SHAN-YONG CHENG

Person

New Taipei, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Electrical connector with improved carrier frame
- Patent number 11,963,326
- Issue date Apr 16, 2024
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- Shan-Yong Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vapor chamber heatsink assembly
- Patent number 11,913,726
- Issue date Feb 27, 2024
- Cooler Master Co., Ltd.
- Yuanlong Wen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electrical connector assembly and pick-up cap
- Patent number 11,830,780
- Issue date Nov 28, 2023
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- Shan-Yong Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector assembly including a back plate having a curve...
- Patent number 11,831,094
- Issue date Nov 28, 2023
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- Shan-Yong Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation device
- Patent number 11,732,981
- Issue date Aug 22, 2023
- Cooler Master Co., Ltd.
- Chia-Yu Lin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat exchanger fin and manufacturing method of the same
- Patent number 11,725,885
- Issue date Aug 15, 2023
- Cooler Master Co., Ltd.
- Chia Yu Lin
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Connector having paired signal contacts surrounded by conjoined gro...
- Patent number 11,715,910
- Issue date Aug 1, 2023
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- Shan-Yong Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation device
- Patent number 11,713,927
- Issue date Aug 1, 2023
- Cooler Master Co., Ltd.
- Kui-Yen Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat exchanger fin and manufacturing method of the same
- Patent number 11,692,777
- Issue date Jul 4, 2023
- Cooler Master Co., Ltd.
- Chia Yu Lin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat dissipation structure
- Patent number 11,686,532
- Issue date Jun 27, 2023
- Cooler Master Co., Ltd.
- Chi-Chuan Wang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method of manufacturing a heat exchanger
- Patent number 11,598,587
- Issue date Mar 7, 2023
- Cooler Master Co., Ltd.
- Chia Yu Lin
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Method of manufacturing a heat exchanger
- Patent number 11,598,588
- Issue date Mar 7, 2023
- Cooler Master Co., Ltd.
- Chia Yu Lin
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Heat exchanger fin and manufacturing method of tHE same
- Patent number 11,530,879
- Issue date Dec 20, 2022
- Cooler Master Co., Ltd.
- Chia Yu Lin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Heat dissipation device
- Patent number 11,525,632
- Issue date Dec 13, 2022
- Cooler Master Co., Ltd.
- Kui-Yen Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method of assembling contacts into housing via respective contact c...
- Patent number 11,527,861
- Issue date Dec 13, 2022
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- Tzu-Yao Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixer pitch arrangement for CPU socket
- Patent number 11,411,338
- Issue date Aug 9, 2022
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- Shan-Yong Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation device
- Patent number 11,384,999
- Issue date Jul 12, 2022
- Cooler Master Co., Ltd.
- Chia-Yu Lin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method of manufacturing a heat exchanger
- Patent number 11,359,870
- Issue date Jun 14, 2022
- Cooler Master Co., Ltd.
- Chia Yu Lin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Rivet spacer for compromising assembling between two parts secured...
- Patent number 11,177,191
- Issue date Nov 16, 2021
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- Shan-Yong Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement for lowering resistance on power delievery region of el...
- Patent number 11,050,173
- Issue date Jun 29, 2021
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- Shan-Yong Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector transmitting high frequency signals
- Patent number 10,998,677
- Issue date May 4, 2021
- FOXCONN INTERCONNECT TECHNOLOGY LIMITED
- Shan-Yong Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection between parallel system board and power board
- Patent number 10,990,141
- Issue date Apr 27, 2021
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- Shan-Yong Cheng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electrical connector for high frequency use with dual orientation
- Patent number 10,950,981
- Issue date Mar 16, 2021
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- Chih-Hsien Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation structure
- Patent number 10,907,907
- Issue date Feb 2, 2021
- Cooler Master Co., Ltd.
- Chi-Chuan Wang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electrical connector with differently shaped contacts in matrix
- Patent number 10,886,655
- Issue date Jan 5, 2021
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- Tzu-Yao Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector with improved shielding plate
- Patent number 10,680,387
- Issue date Jun 9, 2020
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- Shan-Yong Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical contact of electrical connector
- Patent number 10,680,373
- Issue date Jun 9, 2020
- FU DING PRECISION COMPONENT (SHEN ZHEN) Co.
- Shan-Yong Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connectors with reinforced structure
- Patent number 10,574,003
- Issue date Feb 25, 2020
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- Shan-Yong Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Securement of solder unit upon contact
- Patent number 10,559,906
- Issue date Feb 11, 2020
- FU DING PRECISION COMPONENT (SHEN ZHEN) CO., LTD.
- Shan-Yong Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector transmitting high frequency signals
- Patent number 10,483,695
- Issue date Nov 19, 2019
- FOXCONN INTERCONNECT TECHNOLOGY LIMITED
- Shan-Yong Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
VAPOR CHAMBER HEATSINK ASSEMBLY
- Publication number 20240151479
- Publication date May 9, 2024
- Cooler Master Co., Ltd.
