Shang-Yu Wang

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Automated optical inspection method, automated optical inspection s...
- Patent number 12,118,705
- Issue date Oct 15, 2024
- GlobalWafers Co., Ltd.
- Cheng-Wei Gu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer surface defect inspection method and apparatus thereof
- Patent number 12,044,631
- Issue date Jul 23, 2024
- GlobalWafers Co., Ltd.
- Shang-Chi Wang
- G01 - MEASURING TESTING
Information Patent Grant
Mega-sonic vibration assisted chemical mechanical planarization
- Patent number 12,036,636
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hao Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical planarization tool
- Patent number 12,030,159
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tung-Kai Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer processing system and rework method thereof
- Patent number 11,971,365
- Issue date Apr 30, 2024
- GlobalWafers Co., Ltd.
- Shang-Chi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing apparatus and method
- Patent number 11,964,358
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shang-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Material analysis method
- Patent number 11,859,965
- Issue date Jan 2, 2024
- GlobalWafers Co., Ltd.
- Shang-Chi Wang
- G01 - MEASURING TESTING
Information Patent Grant
Wafer inspection method and apparatus thereof
- Patent number 11,852,465
- Issue date Dec 26, 2023
- GlobalWafers Co., Ltd.
- Shang-Chi Wang
- G01 - MEASURING TESTING
Information Patent Grant
Chemical mechanical planarization tool
- Patent number 11,712,778
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tung-Kai Chen
- G01 - MEASURING TESTING
Information Patent Grant
Mega-sonic vibration assisted chemical mechanical planarization
- Patent number 11,590,627
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chun-Hao Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing apparatus and method
- Patent number 10,953,514
- Issue date Mar 23, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shang-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION
- Publication number 20240355627
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shang-Yu WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD
- Publication number 20240217054
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yu Wang
- B24 - GRINDING POLISHING
Information Patent Application
METHOD AND DEVICE FOR PROVIDING WIRE BREAKAGE WARNING
- Publication number 20240175771
- Publication date May 30, 2024
- GLOBALWAFERS CO., LTD.
- Chien-Wen YU
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
AMORPHOUS PHASE MODIFICATION APPARATUS AND PROCESSING METHOD OF SIN...
- Publication number 20240075558
- Publication date Mar 7, 2024
- GLOBALWAFERS CO., LTD.
- Chien Chung Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Chemical Mechanical Planarization Tool
- Publication number 20230321789
- Publication date Oct 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tung-Kai Chen
- B24 - GRINDING POLISHING
Information Patent Application
MEGA-SONIC VIBRATION ASSISTED CHEMICAL MECHANICAL PLANARIZATION
- Publication number 20230219188
- Publication date Jul 13, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chun-Hao Kung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CALCULATING OBJECT PICK-AND-PLACE SEQUENCE AND ELECTRONI...
- Publication number 20230126461
- Publication date Apr 27, 2023
- GLOBALWAFERS CO., LTD.
- Chia-Lin Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR IDENTIFYING WAFER
- Publication number 20230064159
- Publication date Mar 2, 2023
- GLOBALWAFERS CO., LTD.
- Shang-Chi Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MATERIAL ANALYSIS METHOD
- Publication number 20220357152
- Publication date Nov 10, 2022
- GLOBALWAFERS CO., LTD.
- Shang-Chi Wang
- G01 - MEASURING TESTING
Information Patent Application
WAFER PROCESSING SYSTEM AND REWORK METHOD THEREOF
- Publication number 20220326162
- Publication date Oct 13, 2022
- GLOBALWAFERS CO., LTD.
- Shang-Chi Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER INSPECTION METHOD AND APPARATUS THEREOF
- Publication number 20220316872
- Publication date Oct 6, 2022
- GLOBALWAFERS CO., LTD.
- Shang-Chi Wang
- G01 - MEASURING TESTING
Information Patent Application
WAFER SURFACE DEFECT INSPECTION METHOD AND APPARATUS THEREOF
- Publication number 20220307991
- Publication date Sep 29, 2022
- GLOBALWAFERS CO., LTD.
- Shang-Chi Wang
- G01 - MEASURING TESTING
Information Patent Application
AUTOMATED OPTICAL INSPECTION METHOD, AUTOMATED OPTICAL INSPECTION S...
- Publication number 20220270234
- Publication date Aug 25, 2022
- GLOBALWAFERS CO., LTD.
- Cheng-Wei Gu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD
- Publication number 20210205950
- Publication date Jul 8, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD
- Publication number 20210078130
- Publication date Mar 18, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shang-Yu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHEMICAL MECHANICAL PLANARIZATION TOOL
- Publication number 20210053184
- Publication date Feb 25, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tung-Kai Chen
- G01 - MEASURING TESTING
Information Patent Application
MEGA-SONIC VIBRATION ASSISTED CHEMICAL MECHANICAL PLANARIZATION
- Publication number 20210016415
- Publication date Jan 21, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chun-Hao Kung
- H01 - BASIC ELECTRIC ELEMENTS

Shang-Yu Wang

Person

Patents Grantslast 30 patents

Automated optical inspection method, automated optical inspection s...

Wafer surface defect inspection method and apparatus thereof

Mega-sonic vibration assisted chemical mechanical planarization

Chemical mechanical planarization tool

Wafer processing system and rework method thereof

Chemical mechanical polishing apparatus and method

Material analysis method

Wafer inspection method and apparatus thereof

Chemical mechanical planarization tool

Mega-sonic vibration assisted chemical mechanical planarization

Chemical mechanical polishing apparatus and method

Patents Applicationslast 30 patents

SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION

CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD

METHOD AND DEVICE FOR PROVIDING WIRE BREAKAGE WARNING

AMORPHOUS PHASE MODIFICATION APPARATUS AND PROCESSING METHOD OF SIN...

Chemical Mechanical Planarization Tool

MEGA-SONIC VIBRATION ASSISTED CHEMICAL MECHANICAL PLANARIZATION

METHOD FOR CALCULATING OBJECT PICK-AND-PLACE SEQUENCE AND ELECTRONI...

METHOD FOR IDENTIFYING WAFER

MATERIAL ANALYSIS METHOD

WAFER PROCESSING SYSTEM AND REWORK METHOD THEREOF

WAFER INSPECTION METHOD AND APPARATUS THEREOF

WAFER SURFACE DEFECT INSPECTION METHOD AND APPARATUS THEREOF

AUTOMATED OPTICAL INSPECTION METHOD, AUTOMATED OPTICAL INSPECTION S...

CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD

CHEMICAL MECHANICAL POLISHING APPARATUS AND METHOD

CHEMICAL MECHANICAL PLANARIZATION TOOL

MEGA-SONIC VIBRATION ASSISTED CHEMICAL MECHANICAL PLANARIZATION