Shan GAO

Person

Malta, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Magnetic shielding package structure for MRAM device and method for...
- Patent number 10,686,008
- Issue date Jun 16, 2020
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Shan Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Magnetic shielding package structure for MRAM device and method for...
- Patent number 10,290,678
- Issue date May 14, 2019
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Shan Gao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dummy metal structure and method of forming dummy metal structure
- Patent number 9,472,509
- Issue date Oct 18, 2016
- GLOBALFOUNDRIES Inc.
- Jae Kyu Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
DFT structure for TSVs in 3D ICs while maintaining functional purpose
- Patent number 9,460,975
- Issue date Oct 4, 2016
- GLOBALFOUNDRIES Inc.
- Sukeshwar Kannan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-silicon via with sidewall air gap
- Patent number 9,437,524
- Issue date Sep 6, 2016
- GLOBALFOUNDRIES Inc.
- Shan Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy metal structure and method of forming dummy metal structure
- Patent number 9,406,608
- Issue date Aug 2, 2016
- GLOBALFOUNDRIES Inc.
- Jae Kyu Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-silicon via with sidewall air gap
- Patent number 8,877,559
- Issue date Nov 4, 2014
- GLOBALFOUNDRIES Inc.
- Shan Gao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MAGNETIC SHIELDING PACKAGE STRUCTURE FOR MRAM DEVICE AND METHOD FOR...
- Publication number 20190206930
- Publication date Jul 4, 2019
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Shan GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MAGNETIC SHIELDING PACKAGE STRUCTURE FOR MRAM DEVICE AND METHOD FOR...
- Publication number 20190096956
- Publication date Mar 28, 2019
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Shan GAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR DETECTION OF FAILURES IN UNDER-FILL LAYERS...
- Publication number 20160322265
- Publication date Nov 3, 2016
- GLOBALFOUNDRIES Inc.
- Shan GAO
- G01 - MEASURING TESTING
Information Patent Application
DUMMY METAL STRUCTURE AND METHOD OF FORMING DUMMY METAL STRUCTURE
- Publication number 20160254234
- Publication date Sep 1, 2016
- GLOBALFOUNDRIES INC.
- Jae Kyu CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DFT STRUCTURE FOR TSVS IN 3D ICS WHILE MAINTAINING FUNCTIONAL PURPOSE
- Publication number 20160225679
- Publication date Aug 4, 2016
- GLOBALFOUNDRIES INC.
- Sukeshwar KANNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUMMY METAL STRUCTURE AND METHOD OF FORMING DUMMY METAL STRUCTURE
- Publication number 20160111360
- Publication date Apr 21, 2016
- GLOBALFOUNDRIES INC.
- Jae Kyu CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SILICON VIA WITH SIDEWALL AIR GAP
- Publication number 20150054139
- Publication date Feb 26, 2015
- GLOBALFOUNDRIES INC.
- Shan Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-SILICON VIA WITH SIDEWALL AIR GAP
- Publication number 20140264921
- Publication date Sep 18, 2014
- GLOBAL FOUNDRIES Inc.
- Shan Gao
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Magnetic shielding package structure for MRAM device and method for...

Magnetic shielding package structure for MRAM device and method for...

Dummy metal structure and method of forming dummy metal structure

DFT structure for TSVs in 3D ICs while maintaining functional purpose

Through-silicon via with sidewall air gap

Dummy metal structure and method of forming dummy metal structure

Through-silicon via with sidewall air gap

Patents Applicationslast 30 patents

MAGNETIC SHIELDING PACKAGE STRUCTURE FOR MRAM DEVICE AND METHOD FOR...

MAGNETIC SHIELDING PACKAGE STRUCTURE FOR MRAM DEVICE AND METHOD FOR...

METHOD AND APPARATUS FOR DETECTION OF FAILURES IN UNDER-FILL LAYERS...

DUMMY METAL STRUCTURE AND METHOD OF FORMING DUMMY METAL STRUCTURE

DFT STRUCTURE FOR TSVS IN 3D ICS WHILE MAINTAINING FUNCTIONAL PURPOSE

DUMMY METAL STRUCTURE AND METHOD OF FORMING DUMMY METAL STRUCTURE

THROUGH-SILICON VIA WITH SIDEWALL AIR GAP

THROUGH-SILICON VIA WITH SIDEWALL AIR GAP