- Yuanlong Wen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CHIP CONNECTOR WITH IMPROVED TERMINALS
- Publication number 20230283003
- Publication date Sep 7, 2023
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- SHAN-YONG CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURE
- Publication number 20230272980
- Publication date Aug 31, 2023
- COOLER MASTER CO., LTD.
- Chi-Chuan WANG
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CHIP CONNECTOR WITH AN IMPROVED ROTATING PLATE
- Publication number 20230261398
- Publication date Aug 17, 2023
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- SHAN-YONG CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL ELECTRICAL CONNECTOR WITH RESISTING PORTIONS AND METHOD...
- Publication number 20230198178
- Publication date Jun 22, 2023
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- SHAN-YONG CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION DEVICE
- Publication number 20230063953
- Publication date Mar 2, 2023
- Cooler Master Co., Ltd.
- Kui-Yen CHEN
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT DISSIPATION DEVICE
- Publication number 20230055907
- Publication date Feb 23, 2023
- Cooler Master Co., Ltd.
- Kui-Yen CHEN
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT EXCHANGER FIN AND MANUFACTURING METHOD OF THE SAME
- Publication number 20230003459
- Publication date Jan 5, 2023
- Cooler Master Co., Ltd.
- Chia Yu LIN
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
HEAT EXCHANGER FIN AND MANUFACTURING METHOD OF THE SAME
- Publication number 20230003460
- Publication date Jan 5, 2023
- Cooler Master Co., Ltd.
- Chia Yu LIN
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
ELECTRICAL CONNECTOR WITH IMPROVED CARRIER FRAME
- Publication number 20220328989
- Publication date Oct 13, 2022
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- SHAN-YONG CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT EXCHANGER FIN AND MANUFACTURING METHOD OF THE SAME
- Publication number 20220299271
- Publication date Sep 22, 2022
- Cooler Master Co., Ltd.
- Chia Yu LIN
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT DISSIPATION DEVICE
- Publication number 20220299277
- Publication date Sep 22, 2022
- COOLER MASTER CO., LTD.
- Chia-Yu LIN
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HEAT EXCHANGER FIN AND MANUFACTURING METHOD OF THE SAME
- Publication number 20220290928
- Publication date Sep 15, 2022
- Cooler Master Co., Ltd.
- Chia Yu LIN
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CONTACT WITH TWO RESILIENT ARMS MAKING FOUR ABUTTING POINTS WITH A...
- Publication number 20220285874
- Publication date Sep 8, 2022
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- SHAN-YONG CHENG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION DEVICE
- Publication number 20220205723
- Publication date Jun 30, 2022
- COOLER MASTER CO., LTD.
- Kui-Yen CHEN
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
ELECTRICAL CONNECTOR ASSEMBLY INCLUDING A BACK PLATE HAVING A CURVE...
- Publication number 20220131292
- Publication date Apr 28, 2022
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- SHAN-YONG CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VAPOR CHAMBER HEATSINK ASSEMBLY
- Publication number 20220128316
- Publication date Apr 28, 2022
- COOLER MASTER CO., LTD.
- Yuanlong Wen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CONNECTOR HAVING PAIRED SIGNAL CONTACTS SURROUNDED BY CONJOINED GRO...
- Publication number 20220052490
- Publication date Feb 17, 2022
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- SHAN-YONG CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT EXCHANGER FIN AND MANUFACTURING METHOD OF THE SAME
- Publication number 20210213511
- Publication date Jul 15, 2021
- COOLER MASTER CO., LTD.
- Chia Yu LIN
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
HEAT EXCHANGER FIN AND MANUFACTURING METHOD OF THE SAME
- Publication number 20210215437
- Publication date Jul 15, 2021
- COOLER MASTER CO., LTD.
- Chia Yu LIN
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
ELECTRICAL CONNECTOR ASSEMBLY
- Publication number 20210202331
- Publication date Jul 1, 2021
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- SHAN-YONG CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VAPOR CHAMBER HEATSINK ASSEMBLY
- Publication number 20210180873
- Publication date Jun 17, 2021
- COOLER MASTER CO., LTD.
- Chia yu Lin
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
HIGH DENSITY ELECTRICAL CONNECTOR
- Publication number 20210104831
- Publication date Apr 8, 2021
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- SHAN-YONG CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURE
- Publication number 20210088288
- Publication date Mar 25, 2021
- COOLER MASTER CO., LTD.
- Chi-Chuan WANG
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
METHOD OF ASSEMBLING CONTACTS INTO HOUSING VIA RESPECTIVE CONTACT C...
- Publication number 20210075178
- Publication date Mar 11, 2021
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- TZU-YAO HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXER PITCH ARRANGEMENT FOR CPU SOCKET
- Publication number 20210050686
- Publication date Feb 18, 2021
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- SHAN-YONG CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION DEVICE
- Publication number 20200378698
- Publication date Dec 3, 2020
- COOLER MASTER CO., LTD.
- Chia-Yu LIN
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
RIVET SPACER FOR COMPROMISING ASSEMBLING BETWEEN TWO PARTS SECURED...
- Publication number 20200381333
- Publication date Dec 3, 2020
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- SHAN-YONG CHENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ARRANGEMENT FOR LOWERING RESISTANCE ON POWER DELIEVERY REGION OF EL...
- Publication number 20200144747
- Publication date May 7, 2020
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- SHAN-YONG CHENG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION BETWEEN PARALLEL SYSTEM BOARD AND POWER BOARD
- Publication number 20200117247
- Publication date Apr 16, 2020
- FOXCONN (KUNSHAN) COMPUTER CONNECTOR CO., LTD.
- SHAN-YONG CHENG
- G06 - COMPUTING CALCULATING COUNTING

