Shan Zhong

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Barrier structures for underfill containment
- Patent number 12,002,727
- Issue date Jun 4, 2024
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-electronic package with substrate protrusion to facilitate di...
- Patent number 11,776,821
- Issue date Oct 3, 2023
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-electronic package with substrate protrusion to facilitate di...
- Patent number 11,282,717
- Issue date Mar 22, 2022
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having spacer layer
- Patent number 10,636,769
- Issue date Apr 28, 2020
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with polymer core
- Patent number 10,128,225
- Issue date Nov 13, 2018
- Intel Corporation
- Sandeep Razdan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having spacer layer
- Patent number 10,083,936
- Issue date Sep 25, 2018
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with polymer core
- Patent number 9,613,934
- Issue date Apr 4, 2017
- Intel Corporation
- Sandeep Razdan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi die package having a die and a spacer layer in a recess
- Patent number 9,490,196
- Issue date Nov 8, 2016
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlled solder-on-die integrations on packages and methods of as...
- Patent number 9,299,660
- Issue date Mar 29, 2016
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures with polymer core
- Patent number 8,987,918
- Issue date Mar 24, 2015
- Intel Corporation
- Sandeep Razdan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICRO-ELECTRONIC PACKAGE WITH SUBSTRATE PROTRUSION TO FACILITATE DI...
- Publication number 20220165585
- Publication date May 26, 2022
- Intel Corporation
- Ziyin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARRIER STRUCTURES FOR UNDERFILL CONTAINMENT
- Publication number 20210249322
- Publication date Aug 12, 2021
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-ELECTRONIC PACKAGE WITH SUBSTRATE PROTRUSION TO FACILITATE DI...
- Publication number 20190304808
- Publication date Oct 3, 2019
- Intel Corporation
- Ziyin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING SPACER LAYER
- Publication number 20190006325
- Publication date Jan 3, 2019
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES WITH POLYMER CORE
- Publication number 20170229438
- Publication date Aug 10, 2017
- Intel Corporation
- Sandeep Razdan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE PACKAGE STRUCTURES
- Publication number 20170025392
- Publication date Jan 26, 2017
- Intel Corporation
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES WITH POLYMER CORE
- Publication number 20150162313
- Publication date Jun 11, 2015
- Intel Corporation
- Sandeep Razdan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE CONNECTIONS USING DIFFERENT UNDERFILL TYPES FOR DIFFERENT REGIONS
- Publication number 20150001736
- Publication date Jan 1, 2015
- Hualiang Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES WITH POLYMER CORE
- Publication number 20140264910
- Publication date Sep 18, 2014
- Sandeep Razdan
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONTROLLED SOLDER-ON-DIE INTEGRATIONS ON PACKAGES AND METHODS OF AS...
- Publication number 20130277837
- Publication date Oct 24, 2013
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI DIE PACKAGE STRUCTURES
- Publication number 20130277865
- Publication date Oct 24, 2013
- Weng Hong Teh
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Barrier structures for underfill containment

Micro-electronic package with substrate protrusion to facilitate di...

Micro-electronic package with substrate protrusion to facilitate di...

Semiconductor package having spacer layer

Interconnect structures with polymer core

Semiconductor package having spacer layer

Interconnect structures with polymer core

Multi die package having a die and a spacer layer in a recess

Controlled solder-on-die integrations on packages and methods of as...

Interconnect structures with polymer core

Patents Applicationslast 30 patents

MICRO-ELECTRONIC PACKAGE WITH SUBSTRATE PROTRUSION TO FACILITATE DI...

BARRIER STRUCTURES FOR UNDERFILL CONTAINMENT

MICRO-ELECTRONIC PACKAGE WITH SUBSTRATE PROTRUSION TO FACILITATE DI...

SEMICONDUCTOR PACKAGE HAVING SPACER LAYER

INTERCONNECT STRUCTURES WITH POLYMER CORE

MULTI-DIE PACKAGE STRUCTURES

INTERCONNECT STRUCTURES WITH POLYMER CORE

DIE CONNECTIONS USING DIFFERENT UNDERFILL TYPES FOR DIFFERENT REGIONS

INTERCONNECT STRUCTURES WITH POLYMER CORE

CONTROLLED SOLDER-ON-DIE INTEGRATIONS ON PACKAGES AND METHODS OF AS...

MULTI DIE PACKAGE STRUCTURES