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES HAVING CRACK-INHIBITING STRUCTURES
Publication number
20230086907
Publication date
Mar 23, 2023
Micron Technology, Inc.
Hyunsuk Chun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS AND APPARATUS FOR USING STRUCTURAL ELEMENTS TO IMPROVE DROP...
Publication number
20230061955
Publication date
Mar 2, 2023
Micron Technology, Inc.
Koustav Sinha
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THERMALLY CONDUCTIVE LABEL FOR CIRCUIT
Publication number
20230065633
Publication date
Mar 2, 2023
Micron Technology, Inc.
Kaleb A. Wilson
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR INTERCONNECT STRUCTURES WITH CONDUCTIVE ELEMENTS, AND...
Publication number
20220344295
Publication date
Oct 27, 2022
Micron Technology, Inc.
Shams U. Arifeen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS FOR FORMING CONDUCTIVE ELEMENTS FOR MICROELECTRONIC COMPONE...
Publication number
20220189899
Publication date
Jun 16, 2022
Micron Technology, Inc.
Shams U. Arifeen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CIRCUIT BOARD WITH SPACES FOR EMBEDDING COMPONENTS
Publication number
20220122958
Publication date
Apr 21, 2022
Micron Technology, Inc.
Quang Nguyen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CIRCUIT BOARD WITH SPACES FOR EMBEDDING COMPONENTS
Publication number
20220085002
Publication date
Mar 17, 2022
Micron Technology, Inc.
Quang Nguyen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES WITH REINFORCED SUBSTRATES
Publication number
20220077076
Publication date
Mar 10, 2022
Micron Technology, Inc.
Koustav Sinha
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES WITH THERMAL BUFFER STRUCTURES
Publication number
20220037258
Publication date
Feb 3, 2022
Micron Technology, Inc.
Shams U. Arifeen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES, SEMICONDUCTOR DEVICE PACKAGES, ELECTRONIC SY...
Publication number
20220028850
Publication date
Jan 27, 2022
Micron Technology, Inc.
Shams U. Arifeen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGES WITH ANGLED PILLARS FOR DECREASING ST...
Publication number
20220028814
Publication date
Jan 27, 2022
Micron Technology, Inc.
Shams U. Arifeen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH SUBSTRATE HEAT SINKS AND...
Publication number
20220028826
Publication date
Jan 27, 2022
Micron Technology, Inc.
Shams U. Arifeen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE PACKAGES WITH ANGLED PILLARS FOR DECREASING ST...
Publication number
20210366859
Publication date
Nov 25, 2021
Micron Technology, Inc.
Shams U. Arifeen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS FOR FORMING ELEMENTS FOR MICROELECTRONIC COMPONENTS, RELATE...
Publication number
20210272921
Publication date
Sep 2, 2021
Micron Technology, Inc.
Shams U. Arifeen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS AND METHOD FOR DISSIPATING HEAT IN MULTIPLE SEMICONDUCTOR...
Publication number
20210272870
Publication date
Sep 2, 2021
Micron Technology, Inc.
Xiaopeng Qu
G11 - INFORMATION STORAGE
Information
Patent Application
WARPAGE CONTROL IN MICROELECTRONIC PACKAGES, AND RELATED ASSEMBLIES...
Publication number
20210257314
Publication date
Aug 19, 2021
Micron Technology, Inc.
Christopher Glancey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20210202337
Publication date
Jul 1, 2021
Micron Technology, Inc.
Hyunsuk Chun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PROCESSES FOR FORMING SELF-HEALING SOLDER JOINTS AND REPAIR OF SAME...
Publication number
20210193607
Publication date
Jun 24, 2021
Micron Technology, Inc.
Shams U. Arifeen
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR DEVICES, SEMICONDUCTOR DEVICE PACKAGES, ELECTRONIC SY...
Publication number
20210183843
Publication date
Jun 17, 2021
Micron Technology, Inc.
Shams U. Arifeen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WARPAGE CONTROL IN MICROELECTRONIC PACKAGES, AND RELATED ASSEMBLIES...
Publication number
20210057353
Publication date
Feb 25, 2021
Micron Technology, Inc.
Christopher Glancey
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES HAVING CRACK-INHIBITING STRUCTURES
Publication number
20210020585
Publication date
Jan 21, 2021
Micron Technology, Inc.
Shams U. Arifeen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES HAVING CRACK-INHIBITING STRUCTURES
Publication number
20200402925
Publication date
Dec 24, 2020
Micron Technology, Inc.
Hyunsuk Chun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES HAVING CRACK-INHIBITING STRUCTURES
Publication number
20200211983
Publication date
Jul 2, 2020
Micron Technology, Inc.
Hyunsuk Chun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES HAVING CRACK-INHIBITING STRUCTURES
Publication number
20200211982
Publication date
Jul 2, 2020
Micron Technology, Inc.
Shams U. Arifeen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20190067145
Publication date
Feb 28, 2019
Micron Technology, Inc.
Hyunsuk Chun
H01 - BASIC ELECTRIC ELEMENTS