SHAN-YONG CHENG

Person

Patents Grantslast 30 patents

Electrical connector with improved carrier frame

Vapor chamber heatsink assembly

Electrical connector assembly and pick-up cap

Electrical connector assembly including a back plate having a curve...

Heat dissipation device

Heat exchanger fin and manufacturing method of the same

Connector having paired signal contacts surrounded by conjoined gro...

Heat dissipation device

Heat exchanger fin and manufacturing method of the same

Heat dissipation structure

Method of manufacturing a heat exchanger

Method of manufacturing a heat exchanger

Heat exchanger fin and manufacturing method of tHE same

Heat dissipation device

Method of assembling contacts into housing via respective contact c...

Mixer pitch arrangement for CPU socket

Heat dissipation device

Method of manufacturing a heat exchanger

Rivet spacer for compromising assembling between two parts secured...

Arrangement for lowering resistance on power delievery region of el...

Electrical connector transmitting high frequency signals

Connection between parallel system board and power board

Electrical connector for high frequency use with dual orientation

Heat dissipation structure

Electrical connector with differently shaped contacts in matrix

Electrical connector with improved shielding plate

Electrical contact of electrical connector

Electrical connectors with reinforced structure

Securement of solder unit upon contact

Electrical connector transmitting high frequency signals

Patents Applicationslast 30 patents

VAPOR CHAMBER HEATSINK ASSEMBLY

CHIP CONNECTOR WITH IMPROVED TERMINALS

HEAT DISSIPATION STRUCTURE

CHIP CONNECTOR WITH AN IMPROVED ROTATING PLATE

ELECTRICAL ELECTRICAL CONNECTOR WITH RESISTING PORTIONS AND METHOD...

HEAT DISSIPATION DEVICE

HEAT DISSIPATION DEVICE

HEAT EXCHANGER FIN AND MANUFACTURING METHOD OF THE SAME

HEAT EXCHANGER FIN AND MANUFACTURING METHOD OF THE SAME

ELECTRICAL CONNECTOR WITH IMPROVED CARRIER FRAME

HEAT EXCHANGER FIN AND MANUFACTURING METHOD OF THE SAME

HEAT DISSIPATION DEVICE

HEAT EXCHANGER FIN AND MANUFACTURING METHOD OF THE SAME

CONTACT WITH TWO RESILIENT ARMS MAKING FOUR ABUTTING POINTS WITH A...

HEAT DISSIPATION DEVICE

ELECTRICAL CONNECTOR ASSEMBLY INCLUDING A BACK PLATE HAVING A CURVE...

VAPOR CHAMBER HEATSINK ASSEMBLY

CONNECTOR HAVING PAIRED SIGNAL CONTACTS SURROUNDED BY CONJOINED GRO...

HEAT EXCHANGER FIN AND MANUFACTURING METHOD OF THE SAME

HEAT EXCHANGER FIN AND MANUFACTURING METHOD OF THE SAME

ELECTRICAL CONNECTOR ASSEMBLY

VAPOR CHAMBER HEATSINK ASSEMBLY

HIGH DENSITY ELECTRICAL CONNECTOR

HEAT DISSIPATION STRUCTURE

METHOD OF ASSEMBLING CONTACTS INTO HOUSING VIA RESPECTIVE CONTACT C...

MIXER PITCH ARRANGEMENT FOR CPU SOCKET

HEAT DISSIPATION DEVICE

RIVET SPACER FOR COMPROMISING ASSEMBLING BETWEEN TWO PARTS SECURED...

ARRANGEMENT FOR LOWERING RESISTANCE ON POWER DELIEVERY REGION OF EL...

CONNECTION BETWEEN PARALLEL SYSTEM BOARD AND POWER BOARD